Large-Area
Stepper
Azores
Wilmington,
MA
The
Model 5200 PanelPrinter system performs advanced photolithography
for large-area substrate applications that require 0.8–4-µm
resolution. Fully integrated subsystems include a high-fidelity
projection lens and illumination system, a precision x-y stage,
an automated substrate-alignment system, and an automated reticle-handling
and -storage system. The system features a variety of lenses to
meet the needs of active-matrix LCD, FED, OLED, polysilicon, and
high-density interconnect applications. It also offers real-time
magnification adjustment via a six-degrees-of-freedom reticle chuck
for accurate layer-to-layer registration and autofocus measurement
and compensation. Metrology sensors used to calibrate and optimize
the system perform transmission alignment, modulation transfer,
illumination intensity, and reflective alignment functions.
FOUP
Cleaner
Entegris
Chaska,
MN
A
system for cleaning front-opening unified pods (FOUPs) reduces contamination
from human contact. The Process One FX30 cleaning system resides
in an individual cleanroom environment to prevent contamination
and has robotic controls that transport FOUPs through the cleaning
process. It helps semiconductor manufacturers to reduce overall
operating costs by offering high throughput, reliability, and low
utility consumption. The unit is designed to clean and dry the company's
FOUPs and front-opening shipping boxes (FOSBs). It isolates the
cleaning media used inside the FOUPs and FOSBs from the cleaning
media used outside, preventing cross-contamination. (Semicon
Europa, Booth B1.118)
Micromachining
System
New
Wave Research
Fremont,
CA
MicroMill,
a high-precision micromachining system, combines submicron stage
resolution and positional accuracy with high-magnification viewing
of the work piece. The instrument micromachines MEMS, semiconductors,
and other materials. It enables operators to draw precise patterns,
cuts, characters, and holes on-screen and view the work- piece throughout
the process. The tool's stage resolution on three axes allows users
to micromachine over 2 in. in all directions. The system features
an automated height gauge that determines the thickness, contour,
and slope of the workpiece. Its high-resolution stereomicroscope
and color CCD video camera ensure close-up viewing and on-line image
digitization. The instrument comes complete with a computer, flat-screen
monitor, and Windows XP–based software with GUI controls.
Substrate
Etch Tool
SEZ
Villach,
Austria
A
substrate etch tool performs wafer-thinning, surface-conditioning,
and stress-relief processes for front-end wafer manufacturing and
back-end assembly/packaging applications. The Galileo GL-210 spin
processor is used to optimize the surface of the bare wafer before
device patterning. The tool is for use with traditional silicon,
silicon-on-insulator, gallium arsenide, and other compound semiconductor
materials. Such materials require surface conditioning and stress
relief because they tend to be thinner and more susceptible to mishandling,
warping, bowing, and breakage than epitaxial silicon wafers. The
tool removes imperfections caused by mechanical grinding while improving
die/wafer strength, electrical characteristics, metal adhesion,
and uniformity. It etches the wafer in one multilevel process chamber
using a customizable combination of nitrogen, DI water, and chemicals
that can be either drained or recycled. (Semicon Europa,
Booth B1.122)
Nonstandard
Thermocouple
Watlow
St.
Louis
Watcouple,
a nonstandard thermocouple, provides more-accurate measurements
and exhibits three times less drift than type-K thermocouples, resulting
in a longer-lasting sensor. Compared with traditional thermocouples,
which are designed primarily for linearity and made of complicated
alloys that compromise accuracy, stability, and longevity, the Watcouple
uses alloy 600 and nickel-silicon. Based on IEEE 1451.4 smart-sensor
technology, it automatically communicates its individual voltage
table, calibration, manufacturing, and traceability information.
(Semicon Europa, Booth B2.554)
Dry
Strip Platform
Axcelis
Beverly,
MA
The
RapidStrip 320 resist and polymer removal systems use downstream
microwave plasma generation and chuck-based wafer heating to provide
an effective dry strip process. Small process vacuum chambers enable
high ash rates and excellent process repeatability. The small-footprint
tools are available in single- and dual-chamber configurations.
Available in 200- and 300-mm versions, the systems are based on
a simple design that reduces cost of ownership and improves productivity
in front-end-of-line process applications. (Semicon Europa,
Booth B2.200)
E-Beam
Litho Modeling Software
Sigma-C
Munich,
Germany
E-beam
lithography simulation software is used to optimize maskmaking and
direct-write applications. Selid version 3.3 software models the
entire E-beam lithography process in three dimensions. Using the
software, photomask producers and IC manufacturers can develop and
optimize processes for reticle writing, direct-write on wafers,
and other E-beam lithography applications. It can reduce cycle times
and development costs because users can run hundreds of virtual
wafers or masks overnight without using production resources. The
software provides fast, comprehensive modeling techniques, such
as the Monte Carlo method for simulating E-beam scattering, and
can model the use of advanced chemically amplified resists. Additionally,
it enables users to view their results and determine the effectiveness
of different process steps by providing energy density as well as
latent and resist images.
HEPA
and ULPA Filters
Airguard
Louisville,
KY
Microguard
99 filters for use in semiconductor and other environments are available
in 99.97%, 99.99%, and 99.999% efficiency models at the 0.3-µm
particle-size level. Standard- and high-capacity filters are available.
A wide variety of cell side materials is offered, including wood,
steel, and aluminum. The filter media are made of wet-laid paper
produced from micro- glass fibers. The paper is waterproof and heat-resistant
to 1000°F. A channel design optimizes the media surface area
and reduces the possibility of damage during handling. Corrugated
aluminum separators enable the maximum use of the media and high
filter-pack integrity.
RF
Delivery System
Advanced
Energy Industries
Fort
Collins, CO
The
3-kW Apex RF delivery system for thin-film processes provides high
power density and power delivery consistency. The compact, half-rack
unit employs RF-conversion technology, eliminating the need for
front-end dc-to-dc conversion components and thus increasing cost
effectiveness. An optional internal match network reduces extraneous
equipment. The modular unit's delivery system can be customized
to suit specific processes. Users are offered a range of preferences
such as input voltage and on-board RF-connector location. (Semicon
Europa, Booth B1.608)
Gasket
Filter
Mott
Farmington,
CT
A
filtration product that can be installed with virtually no design
change to existing gas-delivery systems protects particle-sensitive
gas control components such as regulators and mass-flow controllers
without adding length to the gas panel or gas stick. The GasShield
gasket filter is compatible with inert and specialty gases, providing
precise filtration in gas flows as low as 1 std L/min. Available
in patented NanoMetal nickel media, the filter fits inside 1/4-in.
face seal fittings. It provides true 0.003-µm filtration (>99.9999999%
particle removal efficiency measured at the most penetrating particle
size). It is recommended for applications with temperatures up to
450°C (for inert gases) and a maximum differential pressure
of 1000 psid (at 20°C).
High-Purity
Pressure Sensor
Setra
Systems
Boxborough,
MA
The
Model 227 pressure transducer is for use in modular gas-delivery
systems or panels to monitor specialty gas processes in high-purity
applications. Based on variable-capacitance sensing technology,
the compact, lightweight unit offers excellent zero stability and
long-term reliability. It has a 1.125-in. down-mount C Seal pressure
fitting and small swept sensor chamber made from VAR 316L stainless
steel that is electropolished to a 5-Ra finish for contaminant-free
operation and system-purging capability. Every sensor undergoes
mass spectrometry helium leak testing to 1 X 10–9
atm.cc/sec. The sensor is available with 5-V dc, 10-V dc, or 4 to
20-mA output with 0.25% of full-scale or 1.0% of reading accuracy.
It offers pressure ranges from 0–25 psi to 0–3000 psi
in gauge, absolute, or compound pressure. (Semicon Europa,
Booth B1.749)
Particle-Detection
System
Dr.
Schenk
Planegg/Martinsried,
Germany
The
Pollux automated particle-detection system enables fabs to perform
complete inspection of all masks and reticles before they are used.
More cost-effective and reliable than performing visual inspection,
the system can be integrated into bare-reticle stockers, wafer steppers,
and cleaning stations. It can also function as a stand-alone unit.
The system inspects the glass side and pellicle side of the mask
simultaneously and can detect imperfections down to a 10-µm
equivalent sphere diameter. It detects particulate contamination
and defects such as glass scratches and holes in the pellicle. The
small-footprint, high-speed system enables fabs to make pass/fail
decisions about photomasks. (Semicon Europa, Booth B2.484)
Postash-Residue
Remover
Mallinckrodt
Baker
Phillipsburg,
NJ
Baker
Rezi-68 postash-residue remover eliminates metal-organic residues
and sidewall polymers from metal and via structures. It operates
at temperatures ranging from 20° to 45°C and can extend
processing times to more than 24 hours. It is compatible with low-k
dielectrics and can be used to remove both aluminum- and copper-based
residues. The postash-residue remover is >80% water, making it
safer to use and less expensive to dispose of than hydroxylamine-based
chemistries. (Semicon Europa, Booth B1.639)
Ultrastiff
Platforms
Technical
Manufacturing
Peabody,
MA
An
ultrastiff platform for photolithography scanners and other fab
equipment, TechCast combines a proprietary laminated-steel plate
with a high-strength resin-aggregate core. The cleanroom-compatible
platform can be drilled and tapped. Custom cutouts and notches are
available. Engineered in cooperation with semiconductor toolmakers,
the platform is designed to exceed the stiffness of the fab floors
to which it is mounted and can be moved as fab requirements change.
It can be combined with the company's support stands to accommodate
any floor height. The stands are compatible with a variety of subfloor
geometries and popout patterns.
Wet
Process Tool
AP&S
Donaueschingen,
Germany
The
TwinStep wet process tool combines two process stations: a flow-optimized
immersion bath for circulation processing and an overflow processing
system. In contrast to manual benches, the system offers controlled
processing, from automated chemical mixing to processing to service
functions. A flexible tool architecture offers a broad range of
configurations that are suitable for photoresist strip, metal and
oxide etch, and cleaning processes. Optimized process baths for
wafers of different sizes help keep chemical consumption low. The
unit's AeroSonic drying technology can be enlarged to perform chemical
treatment, rinsing, and drying in one bath. The unit is for use
in MEMS, gallium arsenide, and other applications. (Semicon
Europa, Booth B2.528)
Flex
Cable Heaters
Durex
Cary,
IL
Flexible,
high-watt electric cable heaters are used in semiconductor manufacturing
and other processes. The heaters have a sealed leadwire transition
that eliminates contamination, while achieving operating temperatures
to 1500°F. An optional internal thermocouple can be placed
at various points for precise temperature control. The cable heaters
are offered with customized wattage and voltage. Sheath materials
include 304 stainless steel, 316 stainless steel, Inconel, and Incoloy.
Standard sheath cross sections range from 0.062 to 0.375 in. in
diameter. Leadwires can be made of PTFE or encased in fiberglass
sleeve, stainless-steel flex cable, or stainless-steel overbraid.
Turbomolecular
Pumps
BOC
Edwards
Wilmington,
MA
STP-XH
magnetic-bearing turbo pumps feature state-of-the-art turbine designs
that maximize helium and hydrogen pumping speed, thereby increasing
throughput without sacrificing the pump's ability to handle heavier
gases such as argon or nitrogen. The pump can be used in shallow-trench-isolation
applications using high-density plasma/chemical vapor deposition.
In etch applications, the pump enhances process quality by reducing
partial pressures of hydrogen, a by-product of plasma decomposition.
Data-Access
Software
Cimetrix
Salt
Lake City, UT
CIMPortal,
an EDA+ software tool, enables fab-level access to critical equipment
data such as SECS/GEM data, high-speed OEM and fab add-on sensor
data, historical data, full tool-level software-version control
data, and configuration data gathered from OEM suppliers. Without
programming, the software can access all GEM data from a 200- or
300-mm tool via an EDA+ secure port.With programming, it can be
configured to collect sensor data directly from OEM tools and allows
add-on sensor bus information to be shared over one synchronized
data-collection plan (DCP) or multiple DCPs. The software has a
powerful data historian, which enables high-speed logging and data-mining
via EDA. (Semicon Europa, Booth B2.634)
Air-Filtration
System
Donaldson
Minneapolis,
MN
A
gas-phase molecular contamination filtration system supplies high-purity
air to IC process tools. The small-footprint Lithoguard-16 has chemical
filter inserts that can be configured to minimize contaminant breakthrough
and maximize overall media utilization. The system controls airborne
contamination, which increasingly degrades expensive optical elements
and adversely affects critical chemical processes. The chemical
media target acidic and basic gases, and volatile organic compounds.
The media's removal capacity can be adjusted for each target depending
on actual process conditions. The company offers chemical-filter
refurbishment and used-filter analysis programs. (Semicon
Europa, Booth B2.211)