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Equipment
Control System
Siemens
Automation and Drives
Nuremberg,
Germany
The
Simatic equipment control system (ECS) configures, starts up,
operates, and monitors semiconductor cluster tools. The system
includes hardware and software for planning, automation, start-up,
and operation. It controls the progression of the wafer through
the process chambers and simplifies changes in the individual
chambers and the existing systems. The core of ECS is the WinCC
tool control software package, which is in compliance with semiconductor
standards. The software implements control functions and performs
order management as well as batch and program management. WinCC
arranges tool modules, components, and equipment units in a
hierarchical tree structure. The tool is configured by dragging
and dropping library elements into the worksheet. WinCC automatically
generates the hardware configuration, the graphical interface,
and system and alarm messages according to input parameters.
(Semicon West, S.F., South Hall, Booth 2141)
Air
Diaphragm Valve
Asahi
America
Malden,
MA
The
HDV-series air diaphragm valve is a compact unit constructed
from rugged PVC. Featuring a PTFE diaphragm, the valve is for
use in skid-mounted water and chemical distribution systems.
Its compact design allows for easy installation in areas where
space is limited. Based on a novel diaphragm design, the air-operated
valve provides a high flow coefficient (Cv). During testing,
the unit had operated for more than 2 million cycles. It is
available in 12-
to 2-in. versions and is fitted with true union ends. (Semicon
West, S.F., South Hall, Booths 120, 121)
Diamond
CMP Pad Conditioners
Abrasive
Technology
Lewis
Center, OH
An
extension of the Infinity line of diamond CMP pad conditioners,
the Infinity v6.1 disk offers the highest-strength synthetic
diamond. The conditioner's diamond concentration has been optimized
to achieve a bond strength improvement of more than 80% and
a disk life improvement of more than 60% over the standard Infinity
product. The v6.1 pad conditioner features the PBS process,
which permanently bonds diamonds to the stainless-steel substrate.
That process delivers an excellent combination of bond strength
and diamond exposure to provide consistent pad conditioning
through the life of the disk. The pad conditioner is available
in production quantities and is manufactured in the company's
ISO 9001:2000–certified facility.
Atomic-Force
Line Monitor
KLA-Tencor
San
Jose, CA
The
AF-LM 300 atomic-force line monitor measures the depth and surface
planarity of critical front-end structures at the 90- and 65-nm
nodes and below. The tool provides direct, non-destructive,
within-die measurements at production-level throughputs. Key
features include an automated tip exchange for improved ease
of use, an advanced pattern-recognition system based on the
company's production-proven Archer 10 overlay metrology platform,
and proprietary image-enhancement algorithms for improved in-line
statistical control of trench depths. (Semicon West, S.F., South
Hall, Booth 426)
Dry/Wet
Lithography System
ASML
Veldhoven,
The Netherlands
The
newest member of the Twinscan platform, the Twinscan XT:1400,
is a 0.93-NA, 193-nm scanner that images at the 65-nm node in
volume production environments and can also be used for preproduction
testing and development at the 45-nm node. Its design will allow
users to shift from dry to immersion lithography on the fab
floor through an immersion-conversion kit that will be available
at the end of 2005. The unit will enable users to include immersion
lithography in their technology roadmaps while performing dry
manufacturing at the 193-nm node. The immersion-conversion kit
has three main components: a lens that is suitable for immersion
use, immersion-compatible wafer stages, and immersion infrastructure.
Conversion from a dry to a wet platform will be achievable in
weeks and will increase system performance. The tool is equipped
with Ultra-k1, hardware and software imaging-enhancement
technologies that make it possible to shrink circuit features
and achieve high die yields. (Semicon West, S.F., Esplanade,
Booth M-IA; South Hall, Booth 2226)
X-Ray
Metrology Tool
Bede
Durham,
UK
A
research and process-development tool offers full mapping capability
for all semiconductor wafers from 50 to 300 mm. The BedeMetrix-L
x-ray metrology tool can be used to determine a range of wafer
characteristics, including porosity size and distribution; epilayer
composition, thickness, grading, and relaxation; wafer orientation;
thickness, roughness, and density of thin films, gallium arsenide,
indium phosphide, and gallium nitride epitaxial device structures;
and crystalline defects. The multipurpose tool performs several
x-ray techniques: high-resolution x-ray diffraction, high-resolution
x-ray reflectivity, powder diffraction, and x-ray topography.
It also performs stress, strain, and texture measurements. The
automated unit enables users to change between applications
simply and rapidly. (Semicon West, S.F., North Hall, Booth 6286)
PVD
Cluster Tool
Singulus
Technologies
Kahl,
Germany
A
PVD cluster tool that achieves high 300-mm uniformity, thickness
control, surface texture, throughput, and cost of ownership,
Timaris is a thin-film sputtering system for fabricating barrier
layers critical to MRAM and TMR applications. The tool offers
barrier repeatability and control down to 0.1 Å of aluminum
and generates low levels of particles. With a throughput of
18 wafers/hr and a 12,000-wafer throughput between maintenance
cycles, the tool permits fast and convenient target change and
rapid vacuum recovery after maintenance. Each module can be
configured for 200- or 300-mm wafers. There are up to two deposition
modules per system and 10 cathodes per module. (Semicon West,
S.F., North Hall, Booth 6684)
Ozonated-Water
Delivery System
MKS
Instruments
Wilmington,
MA
The
Liquozon Single ozonated-water (DIO3 water) delivery
system is the newest in a series of ultrapure ozonated water
generators. Designed to supply DIO3 water to single-wafer
cleaning tools, the compact and self-contained unit provides
ultrapure DIO3 with a high and accurate ozone concentration
at a constant delivery pressure. The unit delivers DIO3
water with ozone concentrations between 5 and 55 ppm at flow
rates between 0.5 and 20 L/min and at a pressure of up to 2.5
bar. The instrument, which measures 40 X 50 X 120 cm, contains
an ozone-gas generator, an ozone contactor, a dissolved-ozone
analyzer, and an ozone-gas destruct unit. (Semicon West, S.F.,
South Hall, Booth 1716)
High-Purity
Arsine
Air
Products and Chemicals
Allentown,
PA
Megabit
III arsine is the highest grade of arsine on the market. High-purity
arsine is essential to grow epitaxial films with a low background
doping concentration using the metal-organic chemical vapor
deposition process. In contrast to typical dopant concentration
requirements of 5 X 1014 charge carriers/cm3,
Megabit III arsine has a background doping concentration in
gallium arsenide of <1014 charge carriers/cm3,
making it suitable for use in new processes that manufacture
more-sophisticated devices. The high-purity arsine meets the
changing demands of compound semiconductor fabrication. (Semicon
West, S.F., North Hall, Booth 5568)
HEPA
Filter
Camfil
Farr
Riverdale,
NJ
A
HEPA filter is guaranteed to maintain an efficiency of 99.99%
at 0.3 µm at operating temperatures up to 650°F. For
use in semiconductor fabrication, the Termikfil filter has a
floating design that allows for filter expansion and contraction
under intense heat. High-temperature, microfine glass media
provide uniform performance throughout the life of the filter.
The enclosing frame is made of ceramic-based materials to withstand
high temperatures and resist degradation as the filter pack
expands and contracts.
Single-Wafer
Cleaner
Goldfinger
Technologies (Akrion)
Santa
Ana, CA
The
four-chamber, single-wafer Goldfinger Mach2HP cleaning system
is for use in FEOL and BEOL cleaning applications. The production-ready,
flexible tool is suitable for a wide variety of wafer-surface-preparation
applications. In FEOL applications, it can be used to perform
postash, postdeposition, and other particle cleans. In BEOL
applications, it performs postash/etch processes on aluminum
and copper integrated devices. The tool's megasonics remove
particles without etching, making it suitable for cleaning sensitive
structures. An integrated Sahara dry technology provides watermark-free
surface-tension-gradient drying. A true 200/300-mm bridge tool,
it has chambers that allow for a 2-mm edge exclusion and that
have integrated splash guards and bowl seals. The system uses
standard RCA chemicals and BEOL semiaqueous solvents. (Semicon
West, S.F., North Hall, Booth 5420)
300-mm
Wafer/Carrier Handler
H-Square
Sunnyvale,
CA
The
TS3 300-mm Trouble Station aids in common 300-mm wafer- and
carrier-handling applications. The toolset is suitable for wafer-rescue
applications but can also serve as an alternative to expensive
sorting platforms. The set consists of an automatic FOUP opener,
an automatic low-contact wafer-transfer machine, and a portable
vacuum wand. The automatic FOUP opener removes and secures the
FOUP door at the touch of a button. Once the door is removed,
the FOUP can be rotated 180° to allow easy access and wafer
removal or transfer. The transfer machine can be used to move
masses of wafers among combinations of FOUPs or FOSBs. The toolset
includes a wafer mapper to ensure wafer safety. (Semicon West,
S.F., North Hall, Booth 5761; S.J., McEnery Hall, Booth 11318)
Real-Time
Factory Cost Model
M+W
Zander
Stuttgart,
Germany
A
digital real-time factory model for semiconductor manufacturing
captures both structured and unstructured data from the systems
involved in production. To keep manufacturing data manageable,
the system employs information logistics to ensure that users
get the facts and figures they require, aided by data-filtering
mechanisms. Another product, a life-cycle cost model, allows
manufacturers to accurately calculate the total cost of fab
operations based on the relationship between the manufacturing
unit and upstream technical departments. Costs can be monitored
throughout the entire production life cycle, enabling users
to implement technology or market-driven changes rapidly. In
addition, accurate insight into cost drivers allows fabs to
reduce the consumption of materials and energy.
DC
Plasma Power Supply
Hüttinger
Elektronik
Freiburg,
Germany
Equipped
with ARCtelligent, the Scalo dc plasma power supply manages
arcs quickly and effectively. Relying on a very minimal reserve
of energy, the system enables the deposition of defect-free
layers and thus is economical to use. The ARC recognition function
can be set via several ports. The unit's construction makes
it flexible in generating power. Modules can be supplemented
comfortably or removed to adapt the entire system to process
needs. A total power output ranging from 20 to 120 kW is achieved
in steps of 20 or 30 kW. The 20- or 30-kW modules are available
in water- or air-cooled versions. (Semicon West, S.F., South
Hall, Booth 737)
Flare
Connectors
EM-Technik
Maxdorf,
Germany
The
1D flare connectors, for use in the semiconductor industry,
include DN 1-in. flare connectors. A variety of models is available,
such as elbow and T unions, as well as a large selection of
space savers. Big flare connectors are offered in PVDF-HP, PFA-HP,
and inexpensive PP-natural, which guarantee high media resistance
even in the presence of aggressive media. A wide range of reducers
is also available. To meet the strict requirements of the IC
manufacturing industry, the connectors are cleaned, mounted,
controlled, and packed in a Class 100 cleanroom.
Decentralized
Control System
Bosch
Rexroth
Hoffman
Estates, IL
A
decentralized control system pushes as much intelligence as
possible down to the device level. In motion control, that concept
translates into handling all servo-loop monitoring and loop
calculations at the drive level. It also translates into calculating
trajectories at the single-axis level. With decentralized control,
each individual drive has its own processor. With the addition
of new drives, processor power scales up. Decentralized control
also allows for easier and faster diagnostics at the local device
level. Isolating diagnostics makes it possible to service tools
without stopping the entire production process. Moreover, the
system reduces the load on the central processor, requires minimal
cabling, and is reliable because feedback cables do not have
to be routed back to the central device. (Semicon West, S.F.,
South Hall, Booth 732; S.J., McEnery Hall, Booth 10934)
Cleanroom
Wipers
Kimberly-Clark
Roswell,
GA
KimTech
Pure critical-task wipers are for surface wiping in cleanrooms.
The line includes CL4 wipers, for use in Class 10 or higher
cleanrooms, and CL5 wipers, for use in Class 100 or higher cleanrooms.
The CL4 wipers are made from 100% meltblown polypropylene material.
Thermally bonded, they contain no glues or binders. Their straight,
clean, knife-cut edges help to minimize lint. The wipers are
resistant to acids, bases, and solvents. The line also includes
an alcohol wiper for one-step application of alcohol to critical
surfaces. The CL5 wipers are made from a continuous-filament
rayon/polyester spunlace blend. They do not contain binders
or surfactants and thus have low extractables. They have a high
water absorbency rate and excellent absorption efficiency and
capacity.
Ethernet/IP
Gateway
FieldServer
Technologies
Milpitas,
CA
A
gateway enables users to interface to Ethernet/IP devices from
a wide range of devices used in process control applications.
Examples of interfaces possible with the unit are DF1, DH+,
DNP, Controlnet, SNMP, Profibus, and Modbus devices. The gateway
is available in the single-port FS-B20-series version or the
multiport FS-B40-series version. Because it is a true protocol
translator and not simply a tunneling device, only one unit
is needed to link a device to Ethernet/IP. Any information available
through the communications port can be translated into the alternative
protocol. The unit can act as either a client or server. The
company offers a large device driver library with more than
70 different protocols and has experience in interfacing to
more than 350 different devices.
Front-End
Module
Newport
Irvine,
CA
The
Performix equipment front-end module (EFEM) features an automated
self-teach wafer-handling robot, patented technology that enables
the EFEM to be installed and operated without extensive operator
training. The module minimizes initial system setup time in
the tool-manufacturing environment and wafer fab during system
startup. The combination of the robot and an ADO load port and
prealigner enables the module to provide high throughput and
extended uptime. The EFEM forms an isolated minienvironment
between a process or metrology tool and a FOUP or SMIF wafer
carrier. The module is available in two-, three-, or four-port
configurations. The use of a repeatable precision datum-mounting
scheme for all major EFEM components facilitates alignment during
installation and reassembly after servicing. (Semicon West,
S.F., South Hall, Booth 438; S.J., McEnery Hall, Booth 10636)
Metrology
Tool
ReVera
Eden
Prairie, MN
Based
on x-ray photoelectron spectroscopy, the RVX 1000 metrology
system is a small-footprint turnkey system that simultaneously
performs multiple automated measurements, including film-thickness
and elemental concentration measurements in film. The tool incorporates
a configurable automation system, allowing customers to choose
the appropriate combination of 200- and 300-mm load ports to
meet their needs. A Windows user interface provides a wide range
of measurement outputs, which can be used to perform process
control or generate reports quickly. The unit has a >95%
availability record. It meets industry safety and export requirements
and supports factory-required host communications protocols
for automated production facilities.

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© 2007 Tom Cheyney
All rights reserved.
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