INDUSTRY NEWS
On the hunt for foundry capacity, TSMC announces mergers with WSMC,
Acer
C apacity-hungry TSMC started the new year by buying two chip factories
in a little more than one week. The Taiwan-based foundry announced an
agreement on January 7 to acquire Worldwide Semiconductor Manufacturing
Corp. (WSMC). The chipmaker preceded that announcement on December 29
with the news that it would take over complete ownership of TSMC-Acer
Manufacturing. Both acquisitions will be completed by June 30, the company
says.
TSMC did not disclose a purchase price for either transaction.
Under the terms of the merger approved by both companies' boards, the
WSMC consolidation will take place as a stock exchange at a ratio of two
shares of WSMC to one share of TSMC securities. The exchange ratio is
based on the net worth per share and future earning prospects of WSMC.
The third-largest foundry in Taiwan, WSMC operates an 8-in. fab
using 0.25- and 0.18-µm processes. A second 8-in. fab is scheduled
to start production in March, TSMC says. Acer Semiconductor Manufacturing
Group sold a 30% stake to TSMC in June 1999 following the decision by
TI to quit the DRAM joint venture. After TI left, Acer converted the Taiwan
foundry from DRAM to logic manufacturing.
WSMC's two fabs are expected to produce a total annual output
of approximately 400,000 8-in. wafers this year and an estimated 760,000
wafers at full capacity. The two mergers will enable TSMC to increase
its annual capacity of 8-in. wafers from approximately 2.8 million to
approximately 3.4 million.
TSMC will not step up the pace of development of copper-based
processes as a result of the mergers, says Chuck Byers, the company's
director of communications. He notes that the foundry is the first to
make copper-based chips commercially available, adding that the new metal
processes won't be a "major driver" until the 0.13-µm regime. "I
don't think you're really going to see that being a major consideration
until 2001." (Please see foundry story in 'Round the Circuit, page 30.)
When TSMC announced the WSMC merger, Morris Chang, TSMC's chairman,
pointed out that the global demand for foundry products "has steadily
and strongly increased for some time." Byers cites several reasons for
the increased demand. "The most obvious but the biggest driver perhaps
is the cost of capacity. There are some numbers floating around that it's
going to cost about $4 billion to build a 12-in. fab. How many companies
are going to build that, fill it up, and get a return on capital?"
Another factor--what Byers calls the "disaggregation of the semiconductor
market"--underlies the increase as well. The company spokesman says the
industry is seeing "a burgeoning development of design houses" as well
as an expansion of "third-party libraries" and IP vendors.
Another overall trend fueling industry demand for foundry product
is chipmakers' need to focus their funds and attention on manufacturing.
After putting some R&D funds into product design and development and
then "spending some money for marketing and sales," chipmakers are asking
themselves, 'How much does that leave for other things?' " Byers says.
"The answer is 'not that much.' "
The twin acquisitions will increase TSMC's industry lead, giving
the foundry approximately 40% of the global market, according to Byers.
He says 60% of company revenues come from U.S. customers. The foundry
focuses on manufacturing logic chips with CMOS processes with an estimated
5 to 10% of its production capacity in DRAMs. In addition to its copper
development at Fab 5 in Hsinchu, TSMC has the WaferTech plant in Camas,
WA, and is building a fab with Philips Semiconductor in Singapore.
Byers indicates that TSMC took only a small hit following last
September's devastating earthquake in Taiwan. The foundry's fabs were
"up and ready to run in about three days" following the disaster. The
quake destroyed approximately 18,000 in-process wafers, although "when
you look at it in terms of overall impact, I think we've got an output
of 1.89 million wafers in 1999. What's 18,000? If somebody gets clumsy
and drops a tray you've probably lost 18,000 wafers."
The lack of adequate power to Hsinchu Science-Based Industrial
Park "slowed us and everybody in Hsinchu down," he adds. Byers notes that
Taiwan is improving the electrical grid infrastructure by building a substation
and generation unit "to service strictly Science-Based Park."
On a visit to Taiwan shortly after the quake Byers was in a meeting
at the TSMC site when he and the others "felt this little tremor, and
I thought, 'Oh, it's an earthquake!' The nonreaction was what struck me.
The guy from Hsinchu was just talking, and he didn't bat an eyelash. You
might as well have heard the rustle of a tree outside.
"We ran around, rechecked the equipment, and were up in five minutes,"
he continues. "The TSMC rep says to me: 'The bad news is that we're good
at this. The good news is that we're good at this.' "

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