AMD has used a new service to successfully mitigate ESD events on photomasks at its Fab 25 in Austin, TX. Launched in September 2000 by DuPont Photomasks and Ion Systems, the Canary ESD Service improves yields by eliminating sources of ESD in the photomask path, according to the suppliers.

The partners say the Canary ESD Service combines DuPont photomask technology and ESD auditing to determine the source of ESD-related mask damage. Service technicians can analyze the entire photolithography process or examine isolated aspects of it, including mask receiving, transport pods, stocker, and inspection stations, according to the companies.

AMD contracted for the service in October 2000 in order to eliminate photomask loss caused by ESD at Fab 25. The chipmaker modified mask-handling procedures and evaluated new materials to help dissipate static charge. Dan Sutton, senior member of AMD's technical staff, says the safeguards have been so successful that the manufacturer plans to use the service at its other fabs. Information: http://www.photomask.com; http://www.ion.com.

Dow Corning and Samsung Electronics are working together to develop advanced interlayer dielectric processes using Dow's XLK spin-on material. The supplier and the chipmaker hope to exceed the industry roadmap requirements for 70-nm production by refining XLK's capabilities at the dielectric constant of 2. The chemical supplier introduced XLK in the summer of 2000. Samsung has been using Dow Corning's FOx flowable oxide spin-on dielectric for several years. XLK is a porous version of the same HSQ molecule in the FOx material.

A new report from ICE summarizes the state of interconnect technology development. Copper Interconnect and Low-k Dielectrics examines the role of copper for interconnect metallization and explores options for low-k dielectric insulators. The 255-page report covers the limitations of Al/SiO₂ technologies and possible solutions offered by these new materials. Cross-sections of advanced devices are shown. Information: http://www.ice-corp.com.

A single-step electrochemical process created by Mitsubishi Electric has the potential to greatly reduce etching costs, the company claims. The HF process operates at approximately one-tenth of the cost of conventional four-step etching techniques, says Mitsubishi. Aspect ratios are greater than 60:1, and the process can be adapted for deep-submicron silicon etching. Using 3-in. wafers, researchers at Mitsubishi's Advanced Technology R&D Center in Osaka, Japan, have made SiO₂ micropillars, trenches, and cantilever structures.

The technique forms small pits on the top of a silicon wafer. Exposing the backside of the wafer to light triggers the chemical etching process. The light produces positive holes that create straight holes and trenches. A reduction in the intensity of the light reduces the number of holes and narrows the etch width. An increase in light intensity enlarges the hole size and widens the trench width.

The technique reduces etching costs primarily because it uses only one process step. The etching speed of 1.8 µm per minute is comparable with a conventional dry-etch speed of 2 µm per minute, Mitsubishi says. The manufacturer plans to switch the process from 3-in. to 5-in. wafers sometime during 2001. Over the long run Mitsubishi believes the technique can be used to make very high-aspect ratio trenches based on 50-nm pores. Presently, the pore sizes are 700 to 800 nm.

A new publication written to help laboratories make more-reliable measurements of ceramic powder particles has been published by NIST. NIST Recommended Practice Guide: Particle Size Characterization will aid industrial and academic labs in measuring both particle size and size distribution of the powders in a more reproducible way, the institute says. The guide is written for general users and includes aspects of particle characterization research that NIST has conducted for more than a decade. The research has resulted in the development of standard reference materials and improvements in measurement procedures, NIST says.

The book, NIST Special Publication 960-1, addresses production methods used by ceramic powder manufacturers. Techniques such as microscopy, sieving, gravitational sedimentation, and laser light diffraction are examined. Directions are given for sample preparation and instrument calibration. The guide also covers national and international standards as well as capabilities, limitations, and general principles.

In related news, NIST researchers are exploring the challenges posed by characterizing submicron and nanosize particles used in making substrates and high-temperature structural materials. The institute will host a workshop on reliable particle size measurement at the submicron level and below in October 2001. Information: carolyn.sladic@nist.gov.