E-Beam Inspection Tool

The FS3000 EB-Scope is an E-beam inspection and metrology tool that detects yield-limiting nonvisual defects. The system combines electron-beam irradiation techniques with a mechanism for measuring pico-level substrate current flows, enabling IC manufacturers to make nonvisual defects visible by measuring substrate currents rather than secondary electrons. The technology relies on quantitative measurements rather than qualitative assessments, improving feedback. The instrument enables users to inspect high-aspect-ratio contact and via structures and detect failures such as residual oxide resulting from underetch, breakthrough of the etch-stop layer caused by overetch, and residual polymer from poor cleans.

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X-Ray Diffraction Tool

An enlarged version of the X'Pert PRO MRD system, the X'Pert PRO MRD XL meets the high-resolution x-ray diffraction (XRD) analysis requirements of the semiconductor, thin-film, and advanced materials industries. The tool can completely map wafers up to 200 mm and enhances the mapping of wafers up to 300 mm. It has an automatic wafer loader option that enables it to function as an in-wall system in which the wafer is loaded from a cleanroom environment and placed onto a self centering wafer holder. The instrument is equipped with PreFIX, which enables the fast and flexible exchange of diffractometers, including optical modules indispensable for advanced materials research. PreFIX eliminates the need for realignment when switching from one kind of analysis method to another.

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Laser Rotary Encoder

The M1-H is a heavy-duty 10,000-rpm system encoder for use in factory automation, manufacturing, and robotics applications. Weighing 260 g, the encoder features a balanced-line driver output circuit that allows long-distance signal transmissions. Its 780-nm semiconductor laser offers output power of 5 mW; it has a signal error within 25 arc-sec. The unit's maximum frequency response is 8.3 MHz, and its signal output is analog. It has a vibration rating of <10 G, 500 Hz, and a shock rating of 60 G, <11 msec. The encoder's operating temperature is 0°­70°C.

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Annealing System

The Flash-300 annealing system, for use in high-performance memory and microprocessor devices applications, forms ultrashallow transistor junctions of 15 nm or less. The system's single process chamber uses rapid thermal processing flash technology to activate ion-implanted dopants. It anneals and electrically activates implanted dopant species such as boron, BF₂, arsenic, and phosphorus, achieving diffusion-free dopant activation. Addressing the limitations of conventional tungsten lamps, spike annealing, and laser-based systems, the tool heats the wafer uniformly during exposure times ranging from tenths of a millisecond to several milliseconds. Through a controlled lamp discharge, a Soft-Flash anneal is provided that lowers thermal stress and enables tailored recrystallization of the implant layer and junction abruptness. Process flexibility is achieved through control of ultraviolet energy, its rate of delivery to the wafer, and wafer preheating.

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Automated In-Line SEM/FIB System

The Applied SEMVision G2 FIB defect analysis system integrates defect review scanning electron microscopy (SEM) with focused ion beam (FIB) cross-sectioning and energy-dispersive x-ray analysis (EDX). With its ClearCut review and analysis methodology, the system performs high-speed, high-resolution automatic SEM review followed by FIB analysis of defects in minutes. Traditionally, the SEM and FIB components of dual systems have pointed at the same location on the wafer in a cross-beam configuration, which limits SEM performance. In contrast, the SEM and FIB in the SEMVision are parallel to each other, enabling shorter working distances. The tool uses several imaging technologies , including multiperspective SEM imaging, voltage contrast, and high-aspect-ratio imaging, and it performs materials analysis.

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Tantalum Sputtering Targets

Cabot Supermetals

Columbus, OH

Tantalum sputtering targets are available for all leading physical vapor deposition (PVD) systems. The tantalum material is offered with purity levels ranging from 3N5 to 5N and a low oxygen content. The targets have a small grain size and uniform metallurgy for high process consistency. Assemblies feature a proprietary high-strength bond for maximum throughput.

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Photolithography Control

The AutoCal Dynamic Correction Engine performs control functions in photolithography track systems. The system tunes multizone or multicontroller postexposure bake (PEB) hot plates to provide a uniform thermal dose profile. It automatically dials in the mean steady-state temperature and reduces the overall temperature spread across the wafer. As a result, within-plate thermal uniformities can be optimized. Plate-to-plate and track-to-track matching of PEB plates can be achieved routinely, improving CD uniformity in the fab. The system works in conjunction with BakeTemp sensor wafers to obtain an accurate baseline picture of the process zone. It uploads BakeTemp data along with an OEM plate-specific thermal model to derive hot-plate control parameters and achieve thermal dose uniformity.

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HEPA-, ULPA-Filtered Vacuums

Used for cleaning sensitive manufacturing tools and other cleanroom equipment, Omega cleanroom vacuums are equipped with a true HEPA cartridge filter or an optional ULPA cartridge filter. The vacuums have a 10-ft ESD-safe hose and a 16-in. ESD-safe rubber flexible gooseneck. Using the standard non-ESD-safe 5.5-in. utility brush, larger areas such as floors, raised floors, and tabletops can be cleaned. In addition, the vacuums are filtered for electromagnetic interference and radio-frequency interference. An optional accessory kit includes two 20-in. straight wands, an 11-in. curved neck, a 10-in. rough-floor wand, a 10-in. floor wand, and a caddy.

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Closed-Loop Ionizer Controller

A closed-loop ionizer controller controls a multifan single ionizer (with two or three fans) or multiple single-fan ionizers. The Series 3350 controller provides digital output communica- tion and multiple digital I/O and auxiliary communication ports to report all alarm conditions directly to the process environment monitoring system or any other forms management system. The instrument can be powered either by the ionizer it is interfaced with or by an optional external power supply. The digital platform features microprocessor control, address identification, and programmable alarm level setpoints.

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Cryogenic Filters

High-resolution, low-pressure-drop cryogenic filters offer fast transfer with low flash-loss levels. The filters feature all-stainless-steel construction and sintered stainless-steel-fiber media, providing a durable, cleanable, reusable product with high porosity, permeability, and dirt-holding capabilities. They are available in various configurations and filtration ranges, with or without vacuum jacketing. Sizes range from 1/2 through 4 in. Standard models are available for cryogenic and high-purity semiconductor applications. Custom filters can be configured to meet customer needs.

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STI Slurry

A slurry for use in direct shallow- trench-isolation (STI) applications, Celexis is a high-selectivity, low-defectivity product with excellent planarization and clearing properties. At the same time, it delivers silicalike defectivity, enabling customers to meet future STI dishing and erosion targets and promoting higher yields. A one-step replacement for multiple-step reverse-mask processes, the slurry performs well and has a low cost of ownership. It features the NanoArc Synthesis cerium oxide (ceria) particle from Nanophase Technologies.

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Microwave Power Supply

A microwave power supply simplifies the ignition of microwave plasmas in etching and cleaning applications. The PM740T can pulse a controlled current to a microwave-emitting magnetron. The pulse quality stimulates a plasma at lower temperatures and imparts higher energy to the plasma particles. The lower plasma temperature enable users to work with materials that have a low melting point while the higher energy particles can speed up the chemical reaction. The overall result is a microwave plasma that is less destructive and has a faster reaction time than related plasmas. The compact, rack-mounted unit can drive the magnetron at various power levels up to 2 kW continuous wave or 8 kW in pulsed mode.

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High-Purity Ozone Generators

Series OG-5000 ozone generators produce high-purity ozone gas at very high concentrations. The systems are used in chemical vapor deposition, atomic layer deposition, oxide growth, surface conditioning, ashing, wet processing, particle cleaning, photoresist removal, and epitaxy applications. Ozone gas is generated in the unit through controlled electrical discharge. The addition of parts-per-million levels of a doping or spiking gas increases ozone production, ensuring concentration stability over time. The compact generators are available as stand-alone systems or as a part of a complete turnkey integrated ozone gas or DIO₃ water-delivery system.

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A production-level MRAM magnetic annealing tool for 200-mm wafers enables users to process up to 50 wafers per batch, with a throughput of 10 wafers per hour. Manufactured in conjunction with JASTEC, the tool contains a superconducting magnet rather than a permanent magnet, making it scalable to 300 mm. The tool also features a patent-pending cooling mechanism that helps increase throughput by reducing cooling time. The annealing process is fully automated. After one or two cassettes of up to 25 wafers each are loaded, the wafers are moved to a vacuum process chamber that has been heated to a maximum of 400°C. The wafers can be rotated 360° to provide proper orientation in the magnetic field.

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The P-9801 optometer provides high-speed, eight-channel parallel signal processing for a range of radiometric/photometric/colorimetric applications requiring fast multiple detection capability. The meter forms the basis of a computer-controlled central monitoring station for UV or visible light measurement for quality control purposes to ensure that products to be exposed are irradiated at the correct dose. Readings of up to eight detectors are displayed simultaneously with a slew rate between 2 and 10 milliseconds. Automated data processing and remote control operation are possible. Operation modes include continuous wave or pulse, peak, relative %, reference, manual or autorange, datalogger, ratio, dose, color chromaticity values, and color temperature.

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Aeronex SK hydride purification media purify gases such as ammonia, arsine, phosphine, germane, and silane. For example, the media remove moisture in ammonia to <1 ppb. Although iron is commonly used to purify hydride gases and removes oxygen effectively, it can lead to the release of low levels of carbon monoxide when used in certain hydride gases. SK products are the first iron-free media developed for the purification of hydride gases. They have improved capacity for moisture and oxygen, can eliminate potential CO release, and offer improved efficiency, as validated in actual process gases.

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The Model 5225 ionization unit featuring an integrated control system is for use in semiconductor and flat-panel process tools. Software running on the equipment's controller provides complete access to ionization parameters, monitors and modifies ionization performance in real time, and enables process recipe control. In addition, the software enables users to perform predictive maintenance, closed-loop control, and e-diagnostics. The core of the technology is an interface module, which contains a 32-bit microprocessor that runs software for both process equipment communications and ionization control. The system communicates with an array of host computers, including process-tool controllers, facility-monitoring systems, and cell controllers.

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Constructed with a heavy-gauge, stainless-steel outer shell and a stainless-steel divider between each compartment, the Series-19 desiccator and inert-atmosphere cabinet is suitable for heavy storage loads. Each compartment is sealed to provide a pressurized dry or nitrogen environment for storing parts, while the stainless steel provides a conductive surface to help dissipate static charge. Unlike completely acrylic units, the durable cabinet will not crack or break apart at the seams. The compartments feature gasketted, clear acyclic doors with cam-action door latches.