TECHNICAL PROGRAMS

Many technical and business programs and meetings are scheduled in conjunction with Semicon West. The following list contains selections of those offerings.

Monday, July 12–Tuesday, July 13

10 a.m.–noon, 2–5 p.m.
Moscone Center, San Francisco
Technology Innovation Showcase

The two-day event features innovative new products selected from applications submitted in response to a call for innovations. A committee of 10 high-profile technical experts chose presenters based on the impact that each innovation will have on the industry.

Monday July 12–Wednesday, July 14

9 a.m.–noon, 2–5 p.m. (July 12–13);
9 a.m.–noon (July 14)
S.F. Marriott Hotel

SEMI Technology Symposium: Innovations in Semiconductor Manufacturing (STS: ISM)

The STS: ISM draws innovators from around the world to present on significant technical advances of interest to materials and equipment users and suppliers. The papers and presenters for each session have been selected by a committee of experts in all aspects of front-end wafer processing. Technical sessions will feature papers that address practical solutions to real problems. Individual sessions will focus on strained silicon technology, advanced wafer processing, interconnect technology, planarization processes, in situ metrology, contamination-free manufacturing, MEMS technology, and EHS issues.

Monday, July 12
1–2 p.m.
Moscone Center, San Francisco, Emerging Technology Center, Esplanade Hall

"Meet the Industry Masters" Keynote Address

Paolo Gargini, Intel
8:30 a.m.–5:30 p.m.
S.F. Marriott Hotel

Polysilicon Surface Micromachine Technology and Devices

Robert W. Johnstone, School of Engineering Science, Simon Fraser University, BC, Canada

This course will introduce participants to the field of microelectromechanical systems (MEMS). Manufacturing technologies for MEMS devices and examples of sensor and actuator devices will be presented. The course focuses on polysilicon surface micromachining, with a brief overview of other MEMS manufacturing technologies and devices.

8:30 a.m.–5:30 p.m.
S.F. Marriott

Dry and Immersion Lithography for Nonlithographers

Burn J. Lin, TSMC

This short course is designed to further attendees' understanding of lithography, chip design, and how to make chips meet better specs.

6–7:30 p.m.
S.F. Hilton

President's Reception

Tuesday, July 13

8 a.m.–12 noon
Moscone Center, San Francisco

SEMI Summer—A Semiconductor Industry Conference Hosted by Merrill Lynch and SEMI—a midyear update

This forum provides attendees with a chance to learn about the investment opportunities and the state of the industry from the device manufacturing perspective.

1–5 p.m.
S.F. Marriott Hotel

Forecasting Techniques for the Semiconductor Industry

Moshe Handelsman, Advanced Forecasting

This popular workshop trains participants to identify and predict the peaks and valleys of the silicon business cycle and their effects on specific products. The course reviews major forecasting techniques
used in the semiconductor equipment and materials industry, and their benefits and shortcomings. Forecasts of IC demand, wafer processing equipment sales, and test and assembly equipment sales for 2004 are presented and analyzed.

9–10 a.m.
Moscone Center, San Francisco, Emerging Technology Center, Esplanade Hall

"Meet the Industry Masters" Keynote Address

Steven Appleton, Micron

1:30–5 p.m.
S.J. Marriott Hotel

STS: IEMT Professional Development Course: Nano—The Next Technology

Deb Newberry and Walt Trybula

8:30 a.m.–12 noon
San Jose Marriott Hotel

STS: IEMT Professional Development Course: Materials, Processes, and Defect Recognition for Hybrids, Microcircuits, and RF/MMIC Modules

Tom Green, National Training Center for Microelectronics

This course gives students an overview of the materials and processes needed to assemble hybrids, microcircuits, and RF/MMIC modules. The emphasis is on understanding defects in relationship to the process and in conjunction with customer expectations.

9 a.m.–3:30 p.m.
Moscone Center, San Francisco

Fab Managers Forum: Maximizing Profitability by Optimizing Productivity

The Fab Managers Forum gives senior fab management and supplier executives an opportunity to identify common problems and solutions in semiconductor manufacturing. The forum features a keynote from Steve Appleton, president and CEO of Micron; morning fab management and supplier peer-to-peer breakout sessions; a joint fab management and supplier luncheon; a joint fab management and supplier afternoon; a summary; and a panel discussion.

8:30 a.m. –12:30 p.m.
S.F. Marriott Hotel

The Fundamental Limits of Optical Lithography

Bruce Smith, Intel Professor of Microelectronic Engineering and Associate Dean in the College of Engineering, Rochester Institute of Technology

The goal of this session is to develop a fundamental and intuitive understanding of topics related to diffraction by a photomask, collection by an optical system, and imaging into a photoresist. Fourier spectral analysis, coherency theory, lens interaction, aberration concepts, and image enhancement are described. The course is the first of a two-part sequence; partipants are not required to take both parts.

1:30 –5:30 p.m.
S.F. Marriott Hotel

Pushing the Limits: Optical Enhancement, Polarization, and Immersion Lithography

Bruce Smith, Intel Professor of Microelectronic Engineering
and Associate Dean in the College of Engineering, Rochester Institute of Technology

This course covers low-k1 optical microlithography concepts and is useful as a stand-alone course or a follow-up to "The Fundamental Limits of Optical Lithography." Topics covered relate to current and future approaches that can extend optical imaging into sub-65-nm
device generations. Immersion lithography, which has become an optical extension technology candidate, will be covered, along with the implications of large-angle (high NA) imaging.

8 a.m.–12 noon
S.F. Marriott Hotel

Standards Technical Education Program (STEP): EUV Lithography Masks

EUV lithography is emerging as a potential lithography solution for the sub-45-nm node. EUV mask standards development has been in progress over the last five years. SEMI P37, P38, and P40 contain requirements for EUV mask substrates and blanks. Additional standards (mounting, handling, storage, etc.) are in the definition stage to support EUV mask infrastructure. This STEP will describe the rationale for each of the requirements in these standards.

3–6 p.m.
S.F. Marriott Hotel

EHS Interest Group Meeting—Energy Efficiency: Global Perspective for the Semiconductor Industry

This meeting addresses the opportunities for toolmakers in supporting chipmakers' goal to improve energy efficiency in fabs. The meeting is sponsored by the International Compliance and Regulatory Committee.

2–3 p.m.
S.F. Marriott Hotel

EU EHS Legislation and Regulations Update

This meeting will cover an overview of new and drafted legislation and regulations by the European Union in the environmental, health, and safety fields with relevance for the semiconductor industry.

8 a.m.–12 noon
S.F. Marriott Hotel

Standards Technical Education Program (STEP): Functional Safety in Compliance with SEMI S2

This STEP will primarily discuss the recent changes in S2 addressing functional safety. This STEP addresses the new technologies for the control engineer to design a tool that meets international safety standards while being in compliance with S2 and its requirement to design a functional, safe tool.

8 a.m.–12 noon
S.F. Marriott Hotel

Standards Technical Education Program (STEP): SEMI E127: Integrated Measurement Module Communications

This STEP will cover the technical requirements of SEMI E127 "Integrated Measurement Module Communications (IMMC)." E127 specifies the communications between an integrated measurement module (IMM) and both a control client (typically an integrated measurement tool, such as a cluster tool) and a data client, such as a fault detection and classification application or a factory data archival/analysis system.

1–6 p.m.
Moscone Center, San Francisco

SEMI Market Symposium

The symposium will provide a midyear update with an industry outlook; market analysis; and forecasts for semiconductors, capital equipment, and materials. Market trends, opportunities, and issues that impact SEMI membership and the industry as a whole will be highlighted by guest speakers.

Wednesday, July 14

Time to be announced

Moscone Center, San Francisco, Emerging Technology Center, Esplanade Hall

"Meet the Industry Masters" Keynote Address

F. C. Tseng, TSMC

2:30–3:30 p.m.
Moscone Center, San Francisco, Emerging Technology Center, Esplanade Hall

"Meet the Industry Masters" Keynote Address

Aart De Geus, Synopsys

8:30 a.m.–5:30 p.m.
S.F. Marriott Hotel

Developing and ImplementingIntellectual Property Strategies in the Semiconductor Industry

Joseph Gortych, consultant

The aim of this course is to provide participants with information on how to develop and implement an effective and realistic IP strategy suitable for a number of different business scenarios. The course includes an overview of the forms of IP, IP connections within a business, IP interactions outside of a business, and the nature of IP in the semiconductor industry.

9 a.m.–5 p.m.
S.F. Marriott Hotel

Standards Technical Education Program (STEP): SEMI S22 Electrical Design

This STEP will cover the detailed technical requirements of SEMI S22 "Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment." This safety guideline, published in November 2003, is the first electrical safety document developed specifically for semiconductor equipment and is therefore a critical technical document.

1:30–5:30 p.m.
S.F. Marriott Hotel

Designing MEMS for Reliability

Susanne Arney, AT&T Bell Labs MEMS reliability research group;
Arman Gasparyan, Lucent Technologies

This course will provide participants with a basic working knowledge of how to design MEMS for reliability. The course will concentrate on MEMS design, reliability physics, MEMS-specific fundamental reliability phenomena and failure modes, and accelerated testing protocols.

Friday, July 16, 2004

8:30 a.m.–12:30 p.m.
S.F. Marriott Hotel

Standards Technical Education Program (STEP): Equipment Data Acquisition Standards (EDA/Interface: A Standards Suite)

SEMI's equipment data acquisition (EDA) specifications are key enablers for the IC industry's E-diagnostics and equipment engineering capability initiatives. They represent an opportunity for toolmakers to improve equipment designs, performance, and customer service models. By implementing these specifications and delivering capabilities that take advantage of them, equipment OEMs can obtain valuable feedback for future design cycles, shorten the time
to return on investments, and improve support efficiency.

SEMICON West 2004 SAN FRANCISCO EXHIBIT HALL HOURS Monday, July 12 10 a.m. – 6 p.m. Tuesday, July 13 10 a.m. – 6 p.m. Wednesday, July 14 10 a.m. – 4 p.m. For more information about Semicon West, log onto www.semi.org.