Lithography Scanner

Canon Semiconductor Equipment

San Jose, CA

The FPA-5000ES2+ KrF scanner accommodates devices with either 0.18- and 0.15-µm design rules. Using a 2-kHz excimer laser, the scanner has improved throughput compared to previous tools and can expose 125 200-mm wafers per hour. The platform can be field converted from a 200- to 300-mm wafer format within a day. The scanner incorporates an ULTiMA lens assembly and Zernike coefficient-analysis lens tuning, ensuring very low wave-front aberration. The numerical aperture is variable from 0.45 to 0.68, while the exposure wavelength is 248 nm. An overlay accuracy of 25 nm can be enhanced by applying airflow and temperature control within the machine chamber and through the use of a hybrid active damper. The tool's improved vibration isolation structure allows synchronization control at a high scanning speed.

ESD-Event Monitors

Credence Technologies

Soquel, CA

A series of in-process monitors detects and measures ESD events accurately in semiconductor, flat-panel, and disk-drive assembly environments. Providing real-time information that helps reduce ESD-related losses, the EM Aware monitors indicate when problems arise with such preventive instruments as ionizers, wrist straps, and grounders. The small, sensitive monitors work with either built-in or optional remote antennas for monitoring events inside semiconductor tools. They offer a wide adjustment range, local and remote threshold settings, audio and visual indication of ESD events, an event-hold indicator, and connections to most data-acquisition and facility-monitoring systems.

Surface-Measurement Sensor

LMI Selcom

Southfield, MI

The LNS laser nanosensor provides fast, high-resolution, noncontact measurement of the surface roughness of silicon wafers and other highly reflective materials. The flexible, lightweight sensor employs autofocus to achieve resolution down to 5 nm, and it offers a frequency response rate up to 300 kHz. Depending on the model, the unit has a measuring range of 8.8­300 µm and an accuracy of better than 0.5% of the range. Suitable for use within small work envelopes, the sensor is 64 mm long by 20 mm in diameter and weighs 100 g. It has a separate control module and is available in four models with standoff distances ranging from 2.3 to 26 mm.

Flat-Panel Monitors

Modgraph

Woburn, MA

A cleanroom-qualified series of 12.1- and 15.1-in. flat-panel monitors features passivated-stainless-steel housings. Desktop and rack-mounted versions can be supplied with or without optional touch screens. Video and OEM configurations are offered. Monitor resolution ranges from 800 x 600 to 1024 x 768 pixels.

Static-Dissipative Linear Slides

Del-Tron Precision

Bethel, CT

Precision ball slides, crossed roller slides, and ball and crossed roller multiaxis positioning stages are available with an electroless-nickel coating to allow static charges to dissipate. The plating, a noninsulating alloy of nickel and phosphorus, provides a conductive path to the grounding apparatus. The linear motion devices meet ESD requirements for automated semiconductor production equipment. They are plated in accordance with ASTM standard B 733-97.

Temperature Probes

Mastco

North Brunswick, NJ

Probes with ultra-high-purity PTFE bodies are sufficiently durable for measuring the temperatures of corrosive and aggressive chemicals in numerous applications. The probe body is isostatically molded to a PFA-covered cable. The probe and cable have the same chemical resistance at temperatures ranging from ­328° to 536°F. Platinum RTDs, thermistors, ICs, and thermocouples enable the probe's integration with a wide variety of monitoring equipment.

In-Line Batch Sputtering System

KDF

Orangeburg, NY

The 844 NT is a high-throughput, cost-effective in-line batch sputtering system for processing high-density interconnect 300-mm wafers and flat-panel displays. The large-area processor features a small footprint, with a usable area of 261/2 x 261/2 in. and can hold four 300-mm wafers or many smaller ones. It has two processing palettes, which allow technicians to change from one wafer size to another quickly and process front- and backsides. The tool has a high-vacuum loadlock with a preheat substrate.

Liquid-Level Sensors

Gems Sensors

Plainville, CT

A line of electro-optical liquid-level sensors has been expanded to include a Teflon sensor with a vapor-barrier boot and a flanged flush-mount polysulfone model that has no threads in which contaminants can collect. Certain models designed for high-purity applications can withstand fluid temperatures to 212°F or pressures to 2500 psi. All of the sensors offer good resistance to particulate contamination in process fluids and feature solid-state design. They also have integrated electronics, eliminating the need for a separate controller. The sensors are minimally intrusive and can be supplied with a variety of mounting configurations.

Wafer Dryer

Interlab

Danbury, CT

The MDS-250S Cocoon dries semiconductor wafers with a stain-free nitrogen process. Because it has no moving parts in the drying zone, the high-purity recirculating dryer ensures that contaminant levels remain nearly undetectable. The dryer can handle wafers up to 200 mm in size without hardware modifications. Its compact dimensions make it suitable for use as a stand-alone wafer rinser/ dryer or for use at the final stage of any chemical process. A model designed for 300-mm wafers is also available, and the dryer can be incorporated into the manufacturer's semiconductor rinser/dryer system for critical cleaning applications.

Bulk-Chemical Control System

Lucid Treatment Systems

Hollister, CA

The Clarity LPC pressure controller/ monitor for programmable real-time control of pressure and flow in bulk chemical and slurry delivery loops regulates the amount of fluid that leaves a loop and returns to a day tank. A pressure sensor measures distribution loop pressure in <50 milliseconds; this measurement is compared to the loop pressure set point by the PLC, which responds to fluctuations by adjusting the position of a high-purity control valve. The flow monitor/control system is available in three models and two flow ranges.

Interferometric Camera

Jobin Yvon

Stanmore, Middlesex, UK

The Twin Spot interferometric camera is designed to perform real-time in situ process control functions in MEMS manufacturing applications. The patented camera can be used to measure large-feature and deep-trench etch rates and make end-point determinations. It employs two independent laser beams that can be positioned precisely by means of a manual or motorized translation stage. With an optional pattern-recognition system, beams are positioned on predefined wafer locations automatically. The camera runs with a software platform that enables users to program recipes. It offers high-sensitivity end-point algorithms, data management, and reprocessing for the review and postprocess analysis of runs.

Copper-Cleaning Products

Arch Chemicals

Norwalk, CT

The Microstrip 6000 series, a line of photoresist stripper and postetch residue cleaner products, was developed for use with copper low-k dielectric dual-damascene interconnect architectures. The safe, completely water-based cleaning formulation can be released into the industrial waste stream and eliminates the need for intermediate rinse steps. The products can remove residues without any detrimental effect on low-k dielectric and barrier layer materials.

Pressure Transducer

Sensotec

Columbus, OH

The Model HV pressure sensor, which adapts to specific high-volume applications, is offered in 10 pressure ranges from 0­25 to 0­10,000 psig. The compact, lightweight device can withstand overpressures as high as twice full scale and is rated operational for a temperature range of ­40° to 185°F. Made from a single piece of stainless steel, the sensor and housing are an integrated, hermetic assembly. The stainless-steel wetted diaphragm is compatible with most corrosive media. The transducer provides output of 4­20 mA or 1­5 V dc. CE-approved, EMI/RFI-protected onboard electronics minimize signal degradation over distance.

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