Product Extra!

A system for measuring copper CMP process parameters on-line in the polisher has been developed by Nova Measuring Instruments. Based on the company's NovaScan technique, the system measures metal loss, metal thickness, and residues inside the die on actual structures. The technology will enable IC manufacturers to shift to high-end copper processing by aiding the removal of copper and barrier residues from field or patterned areas and by preventing mechanisms that lead to the loss of metal thickness, such as erosion and dishing in dual damascene sites. Information: +972 8 9387505.

GaSonics International is offering the PEP Plus 3510, an enhanced version of the PEP 3510A dual-chamber photoresist removal system. The enhanced system includes a high-powered microwave generator that improves photoresist removal rates and digital calibration that extends magnetron lifetime and lowers the cost of consumables. Improved photoresist removal rates and a faster robot can increase throughput by 20% over the earlier model. For customers whose fabs are equipped with standard mechanical interface (SMIF) capability, a SMIF arm is optionally available. Users of the PEP 3510A system can choose the PEP Plus 3510 upgrade package as an option. The new platform will replace the original platform on orders beginning in June 2000. Information: 408/570-7633.

Soitec's silicon-on-insulator (SDI) Unibond substrate has been qualified by Honeywell. The Unibond wafers are produced using commercially available equipment with a process that incorporates both ion implantation and wafer bonding technologies. The silicon quality of this wafer is higher than that of standard or low-dose wafers created through the separation by implanted oxygen (SIMOX) process, and the uniformity of the silicon dioxide layer is much better than that of SOI wafers produced by the bond and etch-stop method. The transition to Unibond wafers enables the manufacturing of very complex integrated circuits that cannot be produced with SIMOX, such as high-temperature products. Honeywell uses the SOI wafers to produce ASICs, SRAMs, ROMs, FIFOs, and data bus interfaces. Information: +33 0476 927500.

A process visualization workstation from Electroglas helps characterize and manage the wafer bumping process. The QuickLook system analyzes bumped wafer inspection data and images generated by the QuickSilver bump inspection system on the production floor. The workstation facilitates the comparisons of bump height, position, area, roundness, and volume within and among die, wafers, and lots. Capable of pulling data from multiple QuickSilver inspection systems, it enables an analysis of bump fabrication data by organizing and presenting wafer maps, defect maps, measurement files, and images. QuickLook collects all the measurements of defective bumps and archives bump images with wafer maps, bump measurement data, and automated defect classifications. Information: 408/727-6500, ext. 6511.

An applications package for compound semiconductor analysis using a Fourier transform infrared (FTIR) measurement tool has been developed by On-Line Technologies. Used to analyze complex thin films, the FilmExpert combines advanced optics, model-based analysis, and a highly stable FTIR to extract thickness, carrier concentration, index of refraction, and composition information from multilayered structures. Providing data from infrared reflectance measurements of product wafers with no artifacts or biases from stray backside reflections, the tool is configured for manual wafer loading and high-speed wafer mapping. A suite of model-based analysis algorithms permits the extraction of multiple parameters from complex structures. Layers as thin as 100 nm can be measured with a level of precision better than 5 nm. Information: 860/291-0719.

Tegal has been granted a U.S. patent for a plasma rector with a deposition shield. The shield prevents the redeposition of wafer processing materials on the interior surfaces of inductively coupled plasma reactors, hindering the degradation of the power transfer into the etch reactor. Over time, this deposition affects reactor performance, resulting in a loss of etch rate, poor uniformity, and decreased uptime and throughput. The technology was developed for use in MRAM, FeRAM, data storage, and next-generation system-on-a-chip applications and is available as an option on the 6550 series etch reactor. Information: 707/763-5600.

An updated version of the Eliminator Junior ionizer from ESD Systems is available with removable emitters. The emitter cassette can be removed easily, enabling cleaning away from the work area or rapid replacement to minimize downtime. The unit has auto-balancing capability and a "clean-me" indicator that flashes when the emitters require cleaning. Available in 120- and 220-V ac models, the unit has airflow output ranging from 60 to 70 cu ft/min. Information: 508/485-7390.

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