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Connectivity software from Cimetrix enables fabs to convert equipment software, with or without a GEM interface, to full 300-mm compliance in as little as six to eight weeks. CIM300Expert works in conjunction with the company's CIM300 connectivity software, but incorporates software modules to handle the 200- and 300-mm graphical user interface, equipment front-end module (EFEM) logic and interfacing, and 300-mm local and remote mode logic. The flexible software allows toolmakers to use products from different EFEM suppliers and includes a source code license and simplified application programming interface for handling the integration of major 300-mm standards. Combined with the company's integration services, the new software reduces overall implementation time to one month. Information: faulkner@cimetrix.com(Semicon West, S.F., South Hall, Booth 305)

A CD from Bosch Rexroth features linear-motion product catalogs and manuals. The CD contains catalogs and manuals for ball rail systems, precision ball screw assemblies, linear bushings, and linear-motion modules. Electronic files in .pdf format offer detailed product specifications, including part numbers, product features, technical data, dimensions, illustrations, and how-to diagrams of components. Information: kevin.gingerich@boschrexroth-us.com. (Semicon West, S.F., North Hall, Booth 5284; S.J., McEnery Hall, Booth 11722)

Matec Applied Sciences has been granted a patent for its acoustic particle sizer, which simultaneously measures particle-size distribution, percent solids, acoustic attenuation and sound speed spectra, pH, temperature, and conductivity of various types of colloids, such as CMP polishing slurries. The acoustic particle sizer performs measurements without the need for prior sample dilution. The instrument is an alternative to traditional light-scattering-based instruments that require high sample predilution, which can change a
dispersion's particle size distribution and introduce operator error. The instrument uses a patented particle-size algorithm developed by Lucent Technologies. Information: colloid@matec.com. (Semicon West, S.F., South Hall, Booth 3047)

An eight-page brochure from Durex Industries highlights the company's broad assortment of electric heater and temperature-sensing products for the semiconductor industry. Products include bake platens for 200- and 300-mm wafers, bake/chill platens, bake/chill pedestals, hot chucks (heated tools), high-temperature platens (>450°C), pedestal heaters, mineral-insulated cable heaters, tubular heating elements, cartridge heaters, multipoint thermocouples and resistance temperature detectors (RTDs), mineral-insulated thermocouples, and platinum RTDs. The products are used in all phases of wafer processing, including CVD, photolithography, stripping, PVD, and etching. Information: sales@durexindustries.com. (Semicon West, S.F., South Hall, Booth 121)

Sigma-C has strengthened the predictive capability of its lithography-simulation software by augmenting its resist-parameter-determination software. FIRM version 3.1 has been upgraded to provide more-realistic modeling of resist development. The software allows users to input their own experimental resist data, including full resist profiles. It can optimize any simulation parameter by comparing simulation predictions to observed experimental results, and then parameters can be automatically tuned to minimize the difference. Data that can be optimized include resist thickness as a function of exposure dose and development time, focus-exposure matrix of resist critical dimensions, resist profiles extracted from scanning electron microscopy images, and E0 swing curves. Information: usa@sigma-c.com.

Applied Materials has been granted a patent for an endpoint technology that can provide precise control of CMP processes. The patent, "Method for In-Situ Endpoint Detection for Chemical Mechanical Polishing (CMP) Operations," applies to technology used on the company's Mirra, Mirra Mesa, and Reflexion CMP systems. The technology uses a laser to direct a light beam through a transparent window in the polishing pad to the wafer. Light reflected from the wafer provides information to determine the precise point at which the polishing process must be stopped. The technology plays a role in enabling shallow trench isolation, copper interconnect, tungsten, and poly applications. Information: 408/563-0647. (Semicon West, S.F., South Hall, Booth 1026)

A micro-Raman spectrometer extends the analytical capabilities of scanning electron microscopy. The Renishaw SEM-Raman from JEOL, when installed in the company's SEM, pinpoints the chemical identities of molecular compositions. In semiconductor manufacturing applications, the tool identifies the composition of submicron particle contaminants on the wafer surface. The molecular and structural analyzer incorporates Raman photoluminescence and cathode luminescence spectroscopes directly into the SEM. Users can take advantage of the high spatial resolution afforded by the SEM and the chemical information revealed by Raman, which is sensitive to light-element chemistry. The instrument is easy to use and features a patented retraction mechanism that allows all other analytical methods to operate normally. Information: nielsen@jeol.com. (Semicon West, S.F., South Hall, Booth 1215; S.J., McEnery Hall, Booth 10327)


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