INDUSTRY NEWS

What's Going On

January 22­26, Wafer Failure Analysis for Yield Enhancement Seminar; Orlando, FL. Contact: 256/536-1304; clay@cti-us.com.

January 30, Understanding and Applying SEMI E78/Electrostatic Compatibility of Equipment; Phoenix. Contact: 510/704-5424; cchiang@ion.com.

January 31­February 2, Semicon Korea; Seoul. Contact: 408/943-6997, ljarman@semi.org (United States); +82 2551 3401, hkim@semi.org (South Korea).

February 25­March 2, SPIE's International Symposium on Microlithography; Santa Clara, CA. Contact: 360/676-3290; pw@spie.org.

February 26­March 1, Semiconductor Pure Water and Chemicals Conference (SPWCC); Monterey, CA. Contact: 408/745-0600.

March 4­6, Dielectrics for ULSI Multilevel Interconnection Conference (DUMIC); Santa Clara, CA. Contact: 813/978-3552.

March 8­9, CMP for ULSI Multilevel Interconnection Conference (CMP-MIC); Santa Clara, CA. Contact: 813/978-3552.

March 25­30, The Electrochemical Society Meeting; Washington, DC. Contact: 609/737-1902.

March 28­29, Semicon China; Beijing. Contact: 408/943-6997; ljarman@semi.org.

April 2­4, Ultrapure Water Expo; Philadelphia. Contact: 303/973-6700; water@talloaks.com.

April 10­13, Semiconductor Safety Association Annual Conference and Exhibition; New Orleans. Contact: 703/790-1745.

April 16­20, Materials Research Society Spring Meeting; San Francisco. Contact: 724/779-3003.

April 21­26, SVC TechCon; Philadelphia. Contact: 505/856-7188; svcinfo@svc.org.

April 23­24, IEEE/SEMI ASMC; Munich. Contact: 202/289-0440, mkindling@semi.org; +32 2 2896496, europrogram@semi.org.

April 24­26, Semicon Europa;
Munich. Contact: 408/943-7936, mjsensen@semi.org (United States); +32 2 2896493, kstuckey@semi.org (Europe).

May 13­15, International Symposium on Plasma Process­Induced Damage; Monterey, CA. Contact: 408/246-3600; della@vacuum.org.

May 30­June 1, SPIE's International Symposium on Microelectronic and MEMS Technologies; Edinburgh, UK. 360/676-3290; spie@spie.org.

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