An enhanced version of GW Associates GWconX300 300-mm connectivity software from Asyst solves communications challenges associated with wafer-fabrication tools that use an internal buffer or ministocker instead of an external loadport to process FOUPs. Because critical IC tools such as diffusion furnaces and wet benches have internal buffers, they require more-complicated software than tools with fixed buffers. The connectivity software uses SEMI standard protocols required for all 300-mm and advanced 200-mm factory automation systems. It provides run-time software libraries that can be incorporated with the embedded control software of any type of 300-mm tool. The software also provides tools for the development and integration of connectivity software. Information: www.asyst.com.

The enhanced model HPS Series 901 pressure/vacuum loadlock transducer (LLT) from MKS Instruments, HPS Products, combines a piezo atmosphere switch and a MicroPirani vacuum gauge into an integrated, compact package. The piezo is a differential pressure sensor that operates properly under varying atmospheric pressures related to weather and elevation, ensuring that it will indicate when a process tool's loadlock door should open. The transducer has three setpoints, a choice of digital communications, an integrated electronic control circuit, and analog output capability. Unlike traditional Pirani gauges, the LLT is equipped with a MicroPirani, whose element is made of a one-millimeter-square silicon chip, allowing measurements to be made in a very small volume. With a small sensing portion, the MicroPirani has a range from 1000 to 10^­5 Torr. It is gas-type sensitive and thus can be used to find medium to fine leaks in vacuum systems. Information: www.mksinst.com.

Thomson Derwent has launched Derwent Micro-Electro-Mechanical Systems (MEMS) & NEMS Industry and Technology Patents Profiles, a global source of MEMS-specific patent information on microdevice R&D. The profiles cover information on patents filed in the microdevice area by leading patent-issuing authorities and technology organizations, such as Canon, Seiko Epson, Lucent, Hewlett-Packard, and Sony. Previously available only to corporate legal departments and libraries, the Profiles will deliver patent data directly to scientists, researchers, and engineers. Information: www.derwent.com/itp.

Matheson Tri-Gas and ATMI have added three new specialty gases to ATMI's subatmospheric safe-delivery sources (SDS): phosphorus trifluoride (PF^₃), arsenic pentafluoride (AsF^₅), and hydrogen selenide (H^₂Se). With the additions, the SDS product line offers eight gases. Matheson will manufacture, market, and distribute the new SDS products. ATMI's patented subatmospheric technology uses special materials that bind to specific gas molecules, effectively converting previously high-pressure toxic gases into no-pressure materials. Information: www.mathesontrigas.com.

Three product enhancements have been introduced by Rodel for its IC1000 line of CMP polishing pads. The first offering, the IC1000 integrated window pad, uses a proprietary process to bond the optical window to the pad, providing an enhanced endpoint technology. Available for 200- and 300-mm applications, the window pad improves process reliability in aggressive high-temperature copper and tungsten processes. The second offering, the A6-style pad, has the same physical properties as the IC100-A2 200-mm pad. The A6 eliminates pad variability for users shifting from 200- to 300-mm manufacturing. The third offering, the SP2000-series subpad, resists slurry absorption and eliminates slurry-wicking issues. The subpad improves planarity and polish consistency over the lifetime of the pad. Information: www.rodel.com.