Wafer supplier Silicon Genesis (SiGen) says it is using a unique noncontact process to produce ultrathin SOI wafers. The substrates feature layer thicknesses of 15 to 50 nm for fully depleted substrate CMOS transistors. Surface roughness is <1 Å for all silicon layer thicknesses, SiGen says. The company has already shipped some of the ultrathin wafers to chipmakers and is making the wafers available with customized germanium-rich layers for high-mobility CMOS and optical use. The proprietary process can be used to manufacture ultrathin 300-mm wafers, SiGen claims.

TSMC is working with Asyst Technologies on a project to optimize automated material handling for 300-mm wafer processing. TSMC has three main goals for the 300-mm automation project: to increase capacity, reduce lot delivery times, and maximize tool use. The four-month project began in September. Asyst has installed its FasTrack transport system at the vendor's facility in Taichung, Taiwan.

Meanwhile, TSMC says it has purchased high-energy implanters from Axcelis Technologies. The foundry plans to use the 300-mm HE3 and 200-mm GSD/HE systems at its 300-mm Fab 12 in Hsinchu and its 200-mm Fab 6 in Tainan, respectively. The HE3 has already been installed at Fab 12. The GSD/HE tool is scheduled for delivery in the first quarter of 2002.

Electroglas of San Jose claims its EG5 300e automatic prober for 300-mm wafers has passed tests proving its production capabilities. The prober underwent testing at the facilities of Agilent Technologies in Hachioji, Japan. Electroglas says that its strategic partner, Cascade Microtech, helped to develop technology that results in low levels of noise, leakage, and capacitance. These capabilities greatly shorten measurement settling times, Electroglas says. The reduced settling time permits faster testing than is currently available, thus increasing parametric test throughput. Cascade developed a wafer chuck and special designs to ensure reliable and repeatable signal measurements, Electroglas says.

A Japanese manufacturer of metrology equipment has purchased 40 StarCon controllers from PRI Automation. The tool manufacturer has integrated several of the controllers in metrology systems already installed at a 300-mm fab in Taiwan, PRI says. The controllers are the "brains" that control the tools' atmospheric wafer-handling systems, the vendor notes. The StarCon components feature a real-time operating system with a three-dimensional display and animation, visual flow chart, and Cartesian motion. The controllers are complemented by PRI's TwinStar dual-arm robot, which is designed to transfer wafers in less than three seconds.