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Back Issues of MICRO Magazine

January/February 2006 | March 2006 | April 2006 | May 2006

June 2006

January/February 2005 | March 2005 | April 2005 | May 2005

June 2005 | July 2005 | August/September 2005

October/November 2005 | December 2005

2004 Back Issues | 2003 Back Issues | 2002 Back Issues

2001 Back Issues | 2000 Back Issues

1999 Back Issues | 1998 Back Issues | 1997 Back Issues


June 2006
Selected Contents

 

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: FEOL challenges, new materials push surface-preparation agenda
  • Lefty: Imprint roadmap
  • The BIG Idea: Pure polysilicon furnaceware could pave way for Integrated materials success
  • Chipworks Corner: TSMC fabbed Matrix 3-D memory array with unique 0.15-µm, seven-metal proces
  • 'Round the Circuit: TEL launches VC unit; Micron, Photronics form joint venture

THE HOT BUTTON

  • Lithography: If you want to improve CD control, you must identify sources of focus and dose errors
  • Columnist Bijan Moslehi discusses micro fuel cells for portable electronics

TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products: Metal thin-film metrology tool, all-digital pressure transducers, butterfly valve, photolithography mask aligners, DRIE ICP system, polysilicon furnaceware, photoresists, remote particle counters, copper plating additives, cleanroom cabinetry, photoelectron spectroscopy, copper seed solution, exhaust-pressure controller, dry etch tool
  • Product Extra: Cleaning tool enhanced with eight double-side process modules; vendor offers remote capability for transmission electron microscopes; patent granted for method of increasing resolution in existing D/A convertors without additional hardware; maskless photolitho system projects master images directly onto substrate materials; supplier receives patent for use of silicon carbide barrier films between dielectric and metal layers

SEMICON WEST 2006

  • The special show section highlights this year's show, including the new TechXPOTs


May 2006
Selected Contents

 

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: California colleges, industry team to explore post-CMOS frontier
  • Lefty: Sound the alarm
  • The MICRO Interview: KLA-Tencor’s Rick Wallace
  • 'Round the Circuit: Novellus donates 200-mm CMP tool to Tsinghua University; Renesas, Applied Materials join industry consortia; ChipMOS, Oracle Taiwan, and Taiwanese Institution of Engineering for Information Industry team up to develop a semiconductor supply-chain system; NanoMarkets sees new thin-film growth; IMEC VC fund capitalized; Foresight Nanotech Institute seeks nominees for 2006 Feynman prizes

THE HOT BUTTON

  • BEOL Processing: Copper/low-k dielectric interconnect schemes have legs, but how long until alternatives are needed?
  • Columnist Bijan Moslehi illuminates the emergence of solid-state lighting

TECHNICAL ARTICLES
  • Transistorama: Developing a systematic approach to metal gates and high-k dielectrics in future-generation CMOS Sematech researchers present a terraced-oxide method for extracting the effective work function of metal gates in an effort to integrate metal gates and high-k dielectrics in CMOS devices
  • Tool/Fab Support Strategies: Achieving process utility conservation and cost reductions in a 300-mm fab environment; a case study details a DRAM fab’s successful multiyear effort to reduce exhaust while lowering consumption of clean dry air, UPW, cleanroom air, and process cooling water
  • Wet Surface Technologies: Comparing single-wafer and batch polymer cleans using inorganic chemicals in BEOL applications; a fab case study demonstrates that the use of a single-wafer cleaning tool in conjunction with inorganic chemistry improves device yields and reduces defectivity levels in BEOL applications

PRODUCT TECHNOLOGY NEWS

  • Products: Mask-writing system, thin-film deposition controller, diaphragm valve, wet processing station, photoresist coating technology, ozone sensors, ion implanter, DI-water heater, miniature isolation valves, wafer-flatness metrology tool, servomotor, scatterometry acceleration tool, bonded door seals
  • Product Extra: Supplier receives patent for IC and optoelectronic chemistries; sensing tube and high-pressure options enhance mass-flow meters; CD measurement tool provides submicron resolution with machine-vision speed; vendor offers strained-silicon process control system for HRXRD measurements; Web site focuses on the Chinese market

April 2006
Selected Contents

 

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: Despite silicon’s strengths, compound semi industry compounds growth
  • Lefty: Wind-powered implant
  • The BIG Idea: UHP DI-water steam has thermal, cleaning applications in chipmaking, says start-up
  • Chipworks Corner: Infineon uses vertical structure to optimize on-resistance in power MOS devices
  • 'Round the Circuit: ASMC back in Boston; TSMC readies immersion; spintronics program started; SEMI issues standards

THE HOT BUTTON

  • Factory Integration: Tool reliability, cycle times, other productivity metrics must improve in increasingly complex fabs
  • Columnist Bijan Moslehi investigates renewable power generation from photovoltaic solar cells

TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products: E-beam inspection system, film-thickness measurement unit, ceramic vacuum wafer chucks, strip tool, absolute-pressure transducers, cleanroom paper, PCI-bus motion controller module, thermoelectric heater/chiller, vibration-isolation workstation, double-ferrule tube fittings, high-purity optical lens material, optical 3-D profiler, gallium nitride-on-diamond wafer, ammonia monitor, wafer-flip module, cleanroom oven, on-line TOC analyzer
  • Product Extra: Automation platform services multiple plasma process chambers; vendor offers thin-film coatings capability to customers needing optical coating services; supplier provides photolithography services and blanket resist coatings; Web site optimizes the efficiency of purchasing cleanroom consumables; six nonaqueous organic hydroxides and salts aid resist, stripper, and cleaner suppliers

 

March 2006
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: Polysilicon forecast is cloudy for solar cell, IC industries
  • Lefty: Apple vs. The Postal Service
  • Semicon Europa: Semicon Europa turns 30
  • Breakout: ISMI program to develop 300 mm Prime, explore transition to 450-mm manufacturing
  • 'Round the Circuit: CS Mantech hits Vancouver; Intrinsic licenses CMP process; MEMS market grows; UCLT scores financing; IEST updates air filtration handbook; Podesser joins Unaxis

THE HOT BUTTON

  • Tech Emergent: Novel research materials, devices extend CMOS, suggest revolutionary post-CMOS approaches
  • Columnist Bijan Moslehi returns to survey the role of enabling technologies as emerging market drivers

TECHNICAL ARTICLES
  • Transistorama: Meeting the future challenges of high-k gate dielectrics and metal gates
  • APC/AEC: Implementing EDA to improve equipment performance and fab productivity
  • Green Manufacturing: Achieving sustainability in the semiconductor manufacturing industry
  • Critical Materials: Monitoring oxidation processes in-line using a novel characterization technique

PRODUCT TECHNOLOGY NEWS

  • Products: Ion implanter, mask aligner, 3-D modeling software, reticle inspection system, photomask metrology tool, handheld particle counter, resist stripper/residue remover, variable-area flowmeter, ArF lithography light source, electric linear actuators, vacuum-pump inlet trap

January/February 2006
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

THE HOT BUTTON

FEATURED SERIES

  • Chipworks Corner: Fujifilm maximizes charge-coupled device’s 0.35-µm, two-metal, double-poly process
  • Transistorama: Accelerating flash product inspections using a novel E-beam inspection method

WET SURFACE TECHNOLOGIES

DEFECT/YIELD ANALYSIS, METROLOGY

DESIGN FOR MANUFACTURING

PRODUCT TECHNOLOGY NEWS

 


December 2005
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS


October/November 2005
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: Will DFM become the lingua franca of the chip world?
  • Lefty: Prototype this
  • Chipworks Corner: Texas Instruments pushes MEMS envelope with micromirror-based DLP
  • Expansions, Acquisitions & Alliances: Freescale, Photronics team up; TSMC megafab approved; MEMC's 300-mm Taiwan plant opens; Rohm and Haas plans manufacturing and tech center in Hsinchu; DuPont greenlights China site; SIA's nano initiative scores funds
  • 'Round the Circuit: Brazil gets in the chipmaking game; Sematech adds IML tool; strained-Si market booms; David Wang joins Shanghai Hua Huang Group


    THE HOT BUTTON
  • BEOL Processing: Copper electroplating, CMP challenges grow more complex at 65-nm node and beyond

  • Columnist Bijan Moslehi reviews materials, cost, productivity, risk management, and other technology challenges

TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products: X-ray inspection tool, dry ice cleaning system, turbo pump, CD/profile mask metrology, UHP liquid-flow sensor, acid-laden-air exhaust duct, wet-processing-solution analyzer, tee valve, pressure-insensitive MFCs, dielectric materials, optical inspection system, charged-plate monitor, HFIP-NB photoresist coatings, liquid particle counter, wafer edge-grinding tool, all-plastic degassing valve, spincoat dispenser
  • Product Extra!: Vendor offers Interface A–compliant EDA product under open-source license; suppliers incorporate MFCs into vaporizer used to deposit high-k dielectrics; model-based yield-analysis technology provides critical-area analysis, enhances devices' physical design; software enables users to size and select control valves; compact sensors detect wafers and slotting errors in cassettes or FOUPs

August/September 2005
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: Pace of training picks up again for the semiconductor industry
  • Lefty: Next-gen scope
  • Market Update: Fab tool, market materials to top $43B
  • Expansions, Acquisitions & Alliances: Intel to site new 300-mm fab in Arizona; M&A activity rolls along; companies expand in Asia
  • Partnerships and JDPs: Table lists companies that have entered into a range of collaborative projects with industry partners
  • 'Round the Circuit: Sematech offers sourcing info; Cymer, Zeiss form FPD team; KT Venture Group funds start-ups; partners launch nano roadmap; IEST joins ISO nano efforts; Kundert to lead SEMI Europe
  • E-Manufacturing: Implementing fabwide process control systems with Interface-B APC solutions
  • Columnist Bijan Moslehi examines the rising costs of R&D

TECHNICAL ARTICLES
  • Manufacturing Effectiveness: Meeting manufacturing metrology challenges at 90 nm and beyond
  • Special Apps: Raising yields of bonded silicon wafers with POU DI-water microfiltration and purification
  • Behind the Mask: Performing 3-D metrology and advanced repairs on leading-edge photomasks

PRODUCT TECHNOLOGY NEWS

  • Products: Sub-90-nm strip system, integrated flow controller, wafer heater assembly, deep reactive ion etch tool, hyper-NA immersion litho tool, electrochemical plating system, miniature linear encoders, metal thin-film metrology tool, advanced precursor materials, high-temperature vacuum curing, x-ray imaging system, EFEM ionization systems, PVD copper/seed tool, multigas leak detector, CMP metrology system, gas-pressure and flow-control devices, trace-moisture analyzer
  • Product Extra!: Metrology tools incorporate advanced automation software; vendor offers integral vacuum chamber stage concept that reduces the size of vacuum chambers; OEM provides online service to speed tool recipe qualification and troubleshooting; NIST-traceable calibration standards are available for thin-film calibration; litho light-source-specific ediagnostics and performance-monitoring software supports litho light sources

July 2005
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: Special report: Opportunities abound, but funding is tight for start-ups
  • Lefty: Virtual storefront
  • Market Trends: Nanotube boom times ahead
  • Breakout: Chipworks' analysis finds high-k, recessed transistors in Samsung's SDRAM
  • Expansions, Acquisitions & Alliances:IBM, Toppan ink mask deal; Infineon, Nanya ramp 90 nm; Zeiss, investors nab NaWoTec; CVD buys First Nano assets; Dimatix opens MEMS fab; Asyst, FACTS sign agreement for conformance testing; Veeco joins AFM program
  • 'Round the Circuit: WSTS upgrades revenue forecast; Foresight group retools; NIST site goes 3-D; ASMC calls for papers
  • FEOL Processing: Resist removal, selectivity, substrate damage top list of surface preparation challenges

  • Columnist Bijan Moslehi probes the pros and cons of outsourcing

TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products:Single-wafer megasonic cleaner, RGA automation platform, parts-cleanliness testing station, wafer inspection tools, photolithography stepper, regulator mounting manifold, STEM system, wafer-thinning materials, liquid-dispense module, slurry blending/delivery units, high-purity PVDF tubing, FOUP/carrier cleaners, vibration-isolation system, backside aligner
  • Product Extra!: Lab service deposits nanocluster films onto customer samples; vendor to integrate cluster boron source technology on implant platforms; suppliers offer third-generation implant dopant gas storage and delivery system; patent granted for method that improves the accuracy of quantification results for micro-XRF analyses; operator-control unit enhances CD measurement systems

June 2005
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: Midyear forecast update: Ramp to 65 nm may offer sole relief after 2004 buying binge
  • Lefty: MEMS CMP A-OK?
  • The MICRO Interview: TSMC's Burn Lin
  • AEC/APC: Intel fabs seek 100% FDC
  • Expansions, Acquisitions & Alliances: IBM to sell or lease Fishkill campus; Air Products to supply specialty gases to Samsung; Honeywell opens radiation-hardened ASIC foundry; Cabot opens tantalum sputtering target facility; Ponté to deliver DFY software package; Silecs, Nagase partner; Chinese fab chooses Membrana membrane contactor systems; Unaxis supplies KANC
  • 'Round the Circuit: SEMI forms DFM, nano partnerships; TSMC targets 65 nm; Intel produces one-billionth chip at Ireland fab; book demystifies chipmaking
  • Lithography: Can't we all just get along? Designers and manufacturers grapple with DFM

  • Columnist Bijan Moslehi considers the growing importance of IP

  • The special section highlights this year's Technology Innovation Showcase.

TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products:Patterned-wafer inspection tools, portable cleanroom fogger, spent-ultrapure-water meters, ArF excimer laser, liquid-flow controller, megasonic system, electrical flex-circuit seals, miniature screw rail, micro/macro defect detection, strained-SOI wafers, diode-pumped solid-state laser, wafer reader, laminar-flow clean bench, linear motor stages, in-line chemical metrology system, depth and CD measurement system, motor control IC, extruded flat PVDF, valveless piston pump, six-axis nanopositioning system
  • Product Extra!: MEMS design software adds all-angle design-rule checking capability; analytical services laboratory becomes ISO/CEI accredited; vendor releases industrial electronics products catalog; x-ray metrology system measures sub-100-Ám test pads in chips and scribe lines; supplier's software upgrade expands particle counter capabilities; brochure details electric process heating and control products

May 2005
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: X-architecture update: Diagonal design to yield production chips in 2005
  • Lefty: A piece of cake
  • Breakout: Toolmakers jump on China/Asia used-equipment bandwagon
  • Tech Outlook: Sematech's top 10 tech challenges
  • Photo Gallery: Ultra Clean Technology opens Shangahi plant
  • 'Round the Circuit: Fabless revenues grow; Aixtron enters novel metals R&D alliance; South Dakota school offers FA; ReVera scores funds; new SEMI standards issued; litho book published
  • BEOL Processing: Surface prep, cleaning, stripping of low-k dielectrics, copper interconnects become more problematic

  • Columnist Bijan Moslehi grapples with managing profitability through the cycles

TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products:Optical wafer-flatness system, total organic carbon sensor, infrared sensor graphic interface, nanopatterning stepper, thin-film metrology tools, real-time FDC system, PVC sheet material, chemical mixer, piping and fusion systems, semiconductor lamp, full-chip verification tool, yield management software
  • Product Extra!: Spectral engineering techniques minimize OPE variations, enhance DOF; patent awarded for hydrogen purification system; supplier enhances EES platform; nickel-platinum strip process enables 65-nm salicide formation; thin-film analysis software supports ellipsometry, reflectance, transmittance analysis; vendor offers tantalum sputtering target Web site

April 2005
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: Despite advances, MEMS industry still feels growing pains
  • Lefty: ABCs of failed litho
  • Semiconductor History: Present at the creation
  • The MICRO Interview: Novellus Systems' Sass Somekh
  • 'Round the Circuit: Vitex moves to commercialize transparent barrier coating and flexible glass technologies; CNT tips grown on SPM cantilevers; Frost & Sullivan chipmaking report issued; immersion lithography, ISMI symposia call for papers
  • E-Manufacturing: Integrated metrology, e-diagnostics have made inroads, but problems still hinder widespread implementation
  • Columnist Bijan Moslehi ponders lithography at the crossroads

TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products: Ion implantation tools, benchtop FTIR spectrometer, hybrid ball screws, imprint lithography system, spin track system, cleanroom wipes, ultrasonic sensors, dc power systems, flaring system, CMP pad conditioner, FTIR moisture analyzers
  • Product Extra!: Supplier offers upgrades for x-ray fluorescence wafer analyzers; Web site provides on-line information on water purification, wastewater treatment, water analysis systems and services; patent awarded for high-selectivity process for etching high-k films; vendor offers free samples of polyimide and high-performance thermoplastic materials; catalog covers vacuum technology, including equipment for producing, controlling, and measuring vacuum

March 2005
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: Materials update: Suppliers, OEMs, chipmakers must improve cooperation
  • Lefty: Fab owners, unite!
  • Fab Outlook: Differing 300-mm opinions
  • The MICRO Interview: IBM's Don Eigler
  • Expansions, Acquisitions & Alliances: Merck sells electronics unit to BASF; DPI increases capacity in Singapore; SMIC, TSMC settle; MKS grants Philips license for high-speed IR thin-film metrology; Straatum scores funds; Picogiga pumps up HEMTs
  • Breakout: Munich welcomes back Semicon Europa
  • 'Round the Circuit: Sandia database offers IP; SIA, SEMI plan nano study; Actinix gets NSF grant; IMT raises venture capital; SCP revives wafer-cleaning symposium
  • FEOL Processing: Strained silicon engineering leads field of transistor technology improvements
  • Columnist Bijan Moslehi comments on green manufacturing

TECHNICAL ARTICLES
  • Tech Emergent: Implementing a batch atomic layer deposition approach for advanced DRAM dielectrics
  • APC/AEC: Controlling etch tools using real-time fault detection and classification
  • Critical Materials: Eliminating etch-sequencing-induced dielectric defects in high-volume manufacturing
  • Green Manufacturing: Maximizing hydrogen pumping speed in cryopumps without compromising safety

PRODUCT TECHNOLOGY NEWS

  • Products: Optical thin-film metrology tool, trimethylsilane, temperature transmitter, CD-SEM, overlay inspection system, particle-counting manifold system, molecular-beam epitaxy tool, macrodefect management system, 300-mm overlay tool, sample preparation and transfer, workstation/equipment monitor, helium leak detector, direct-drive linear actuator, workstation Faraday cages, autofocus linear stage, particle sensor, absolute-pressure transducers, SPM sensor
  • Product Extra!: Vendor offers Web-based filter-life estimator for ASML litho tools; technical flyer highlights PEEK material for CMP processes; supplier provides reduced-footprint process module for Novellus C2 tools; hierarchical yield control patent supports neural control model product line; program enhances and upgrades Applied Materials automated impedance match system

January/February 2005
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: ITRS update: Interim edition includes no surprises, sets stage for 2005.
  • Lefty: Einstein cool
  • Market Outlook: Litho chemical market develops
  • Photo Gallery: Giant robot attacks Makuhari!
  • Expansions, Acquisitions & Alliances: KLA-Tencor teams up with Synopsys, DNS; IBM, AMD develop strained-silicon process; SMIC, Fangtek collaborate; IBM, Schneider market APC; Trazar unit targets RF service
  • Breakout: San Jose hosts SPIE litho show
  • 'Round the Circuit: DOE TEAM taps FEI; SEMI seeks innovators for Semicon West; Silicon Border gets grant; Mattson ships flash-anneal tool to ATDF; Bede hires McIntosh
  • Lithography: Leaching, line-edge roughness, topcoats among key challenges facing immersion photoresist development
  • Columnist Bijan Moslehi addresses the nanoscale DFM challenge

TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products: Automated AFM metrology, E-beam photomask repair tool, high-purity controls, optical stylus profiler tool, dry vacuum pump, chemical concentration system, color camera, portable flowmeters, tungsten deposition tool, dry leak detector, hydrogen purification systems, germanium-free sSOI wafers, high-current ion implanter, barrier slurry
  • Product Extra!: U.S. patent granted for I/O technology; vendor modifies MEMS Web site; supplier increases bulk acids packaging capability; servomotors are available with high-resolution sine-absolute encoders; free catalog highlights inch-series linear ball bearings, pillow block units, shafting


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