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Product Technology News

Equipment Control System

Siemens Automation and Drives

Nuremberg, Germany

The Simatic equipment control system (ECS) configures, starts up, operates, and monitors semiconductor cluster tools. The system includes hardware and software for planning, automation, start-up, and operation. It controls the progression of the wafer through the process chambers and simplifies changes in the individual chambers and the existing systems. The core of ECS is the WinCC tool control software package, which is in compliance with semiconductor standards. The software implements control functions and performs order management as well as batch and program management. WinCC arranges tool modules, components, and equipment units in a hierarchical tree structure. The tool is configured by dragging and dropping library elements into the worksheet. WinCC automatically generates the hardware configuration, the graphical interface, and system and alarm messages according to input parameters. (Semicon West, S.F., South Hall, Booth 2141)


Air Diaphragm Valve

Asahi America

Malden, MA

The HDV-series air diaphragm valve is a compact unit constructed from rugged PVC. Featuring a PTFE diaphragm, the valve is for use in skid-mounted water and chemical distribution systems. Its compact design allows for easy installation in areas where space is limited. Based on a novel diaphragm design, the air-operated valve provides a high flow coefficient (Cv). During testing, the unit had operated for more than 2 million cycles. It is available in 1Ž2- to 2-in. versions and is fitted with true union ends. (Semicon West, S.F., South Hall, Booths 120, 121)


Diamond CMP Pad Conditioners

Abrasive Technology

Lewis Center, OH

An extension of the Infinity line of diamond CMP pad conditioners, the Infinity v6.1 disk offers the highest-strength synthetic diamond. The conditioner's diamond concentration has been optimized to achieve a bond strength improvement of more than 80% and a disk life improvement of more than 60% over the standard Infinity product. The v6.1 pad conditioner features the PBS process, which permanently bonds diamonds to the stainless-steel substrate. That process delivers an excellent combination of bond strength and diamond exposure to provide consistent pad conditioning through the life of the disk. The pad conditioner is available in production quantities and is manufactured in the company's ISO 9001:2000–certified facility.


Atomic-Force Line Monitor

KLA-Tencor

San Jose, CA

The AF-LM 300 atomic-force line monitor measures the depth and surface planarity of critical front-end structures at the 90- and 65-nm nodes and below. The tool provides direct, non-destructive, within-die measurements at production-level throughputs. Key features include an automated tip exchange for improved ease of use, an advanced pattern-recognition system based on the company's production-proven Archer 10 overlay metrology platform, and proprietary image-enhancement algorithms for improved in-line statistical control of trench depths. (Semicon West, S.F., South Hall, Booth 426)


Dry/Wet Lithography System

ASML

Veldhoven, The Netherlands

The newest member of the Twinscan platform, the Twinscan XT:1400, is a 0.93-NA, 193-nm scanner that images at the 65-nm node in volume production environments and can also be used for preproduction testing and development at the 45-nm node. Its design will allow users to shift from dry to immersion lithography on the fab floor through an immersion-conversion kit that will be available at the end of 2005. The unit will enable users to include immersion lithography in their technology roadmaps while performing dry manufacturing at the 193-nm node. The immersion-conversion kit has three main components: a lens that is suitable for immersion use, immersion-compatible wafer stages, and immersion infrastructure. Conversion from a dry to a wet platform will be achievable in weeks and will increase system performance. The tool is equipped with Ultra-k1, hardware and software imaging-enhancement technologies that make it possible to shrink circuit features and achieve high die yields. (Semicon West, S.F., Esplanade, Booth M-IA; South Hall, Booth 2226)


X-Ray Metrology Tool

Bede

Durham, UK

A research and process-development tool offers full mapping capability for all semiconductor wafers from 50 to 300 mm. The BedeMetrix-L x-ray metrology tool can be used to determine a range of wafer characteristics, including porosity size and distribution; epilayer composition, thickness, grading, and relaxation; wafer orientation; thickness, roughness, and density of thin films, gallium arsenide, indium phosphide, and gallium nitride epitaxial device structures; and crystalline defects. The multipurpose tool performs several x-ray techniques: high-resolution x-ray diffraction, high-resolution x-ray reflectivity, powder diffraction, and x-ray topography. It also performs stress, strain, and texture measurements. The automated unit enables users to change between applications simply and rapidly. (Semicon West, S.F., North Hall, Booth 6286)


PVD Cluster Tool

Singulus Technologies

Kahl, Germany

A PVD cluster tool that achieves high 300-mm uniformity, thickness control, surface texture, throughput, and cost of ownership, Timaris is a thin-film sputtering system for fabricating barrier layers critical to MRAM and TMR applications. The tool offers barrier repeatability and control down to 0.1 Å of aluminum and generates low levels of particles. With a throughput of 18 wafers/hr and a 12,000-wafer throughput between maintenance cycles, the tool permits fast and convenient target change and rapid vacuum recovery after maintenance. Each module can be configured for 200- or 300-mm wafers. There are up to two deposition modules per system and 10 cathodes per module. (Semicon West, S.F., North Hall, Booth 6684)


Ozonated-Water Delivery System

MKS Instruments

Wilmington, MA

The Liquozon Single ozonated-water (DIO3 water) delivery system is the newest in a series of ultrapure ozonated water generators. Designed to supply DIO3 water to single-wafer cleaning tools, the compact and self-contained unit provides ultrapure DIO3 with a high and accurate ozone concentration at a constant delivery pressure. The unit delivers DIO3 water with ozone concentrations between 5 and 55 ppm at flow rates between 0.5 and 20 L/min and at a pressure of up to 2.5 bar. The instrument, which measures 40 X 50 X 120 cm, contains an ozone-gas generator, an ozone contactor, a dissolved-ozone analyzer, and an ozone-gas destruct unit. (Semicon West, S.F., South Hall, Booth 1716)


High-Purity Arsine

Air Products and Chemicals

Allentown, PA

Megabit III arsine is the highest grade of arsine on the market. High-purity arsine is essential to grow epitaxial films with a low background doping concentration using the metal-organic chemical vapor deposition process. In contrast to typical dopant concentration requirements of 5 X 1014 charge carriers/cm3, Megabit III arsine has a background doping concentration in gallium arsenide of <1014 charge carriers/cm3, making it suitable for use in new processes that manufacture more-sophisticated devices. The high-purity arsine meets the changing demands of compound semiconductor fabrication. (Semicon West, S.F., North Hall, Booth 5568)


HEPA Filter

Camfil Farr

Riverdale, NJ

A HEPA filter is guaranteed to maintain an efficiency of 99.99% at 0.3 µm at operating temperatures up to 650°F. For use in semiconductor fabrication, the Termikfil filter has a floating design that allows for filter expansion and contraction under intense heat. High-temperature, microfine glass media provide uniform performance throughout the life of the filter. The enclosing frame is made of ceramic-based materials to withstand high temperatures and resist degradation as the filter pack expands and contracts.


Single-Wafer Cleaner

Goldfinger Technologies (Akrion)

Santa Ana, CA

The four-chamber, single-wafer Goldfinger Mach2HP cleaning system is for use in FEOL and BEOL cleaning applications. The production-ready, flexible tool is suitable for a wide variety of wafer-surface-preparation applications. In FEOL applications, it can be used to perform postash, postdeposition, and other particle cleans. In BEOL applications, it performs postash/etch processes on aluminum and copper integrated devices. The tool's megasonics remove particles without etching, making it suitable for cleaning sensitive structures. An integrated Sahara dry technology provides watermark-free surface-tension-gradient drying. A true 200/300-mm bridge tool, it has chambers that allow for a 2-mm edge exclusion and that have integrated splash guards and bowl seals. The system uses standard RCA chemicals and BEOL semiaqueous solvents. (Semicon West, S.F., North Hall, Booth 5420)


300-mm Wafer/Carrier Handler

H-Square

Sunnyvale, CA

The TS3 300-mm Trouble Station aids in common 300-mm wafer- and carrier-handling applications. The toolset is suitable for wafer-rescue applications but can also serve as an alternative to expensive sorting platforms. The set consists of an automatic FOUP opener, an automatic low-contact wafer-transfer machine, and a portable vacuum wand. The automatic FOUP opener removes and secures the FOUP door at the touch of a button. Once the door is removed, the FOUP can be rotated 180° to allow easy access and wafer removal or transfer. The transfer machine can be used to move masses of wafers among combinations of FOUPs or FOSBs. The toolset includes a wafer mapper to ensure wafer safety. (Semicon West, S.F., North Hall, Booth 5761; S.J., McEnery Hall, Booth 11318)


Real-Time Factory Cost Model

M+W Zander

Stuttgart, Germany

A digital real-time factory model for semiconductor manufacturing captures both structured and unstructured data from the systems involved in production. To keep manufacturing data manageable, the system employs information logistics to ensure that users get the facts and figures they require, aided by data-filtering mechanisms. Another product, a life-cycle cost model, allows manufacturers to accurately calculate the total cost of fab operations based on the relationship between the manufacturing unit and upstream technical departments. Costs can be monitored throughout the entire production life cycle, enabling users to implement technology or market-driven changes rapidly. In addition, accurate insight into cost drivers allows fabs to reduce the consumption of materials and energy.


DC Plasma Power Supply

Hüttinger Elektronik

Freiburg, Germany

Equipped with ARCtelligent, the Scalo dc plasma power supply manages arcs quickly and effectively. Relying on a very minimal reserve of energy, the system enables the deposition of defect-free layers and thus is economical to use. The ARC recognition function can be set via several ports. The unit's construction makes it flexible in generating power. Modules can be supplemented comfortably or removed to adapt the entire system to process needs. A total power output ranging from 20 to 120 kW is achieved in steps of 20 or 30 kW. The 20- or 30-kW modules are available in water- or air-cooled versions. (Semicon West, S.F., South Hall, Booth 737)


Flare Connectors

EM-Technik

Maxdorf, Germany

The 1D flare connectors, for use in the semiconductor industry, include DN 1-in. flare connectors. A variety of models is available, such as elbow and T unions, as well as a large selection of space savers. Big flare connectors are offered in PVDF-HP, PFA-HP, and inexpensive PP-natural, which guarantee high media resistance even in the presence of aggressive media. A wide range of reducers is also available. To meet the strict requirements of the IC manufacturing industry, the connectors are cleaned, mounted, controlled, and packed in a Class 100 cleanroom.


Decentralized Control System

Bosch Rexroth

Hoffman Estates, IL

A decentralized control system pushes as much intelligence as possible down to the device level. In motion control, that concept translates into handling all servo-loop monitoring and loop calculations at the drive level. It also translates into calculating trajectories at the single-axis level. With decentralized control, each individual drive has its own processor. With the addition of new drives, processor power scales up. Decentralized control also allows for easier and faster diagnostics at the local device level. Isolating diagnostics makes it possible to service tools without stopping the entire production process. Moreover, the system reduces the load on the central processor, requires minimal cabling, and is reliable because feedback cables do not have to be routed back to the central device. (Semicon West, S.F., South Hall, Booth 732; S.J., McEnery Hall, Booth 10934)


Cleanroom Wipers

Kimberly-Clark

Roswell, GA

KimTech Pure critical-task wipers are for surface wiping in cleanrooms. The line includes CL4 wipers, for use in Class 10 or higher cleanrooms, and CL5 wipers, for use in Class 100 or higher cleanrooms. The CL4 wipers are made from 100% meltblown polypropylene material. Thermally bonded, they contain no glues or binders. Their straight, clean, knife-cut edges help to minimize lint. The wipers are resistant to acids, bases, and solvents. The line also includes an alcohol wiper for one-step application of alcohol to critical surfaces. The CL5 wipers are made from a continuous-filament rayon/polyester spunlace blend. They do not contain binders or surfactants and thus have low extractables. They have a high water absorbency rate and excellent absorption efficiency and capacity.


Ethernet/IP Gateway

FieldServer Technologies

Milpitas, CA

A gateway enables users to interface to Ethernet/IP devices from a wide range of devices used in process control applications. Examples of interfaces possible with the unit are DF1, DH+, DNP, Controlnet, SNMP, Profibus, and Modbus devices. The gateway is available in the single-port FS-B20-series version or the multiport FS-B40-series version. Because it is a true protocol translator and not simply a tunneling device, only one unit is needed to link a device to Ethernet/IP. Any information available through the communications port can be translated into the alternative protocol. The unit can act as either a client or server. The company offers a large device driver library with more than 70 different protocols and has experience in interfacing to more than 350 different devices.


Front-End Module

Newport

Irvine, CA

The Performix equipment front-end module (EFEM) features an automated self-teach wafer-handling robot, patented technology that enables the EFEM to be installed and operated without extensive operator training. The module minimizes initial system setup time in the tool-manufacturing environment and wafer fab during system startup. The combination of the robot and an ADO load port and prealigner enables the module to provide high throughput and extended uptime. The EFEM forms an isolated minienvironment between a process or metrology tool and a FOUP or SMIF wafer carrier. The module is available in two-, three-, or four-port configurations. The use of a repeatable precision datum-mounting scheme for all major EFEM components facilitates alignment during installation and reassembly after servicing. (Semicon West, S.F., South Hall, Booth 438; S.J., McEnery Hall, Booth 10636)


Metrology Tool

ReVera

Eden Prairie, MN

Based on x-ray photoelectron spectroscopy, the RVX 1000 metrology system is a small-footprint turnkey system that simultaneously performs multiple automated measurements, including film-thickness and elemental concentration measurements in film. The tool incorporates a configurable automation system, allowing customers to choose the appropriate combination of 200- and 300-mm load ports to meet their needs. A Windows user interface provides a wide range of measurement outputs, which can be used to perform process control or generate reports quickly. The unit has a >95% availability record. It meets industry safety and export requirements and supports factory-required host communications protocols for automated production facilities.

 


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