The Versalock system used in compound semiconductor, magnetoelectronic, and photomask production integrates plasma etching and deposition technologies. Several configurations are available, from simple parallel-plate reactive ion etchers to high-density, inductively coupled plasma process modules. The platform features up to three process modules that can be configured serially for sequential, in situ process applications or in parallel. Single- or multiwafer process modules are available. Applications include gallium arsenide via etching; frontside etching of GaAs, AlGaAs, and InGaP transistor films; SiN deposition; and InP etching. The system can be used to fabricate monolithic microwave integrated circuits, optoelectronics devices, and MEMS devices. (Semicon Europa, Booth A3.412)

Wafer Backside Inspection

A fully automated wafer backside inspection system addresses process control needs for advanced design rules and 300-mm applications. The Backside Inspection Module (BSIM) enables nondestructive inspection of the backsides of patterned production wafers with the sensitivity to detect particles as small as 50 nm. As chip fabrication moves to the use of double-sided polished wafers for 300-mm applications, defects on the wafer backside that come to the surface during backside polishing pose a risk of yield losses. Such defects cause front-surface distortion during lithography exposure and can migrate between processes. The BSIM applies the Surfscan SP1 platform to detect and classify a wide range of defect types and decreases the use of unpatterned test wafers. Its edge-only wafer handling is nondestructive to the unscanned side. The tool can be used during all process phases to detect backside defects rapidly with little impact on tool productivity. (Semicon Europa, Booth A2.662)

DUV CaF₂ Lenses

Plano-convex CaF₂ lenses are for use with fluoride and argon fluoride (ArF) excimer lasers. The lenses have a high-power, double-band antireflection coating with fundamentals at 157 and 193 nm. The lens surface features a 4-rhomb polish and microroughness ranging from 0.3–0.4 nm, resulting in ambient illumination levels that are negligibly low compared with absorption. CaF₂ lenses have a 50-mm diameter and are available with focal lengths of 200, 300, and 500 mm. (Semicon Europa, Booth A2.677)

Gas Regulator

A manually adjustable HF-series gas regulator has flow rates up to 200 std L/min. A choice of four springs provides outlet pressures ranging from vacuum to 150 psig in a compact design that is approximately half the size of conventional pressure regulators with comparable flow rates. Color-coded load springs are isolated from the wetted components and can be changed in the field without exposing the system to contamination. A pressure-sensing assembly maintains consistent outlet pressure when changes in system pressure and flow rate occur, reducing the need for spring adjustment. The unit, available for inlet pressures up to 500 psig, has a PCTFE poppet for compatibility with a wide range of fluids. It is available with 1/4-in VCR split-nut assemblies or 1/4-in. tube butt-weld end connections. (Semicon Europa, Booth A2.142)

Deep-UV Laser Source

The Indigo-DUV narrow-linewidth, deep-UV, solid-state laser source is a single-frequency source of 193 or 248 nm light in a TEM₀₀ beam. The unit can be used for UV lithography, metrology, and mask inspection. At the fundamental wavelength, it provides pulses with an average power of 1.5 W and a repetition rate of 5 kHz. A harmonic generation scheme produces up to 2 mW at 193 nm and 50 mW at 248 nm, with a linewidth of <0.02 pm. The system combines the Nd:YLF Evolution laser with the injection-seeded Ti:sapphire laser. It offers efficient and stable diode-pumping and operates on 110 or 220 V. It does not require an external water supply and can be upgraded.

Temperature Measurement

The Sensor Probe 1400 series helps users improve their understanding of thermal conditions in semiconductor equipment. The unit can be used in wet or dry environments and is compatible with a variety of liquid media, including DI water, IPA, and photoresist. With a high absolute accuracy of >±0.1°C and sensor-to-sensor interchangeability of 0.1°C, it can be used in environments with temperatures as high as 230°C. It is available with a variety of sensor tip designs that are optimized for different temperature measurement applications. The calibrated small-tip resistance temperature detector probes can be used with the company's Thermal Track and Thermal Map systems for enhanced numerical and graphical analysis.

Vacuum Inlet/Exhaust Trap

The high-capacity MV Multi-Trap Model IC vacuum inlet/exhaust trap has a stainless-steel knock-down stage for collecting heavy solids. The trap can be configured with two banks of 10 replaceable 4 1/2-in. filter elements or one bank of five 9 1/2-in. elements. Featuring water-cooled internal coils with better than 200 sq in. of surface area, the unit collects both condensables and particulates. Available with stainless-steel or copper gauze, a molecular sieve, activated charcoal, activated alumina, Sodasorb, and pleated polypropylene filter elements, the trap can be easily customized. With >200% more cooling surface than conventional traps, it forces all effluents to go through every filtration stage. (Semicon Europa, Booth A3.562)

Surface-Inspection Camera

The XCD-SX900UV high-resolution, black-and-white digital CCD video camera with near-ultraviolet sensitivity captures clear images of minute surface details in semiconductor and other applications. The camera incorporates a 1/2-type interline transfer progressive-scan CCD sensor based on the company's HAD technology, providing a spectral range of 230 to 100 nm. It also features a high-resolution SXGA video format of 1280 (H) x 960 (V). Designed for use with UV lighting systems, the camera can capture fine surface details, including small scratches, dust, and blemishes that might remain undetected using visible or infrared lighting. Moreover, near-UV light does not penetrate the surface. With a small footprint of 44 mm x 33 mm x 116 mm, the unit can be easily integrated into machine vision systems.

GaAs Wafer Reclaim

A high-quality restoration process for gallium arsenide (GaAs) wafers offers fabs the ability to reuse the substrates. Wafers of 100 and 150 mm are restored to specifications that equal or exceed those of prime wafers. After being received from customer sites, GaAs wafers are inspected and sorted by film type. After sorting, the substrates undergo several chemical strip and etch steps that eliminate all films and patterns. Batches of wafers with a similar thickness are processed together to ensure consistent film removal during polishing. After polishing, the wafers are cleaned to remove trace impurities. Then they are visually inspected for defects and scanned with automatic laser particle counters for light-point defects. The final product costs a fraction of prime GaAs wafers. The use of a dedicated reclaim line avoids problems associated with cross-contamination.

Reliability Software

The Genesis reliability module integrates several techniques for analyzing the reliability of semiconductor devices and the tools that produce them into the Genesis platform. By incorporating the latest advances in reliability theory, the software enables accurate assessment of product and tool reliability faster than conventional techniques. The module includes several features. Reliability modeling provides support for modeling data using standard reliability distributions such as log-normal, Weibull, and exponential. Accelerated testing predicts and models reliability under standard use conditions from failure experiments under accelerated temperature and voltage stress conditions. Qualification testing uses Bayesian statistical methods to shorten the qualification process by drawing on prior knowledge about mean time between failures in equipment and components.

Vibration-Isolation Platform

The Nano-K Biscuit is a lightweight bench-top vibration-isolation platform for use with scanning electron microscopes, atomic force microscopes, and other analysis equipment. The platform is 24 in. wide x 22 1/2 in. deep x 8 1/2 in. high, and weighs approximately 80 lb. It can support instruments weighing more than 160 kg. An automatic adjustment feature with a range of ±7 lb enables the platform to bear varying weight loads. The unit features negative-stiffness technology (springs and flexures). It has true 0.5-Hz performance, requires no air or complex electronics, and requires little or no maintenance.

Vortex Flowmeters

Flowmeters based on vortex technology for use in pure-fluid applications measure flows from 0.13–18.0 gal/min, with accuracies from ±3% of full scale to ±1% of reading for top-of-the-line models. Three models are available. The VF-2000 and VF-3000 can be equipped with an optional local readout and have a current and pulse output that can be used with the company's digital compact counter for remote readouts. Adjustable alarm set points also are available. The VF-4000 has a local readout of total flow and flow rate, a current and pulse output, and an ultrasonic pickup. The VF-2000 is made of PPS and comes with male-threaded connections in 3/8- and 1/2-in. sizes. The VF-3000 and VF-4000 are made of PFA, have tube-end and flare fittings, and come in 3/8-, 1/2-, and 3/4-in. sizes.

Process Management Software

SORTmanager, part of the EGsoft suite of software, is a Web-based tool for infrastructure and process management applications. The software connects semiconductor manufacturing process steps and identifies areas for improvement, allowing manufacturers to realize greater precision than can be achieved in a single tool. SORTmanager combines statistical analysis and reporting capabilities with Web technology to deliver process optimization that provides information for monitoring, analyzing, and improving processes. The software enables fab personnel to access data and perform analyses anywhere. (Semicon Europa, Booth A1.424)

Boron Analyzer

A UPW boron analyzer measures parts-per-trillion levels of boron in DI- and ultrapure-water applications. The analyzer performs continuous, on-line, unattended monitoring of ultratrace levels of boron and also can be used to determine the exhaustion of mixed-bed ion-exchange resins. With the parts-per-trillion sensitivity of ICP-MS, the analyzer ensures compliance with primary and polish-loop boron specifications. Because the unit can perform five analyses per hour, engineers can protect against upset conditions that would go undetected with ICP-MS or other batch analysis methods.