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INDUSTRY NEWS

New Materials Roundup

Low-k 'summit' convenes

A high-level conference hosted by Dow Chemical in late November drew scientists, engineers, and program managers intent on speeding the introduction of low-k materials. The three-day Summit for SiLKnet Alliance in Phoenix drew representatives from member companies to hear the latest developments concerning Dow's SiLK dielectric resin. Dow says the conference goal was to see that participants have the tools needed to meet BEOL interconnect requirements for low-k integration at the 130-nm node and below.

The alliance was formed in 2001. In addition to Dow Chemical, members include Arch Chemicals, Ashland Specialty Chemical, Dainippon Screen, EKC Technology, TEL, and Verteq. Five new materials and equipment suppliers joined the alliance during the conference, which was the first high-level symposium Dow Chemical has sponsored for the low-k group. The new members are ATMI MLS Photo/Etch Solutions, Axcelis Technologies, Bayer, General Chemical, and the SEZ Group. The additional companies bring the total number of alliance members to 15.

Service reclaims GaAs wafers

A San Jose–based company claims to have developed a technique to restore gallium arsenide (GaAs) wafers to almost prime condition. Exsil says it has established a contamination-free dedicated line to reclaim 100- and 150-mm GaAs wafers. To avoid breakage during shipment, the company also has designed special packaging.

Exsil, which has offered wafer reclaim services for nearly 25 years, says a prime GaAs wafer costs approximately 10 times the price of a silicon wafer of comparable size. A prime 150-mm GaAs wafer costs $350–$450, a mechanical-grade wafer, $175–$250, according to Exsil. In contrast, a restored GaAs wafer costs approximately $85–$100, the company says. Exsil is a unit of the electronic division of Rockwood Specialties of Princeton, NJ.


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