Litho
leads partnering parade
Collaborative
agreements and strategic alliances continue to criss-cross the semiconductor
manufacturing space, led by recent deals struck within the lithography
and photomask areas. A multiyear agreement signed by ASML MaskTools
and Micron deals with the creation and improvement of the practical
applications of resolution enhancement techniques (RETs) for the 95-nm
and below technology nodes. As part of the deal, the chipmaker gets
a global license for the optical extension technologies company's intellectual
property portfolio to use in its production fabs. Micron will also buy
ASML's MaskWeaver RET implementation and LithoCruiser scanner optimization
products, while the semiconductor company will supply the OEM unit with
its high-end maskmaking and mask-characterization services to help qualify
ASML ArF scanners for volume production at the 65- and 45-nm nodes.
Photronics
has signed two strategic deals to bolster its efforts to provide design
and mask integration support and improve advanced mask manufacturability
and quality.
Sigma-C
will grant the maskmaker preferred-partner access to the software company's
portfolio of litho simulation platforms—including first looks at early
releases of new products—as well as offering strategic input on Photronics'
software development options. The mask house says it will deploy Sigma-C
tools to anticipate and understand the implications of the entire photomask
process on advanced litho integration options.
Synopsys
will work with Photronics to explore and develop solutions in the design
for manufacturing (DFM) and mask synthesis areas that will shorten time
to yield for chipmakers. Specific programs will include efforts to improve
the design flow from layout to mask for alternating-aperture phase-shift
masks, speed up the yield and cycle time for masks using strong RETs,
and reduce mask-inspection turnaround times through the use of Synopsys's
suite of DFM software tools.
The
trend toward partnering and alliance building shows no signs of letting
up in other corners of the semiconductor equipment, subsystems, and
materials community. KLA-Tencor has agreed to distribute SII NanoTechnology's
high-speed, high-resolution atomic force profilometer outside of Japan.
The yield management and process control company will sell the Seiko
Instruments unit's Nanopics 2100 tabletop system as a joint product
in North America and Asia, targeting surface-metrology applications
in such markets as semiconductor, data storage, MEMS, and biotechnology.
MKS
Instruments and Umetrics have formed an alliance to provide chipmakers
with a turnkey solution for real-time advanced process control and e-diagnostics.
The Swedish company's embedded multivariate analysis engine will be
integrated with MKS's TOOLWeb product suite, offering a "complete sensor-to-analysis
fault detection and classification capability," according to the company.
MKS will back up the package with its worldwide support network.
A
strategic alliance between Pall and Matheson Tri-Gas will bring the
two corporations together to develop, manufacture, and sell gas-purification
products to the semiconductor industry. The agreement builds on the
working relationship the suppliers have had since 1997. Both companies
will have exclusive access to each other's purification media to improve
chipmaking by eliminating molecular and particulate contaminants from
process gases. They will also collaborate on new technology development.
Vesta
Technology and Integrated Process Systems (IPS) have joined together
in an exclusive technology deal that encompasses marketing, sales, and
service efforts focused on the atomic layer deposition (ALD) space.
Vesta will provide global support for IPS's line of ALD, ALD/CVD, and
etch tools, as well as work with the Korean company on joint development
efforts.
On
the legacy tool front, Aspect Systems (ASI) has licensed another product
line from Axcelis—the reactive ion etch systems formerly manufactured
by Matrix Integrated Systems (now a part of Axcelis). ASI can manufacture,
sell, and service the 150- and 200-mm versions of the Bobcat and Cheetah
tools, adding to its already-licensed portfolio of legacy Matrix/Axcelis
and Lam etch equipment.
ASMI
sets Singapore plant
Semiconductor
equipment manufacturer ASM International plans to build a wafer-processing
tool factory in Yioshun, Singapore. The facility will be the first front-end
toolmaking facility in the city-state, according to company and Singaporean
government sources. The Dutch company says it will invest close to $29
million in the plant over the next few years. Located in two buildings
with 150,000 sq ft of total floor area, including 30,000 sq ft of cleanroom
space, the site will employ 50 by year's end and up to 300 within 3
years. ASMI plans to hit full production of generic vertical furnaces
by mid-2005, with shipment levels of 100 systems expected by the end
of 2006. The facility will make its own parts or source locally and
assemble the generic subsystems for vertical diffusion furnaces, ASMI
says. It will also provide manufacturing support to the company's U.S.
and Japanese units.
AMAT
buys Metron
In
another move to enhance its service and support business, Applied Materials
will buy Metron Technology for approximately $85 million. The deal will
add Metron's worldwide organization of more than 30 offices and operating
facilities to Applied's Global Services unit. The outsource solution
company's assets include parts and materials supply, equipment maintenance,
kitting and cleaning of process parts, legacy tool refurbishment, and
specialty products distribution. Metron's traditional support for non-Applied
systems will be included in the expanded fab services program. The deal
is expected to close in Applied's fourth fiscal quarter. (For more
on Applied's other recent transactions on the service and support front,
see "Service, spares management deals
extend Applied's global fab reach" in the Industry News section
in MICRO's July 2004 issue.)
Kodak
snaps up National unit
Eastman
Kodak has acquired the CMOS image sensor (CIS) business of National
Semiconductor, adding the unit to its Image Sensor Solutions (ISS) group.
As part of the deal, Kodak obtains some IP (such as advanced mixed-signal
circuit design) and equipment assets. The company also says it plans
to hire about 50 former National employees, who will work out of a new
ISS organization office in Sunnyvale, CA, and collaborate with an existing
team located at Kodak's Rochester, NY, headquarters. The CIS technology
will augment the company's existing high-performance charged coupled
devices (CCDs). "The acquisition demonstrates Kodak's continued commitment
to CIS products and accelerates our longer-term goal of providing CIS
devices that offer the image quality of CCD sensors, while still taking
advantage of the power, integration, and cost benefits traditionally
associated with CMOS technology," says Kodak's Chris McNiffe.