A surge in demand by end-users will spur 30% growth in the global semiconductor market in 2003, a market research firm predicts. Semico Research bases its prediction on unit shipment forecasts "derived from semiconductor consumption in end-use markets, which has proven to be extremely accurate," claims Jim Feldhan, president of the Phoenix-based company. This analytical concept, combined with Semico's long-term forecasting tool, the inflection point indicator, also "points to a solid recovery next year," Feldhan insists.

Vendor claims metrology first

Nanometrics says it has introduced the semiconductor industry's first in-vacuum stage for integrated metrology. The platform promises highly accurate measurements from within cluster tools, the supplier claims. The new stage works with all of Nanometrics' metrology technologies and both 200- and 300-mm wafer cluster tools.

Nanometrics plans to integrate the technology with its optical critical dimension platform. Capable of covering the entire wafer, the stage features a small measurement-spot size for highly sensitive CD and profile measurements inside the process chamber. An edge-gripping wafer chuck minimizes yield loss from backside particulate contamination. The R-theta stage technology is designed to fit inside a cluster tool without affecting tool footprint, according to the supplier. Information: www.nanometrics.com.

Instructional books updated

An industry training organization has published revised versions of two instructional booklets. Semiconductor Services of Redwood City, CA, has updated Semiconductor Terminology– Graphic Glossary of Terms and Integrated Circuit Manufacturing Synopsis. The synopsis booklet contains revised statistics and new technologies such as copper. An illustrated dictionary, Semiconductor Terminology has added terms related to the use of copper, low-k dielectric materials, and atomic layer deposition. Expanded coverage of CMP-related topics and next-generation lithography is also featured in the dictionary, which is written for the nontechnologist. The synopsis offers a concise overview of the semiconductor industry.

Each publication is spiral bound. Semiconductor Terminology is 102 pages; Integrated Circuit Manufacturing Synopsis is 35 pages. The authors are Michael Heynes, a senior industry technologist and former senior instructor at Lam Research, and Anne Miller, manager of Semiconductor Services. Information: www.semiconductorservices.com; 650/369-7890.

Cleaning workshop to debut

A workshop exploring challenges and solutions in surface cleaning is set to debut in Boston. The First International Surface Cleaning Workshop will be held November 12–13 on the Boston campus of Northeastern University. Presentations and panel discussions will cover the broad spectrum of cleaning topics. These include new cleaning technologies such as supercritical carbon dioxide and cryogenic aerosols, surface damage, single-wafer cleaning, post-CMP challenges, and physical cleaning techniques such as megasonic, brush, and hydrodynamic. Additional topics include surface cleaning for copper, low-k and high-k dielectric materials, and the EHS impact of surface cleaning.

Chairman of the symposium is Ahmed Busnaina, the William Lincoln Smith professor and director of the university's NSF Center for Nano and Microcontamination Control. Information: www.cmc.neu.edu/surfacecleaning.html.

ALD to pace deposition segment

A market research firm foresees big things for the atomic layer deposition (ALD) market in 2002. In a new report on thin-film deposition, The Information Network of New Tripoli, PA, predicts the ALD market will grow 62% in 2002 to $82 million. That increase follows an astronomical market rise of 188.2% to $49 million in 2001. ASM International led the market with a 51% share, the firm reports. In addition to ASM, several front-end toolmakers have begun selling ALD systems. Players include Genus and Applied Materials, which introduced a tool last year. Genus has installed ALD-based systems at six customer sites.

A technique related to CVD, atomic layer deposition enables the growth of thin solid films one layer at a time at moderate temperatures. ALD has an advantage over chemical vapor deposition because it can be used to separate individual reactants through surface adsorption. Proponents such as Tom Seidel, CTO of Genus, note that the technique deposits highly conformal monolayers at high film uniformity on large substrates. Relatively low throughputs, however, remain a stumbling block.

The overall market for thin-film deposition tools will grow a meager 4% to $3.6 billion in 2002, according to The Information Network. Revenues plummeted in 2001 by 46.1% to $3.4 billion. Applied Materials dominates the deposition segment with an 83% share of the PVD market, a 48% share of the metal CVD market, and a 58% share of the dielectric CVD market, according to the research firm. Other manufacturers are Novellus, TEL, Ulvac, Genus, Kokusai, SVG, and ASM.