MICRO: Product Extra!

Nanometrics is offering a new option for the NanoSpec thin-film analysis systems. The option adds wafer bow and stress-measurement capability to film-measurement systems, eliminating the need for separate tools and lowering capital expenses. In 300-mm fabrication, deposited films can cause wafers to bow, significantly increasing the amount of stress in the films and causing them to crack and delaminate. The combined application improves tool utilization and reduces start-up times, since stress management and film management applications have similar recipe setup and equipment use requirements. Information: www.nanometrics.com.

Acutec and Nada Technologies have developed the Class 1 SMIFed minienvironment to connect the IDScope, an in-cassette wafer ID system, to a SMIF loader. By using a SMIF loader's installed base and designing the minienvironment to interface with commonly used loaders, users can redeploy the loaders. Using the SMIFed IDScope system can reduce the time it takes to identify 25 wafers to just 30 seconds. The system has three components: the IDScope engine and a PC-based controller, the minienvironment, and the SMIF loader. Service panels provide access to the engine, and a 19-in. rack-mount controller is fitted into the minienvironment. The loader removes the cassette from the SMIF pod and places the wafers and cassette onto the top of the engine. The engine then signals that a cassette is ready. After all wafers have been identified, the engine signals that the scan is complete and the loader retrieves the cassette. The enclosure is available with or without the IDScope engine and controller. Information: 503/675-9040.

Axcelis Technologies has introduced an H₂O-vapor-assisted plasma technology. The enhancement helps to thoroughly and rapidly remove polymer and postetch residues in BEOL dry-clean applications, such as photoresist strip over low-k materials. It can enable customers to decrease process times by as much as 40% while reducing the number of poststrip wet cleans. The enhancement is available as an option on the FusionGemini ES (enhanced strip) plasma ashers and can be added as an upgrade to systems in the field. The technology allows chipmakers to use H₂O vapor as one of the process gases in many dry-strip applications, including postvia etch, postmetal etch, shallow-trench isolation, and poly etch. The addition of H₂O vapor improves polymer removal selectivity, reducing undesirable oxide or nitride loss. Information: 301/284-5841.

A new catalog from Bosch Rexroth's Linear Motion and Assembly Technologies division highlights aluminum framing for cleanrooms. The 102-page catalog details hundreds of aluminum structural framing components, connectors, and accessories. It matches components to an application and includes part numbers, measurements, product illustrations, and how-to diagrams. It also lists tools needed to construct cleanroom structures, contact information, and aluminum framing design software. Information: www.boschrexroth-us.com.

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