INDUSTRY NEWS

300-mm Imperative

Axcelis touts stripper system

Axcelis Technologies says its new resist strip tool is the first such system that won't damage low-k materials. Introduced May 27, the ES3Lk uses chemistries that preserve the insulating and structural properties of the low-dielectric-constant materials in dual-damascene processes, according to Jan-Paul van Maaren, vice president and general manager of the supplier's curing and cleaning systems unit.

Beverly, MA–based Axcelis claims the system solves one of the top five challenges to low-k integration that are enumerated in the International Technology Roadmap for Semiconductors. The ES3Lk causes no latent damage to the materials, as conventional dry cleaning processes do, the company says.

The stand-alone tool caps layers and etch stops through the 45-nm technology node. Axcelis claims that the ES3Lk is 25% less costly to operate than in situ systems with etch and stripping processes in one process chamber. Based on the company's established FusionES3 platform, the system is compatible with wet cleaning steps. The process also suits all dense and porous low-k materials.

Wacker buys metrology tool

A major supplier of 300-mm wafers has purchased a SemiTest metrology system for an epitaxial wafer line in Burghausen, Germany. Wacker Siltronic selected the Epimet 300 because the noncontact tool profiles epitaxial layers without scrapping any wafers, says SemiTest. The system's dual-cassette architecture also played a role in Wacker's decision, the company says.

Wacker Siltronic collaborated with both SemiTest and Veonis Technologies, the supplier's German distributor, to develop the Epimet 300, which was introduced in 2002 at Semicon West. Unlike Hg-probe and CV-Schottky measurements, the system is completely nondestructive, the Massachusetts-based supplier says. A FOUP-equipped system costs approximately $1 million.

Mattson client wants more

A client described as a major chipmaker based in Europe has purchased additional process gear from Mattson Technology of Fremont, CA, the supplier says. The customer's multimillion-dollar order includes several 300-mm RTP and strip processing systems. An Aspen III stripper was the first tool shipped to the customer's 300-mm fab, the equipment maker reports.

Wafer repair tool qualifies

A wafer repair system from GSI Lumonics of Wilmington, MA, is going to Taiwan. Powerchip Semiconductor in Hsinchu ran GSI's WaferRepair M430 tool through acceptance tests and qualified the system for production, the vendor says. The repair equipment meets the automation requirements of Powerchip's 300-mm fab. The tool uses laser-based fusing for DRAM, SRAM, flash, ASIC, and other processes, GSI says. Powerchip manufactures DRAM devices and provides foundry services.

Foundry chooses litho tool

A Singapore-based 300-mm foundry venture has purchased an advanced lithography system from ASML. UMCi plans to install the AT:850B tool in its Singapore fab to manufacture 130-nm chips. The tool is based on ASML's Twinscan 300-mm optical lithography platform for making chips down to 80-nm geometries. UMCi is a collaboration involving UMC, Infineon Technologies, and Singapore's Economic Develop Board Investments. The foundry will make up to 40,000 wafers per month when operating at full capacity.