CONFERENCE PROGRAMS CONTINUED

Novel Technologies

RF - MEMS

Alain Le Roy, LETI

Automotive MEMS

Robert Aigner, Siemens

Biomedical MEMS

Reiner Wechsung, Steag Microparts

Assembly, Testing

Heinrich Walk, ASYS

ModulAS--A Modular Assembly System
for the High-Speed, High-Precision Assembly of Multiple Microsystems

Johann Peter Feraric, Simotech

9 a.m.­5 p.m.

Advances in Chemical Mechanical Polishing
(CMP) Technology Course

Instructors: Dale Hetherington and David Stein,
Sandia National Labs; Joost Grillaert, IMEC; and Katia Devriendt, IMEC

Guest Speaker: Mike Ravkin, Manager of CMP and
Cleaning Technology Development, Lam Research

1­5 p.m.

Semiconductor Equipment Assessment (SEA)

Chair: Georg Kelm, European Commission

SEA--Strategic Partnerships Providing Productive

Solutions

Jeff Bruchez, SEA/SiTeC

Performance of a Twin Furnace System in
a 300-mm Production Environment

Sonja Radler, SC300

Automated 300-mm Test/Monitor Wafer
Logistics in a Production Batch Environment for Integrated Yield and Process Control

Jürgen Griessing, Infineon

Cost-Effective Removal of Particulate and
Metallic Contamination from Wafer Containment Systems Using a
200-300-mm Bridging Tool

Pascal Decamps, STMicroelectronics

Status of 193-nm Technology

Kurt Ronse, IMEC

Automated, 300-mm Compatible, Wafer
Analysis Preparation System with Integrated VPD-Droplet Collection

Stefan De Gendt, IMEC

Extending High Accuracy Analytical
Probing to 300-mm Wafers

Jürgen Frickinger, FhG IIS-B

STEP: SEMI E78 : Electrostatic Compatibility of Equipment

Chair: Arnold Steinman, Ion Systems, ESD/ESC
Task Force Leader, SEMI International Standards Program

Introduction: The Basics: Static Charge
Problems, Electrostatics, Measurement Techniques and Static Control Methods

Arnold Steinman, Ion Systems

ESD Damage to Components

Minimizing Electrostatic Attraction of Contamination

ESD Effects on Equipment

Implementing SEMI E78-0998, User/Manufacturer Collaboration to Achieve the Static Levels in the Guide

Arnold Steinman, Ion Systems

International Workshop on
Lead- and Halide-free Electronics

Chairs: Ruben Bergman, Executive Director of HDP User Group International; and Professor Suganuma, Osaka University

6:30­10 p.m.

Semicon Europa Opening Reception and President's Dinner

New Munich Trade Fair Center, Room 14

WEDNESDAY, APRIL 5

8:30­10:45 a.m.

Semiconductor Equipment and Materials Market Briefing Forum

Speakers: Elizabeth Schumann,
Materials Statistics Programs, SEMI; and John Schuler, Equipment Statistics Programs, SEMI

8:30 a.m.­12:30 p.m.

Lithography for 120 nm and beyond

Chair: Gerhard Gross, International Sematech

Cochair: Uwe Behringer, Institute for Microstructure Technology (FZK)

Introduction

Gerhard Gross, International Sematech

How Far Can Optical Lithography Go?

Luc van der Hove, IMEC

Next-Generation Lithography

John Canning, International Sematech

Next Challenges for Exposure Tool Suppliers

Bill Arnold, ASML; Phillip M. Ware, Canon; Speaker TBA, Nikon; and John J. Shamaly, SVGL

Next-Generation Dielectrics

Chair: Ivo Raaijmakers, ASM International

Welcome and Introduction

Ivo Raaijmakers, ASM International

Keynote

High-k Dielectrics for DRAMs

Gurtej Sandhu, Micron Technology

High-k for CMOS: From Furnace to CVD in Advanced CMOS Technology

Edward W.A.Young, Philips Research Labs

RTP for Advanced Dielectrics

Jeff Gelpey, Rahul Sharangpani, and Georg Roters,

Steag RTP

Atomic Layer Chemical Vapor Deposition
of High-k Gate Dielectrics

Suvi Haukka and Marko Tuominen,
ASM Microchemistry; and Ernst Granneman,

ASM International

Electrical Properties of Metal-Insulator-Semiconductor Devices with High Permittivity

Gate Dielectric Layers

M. Houssa, M.M. Heyns, M. Naili, and P.W.

Mertens, IMEC; and A. Stesmans, Dept. of

Physics, KU Leuven, Belgium

8:30 a.m.­5 p.m.

Environment, Health, and Safety (EHS) Compliance Market Driven and Legal Requirements (cosponsored by SSA Europe)

Chairs: Peter Middleton, Filtronics; and Alastair Brown, Rushbrook Consultants

Morning Session

Introduction

Peter Middleton, Filtronics

Explosive Atmospheres

Clive Patten, ITS

Pressure Equipment Directive

Speaker TBA

Electronic Waste

James Donaldson, Waste Exchange Services