An enhanced version of the V3 wafer-cleaning station from Akrion includes drying capability. The tool integrates a dryer, eliminating the need to move PFA cassettes from the wet process tanks to a stand-alone dryer. The new system reduces cycle times, increases safety, and avoids the risk of contamination from airborne particles. Used in IC and MEMS applications, the unit processes devices with 0.18–0.5-µm feature sizes. A typical unit is 1.5 m long and can be used for a variety of cleaning and etching applications. It is available in several single- and dual-robot configurations. Information: droberts@akrion.com.

Rudolph Technologies has updated its MetaPULSE and MetaPULSE-II opaque film metrology systems. The enhanced tools incorporate the Expert Application System (EASy), knowledge-based software that performs complex in-line signal processing. EASy makes it possible to perform process control metrology for copper, low-k, and other processes at the 90-nm node and beyond. The software enables automatic measurements in electroplate edge profiling, post-CMP copper/barrier, and copper/interlevel dielectric applications. Information: jclerico@rudolphtech.com.

A catalog from Animatics showcases SmartMotors, which combine a brushless dc servomotor, controller, and amplifier in one package. Capable of performing multiaxis control using industry-standard networking, the motors can move in coordinated motion, eliminating the need for enclosures, cables, and connections. The 48-page guide features the SM3416D SmartMotor and the DeviceNet and ProfiBus options. Information: response@animatics.com.

Nikon's NSR-SF130 scan-field i-line stepper has higher throughput than that of its predecessor, the NSR-SF120. The updated model has a throughput of 120 wafers/hr for 300-mm wafers at a resolution of 280 nm or better. The system's lens technology produces the same wide-exposure field as that of DUV scanners (26 X 33 mm). The tool is for use in processing subcritical layers in DRAMs and microprocessors. Information: sbernardi@nikon.com.

SABRE NExT, an enhanced model of the SABRE electrofill system from Novellus Systems, offers new chemistry, process, and hardware features. For use in sub-90-nm interconnect applications, the tool uses a single-step chemistry that provides reproducible fill at advanced nodes, with low defect levels and excellent profile for CMP. An anode cell design reduces contaminant levels in the plating bath, while reducing chemical consumption. The system can be configured with a remote bath, enabling production and development on the same tool. Information: bob.climo@novellus.com.