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Product Technology News


Automated AFM Metrology


Santa Barbara, CA

An automated atomic force microscopy (AFM) tool designed for photomask applications, the Dimension X3D provides comprehensive profile and critical dimension (CD) metrics for a variety of materials, including chrome, quartz, MoSi, and photoresist. The high-resolution, nondestructive CD-AFM system is insensitive to material properties and provides repeatable measurements for multiple mask generations. The tool gathers detailed information for CD elements, including lines and spaces, line and space depth, hole CD and depth, sidewall angle on vertical and reentrant profiles, linewidth variability (line edge roughness), and sidewall roughness. Nanoscope software provides quick, simple recipe setup for a variety of complex measurements. (Semicon China, Booth 5339)

E-Beam Photomask Repair Tool

Carl Zeiss

Jena, Germany

The MeRiT MG E-beam system repairs binary and phase-shift photomasks. The tool is suitable for next-generation lithography, including extreme ultraviolet (EUV), electron projection, and low-energy E-beam proximity projection lithography. It can repair opaque and clear defects on photomasks and be customized to deposit several materials, including SiO2. The instrument has a high-resolution Gemini E-beam column featuring low-voltage operation and a variable-pressure mode. A five-channel gas supply provides gaseous, liquid, and solid precursors, enabling deposition and etching. The tool can treat a range of materials, including quartz in phase-shift bumps; molybdenum silicide, an attenuator for 193-nm wavelength applications; molybdenum/silicon multilayer stacks for EUV masks; and tantalum nitride, an absorber for EUV.

High-Purity Controls


Elk River, MN

Clean and ultraclean pressure regulators, valves, down-mount components, manifolds, and electronic controllers are for use in point-of-use, bulk specialty gas, gas cabinet, facility, and inert-gas-system applications. Products include MicroTek miniature valves, which have a very high cycle life, and MicroStik assemblies, which incorporate regulators, valves, filters, and sensing elements in a compact package. (Semicon China, Booth 4149)

Optical Stylus Profiler Tool


Newbury Park, CA

The HRT 3000 optical stylus profiler is designed for MEMS, semiconductor, LCD flat-panel, and other applications. The noncontact profiler provides z-data in real time. It also features a traditional microscope for performing conventional x-y metrology, achieving true three-axis views. Proprietary signal-processing software measures high-aspect-ratio wafer isolation and MEMS trenches, panel or substrate flatness, critical dimensions, and other features. The tool can be supplied as a turnkey unit or as an OEM measurement probe for existing equipment or in-process applications. It features a flexible extended scan range from 50 to 2000 µm with resolutions from 0.03 to 1.0 µm. Range and resolution can be altered by exchanging a standard microscope lens.

Dry Vacuum Pump

Pfeiffer Vacuum

Nashua, NH

A low-cost, positive-displacement dry pump features a simple piston-style design, which does not expose the bearings to high-vacuum conditions. The XtraDry pump provides a hydrocarbon-free vacuum and does not generate particles that can contaminate vacuum processes. Its operating characteristics make it well suited for use in semiconductor applications, such as loadlocks and differential seals. It can also be used as a backing pump for turbo pumps in high-vacuum systems. The unit has a low-vibration design that permits multiple pump configurations. Pumping speed is independent of gas species. A two-stage version provides a pumping speed of 7 m3/hr and a base pressure of 0.05 mbar, while a single-stage model has a pumping speed of 14 m3/hr and base pressure of 3 mbar.

Chemical Concentration System


Campbell, CA

A dependable, cost-effective, point-of-use system for monitoring and controlling the concentrations of liquid chemicals, the CR-288T is fully compatible with all liquid-chemical manufacturing processes, such as CMP and wafer-surface-preparation tools. The system uses miniaturized optical reflectivity technology, delivering accurate chemical information in fractions of a second. Its advanced sensor technology is based on optical reflectivity. The 2 X 2 X 3-in. real-time sensor has no moving parts and is process transparent. The system reduces chemical consumption; provides monitoring for point-of-use chemical blending, spiking, and dilution; has waste-stream monitoring capabilities; and provides reliable data for process development and tool troubleshooting.

Color Camera

JAI Pulnix

Sunnyvale, CA

The CV-M8CL is a 2-megapixel color camera that features resolution of 1600 X 1200 pixels. Measuring 40 X 50 X 120 mm, the camera is based on a progressive-scan 1-in.-format Bayer CFA CCD sensor (KAI-2001CM) with 7.4-µm-square pixels. It performs 30 frames/sec at full resolution with dual-tap output or 17 frames/sec at full resolution over single-tap output. The camera has a Camera Link interface, RS-232C for configuring the unit, PIV mode, and C-mount. It features auto iris lens video output, knee and gamma response curves, reset continuous trigger mode, analog monitor output, and five-image burst-trigger mode, which enables the capture of a sequence of five images at different shutter-speed settings.

Portable Flowmeters


Tucson, AZ

Portable mass-flow meters and liquid flowmeters use a battery pack with a standard 9-V battery, making metering gas flow, pressure, and water flow convenient and reliable. The unit can be used to verify proper operation of flowmeters and flow controllers, take measurements of flow or pressure without a hard-wired power source, and test for leaks in multiple processes or systems. In addition to mass flow, the meters display volumetric flow, pressure, and temperature; have a local dynamic display; are field tunable for application-specific response; calibrate 14 different gases; and offer calibration accuracy to ±0.5% full scale.

Tungsten Deposition Tool

Novellus Systems

San Jose, CA

Designed to meet contact and via-fill needs at the 65-nm node and below, the Altus DirectFill eliminates the need for conventional titanium/titanium nitride toolsets. The plug-fill technique can reduce contact resistance and lower cost of ownership by 50% compared with existing processes. By replacing the standard multitool Ti/TiN/W approach with a single system, the tool simplifies the tungsten deposition process. It performs an advanced preclean process in one process module, pulsed nucleation-layer (PNL) deposition of tungsten
nitride in a second module, and a combined PNL and CVD tungsten-deposition step in a third module. The thin tungsten nitride barrier exhibits atomic-layer-deposition conformality and adheres to a variety of dielectric materials. All process temperatures are below 400°C, providing compatibility with future process integration requirements. The tool is available in 200- and 300-mm configurations. (Semicon China, Booth 5477)

Dry Leak Detector

Alcatel Vacuum Technology

Annecy, France

The ASM 192 T2D+ console dry leak detector offers extended pumping speed over the ASM 182/192. The detector is available in two versions: one with a standard roughing pump and one with an enhanced dry roughing pump that performs at 50 m3/hr. The unit is sensitive (5 X 12–12 mbar L/sec) because it has an analyzer cell equipped with a dual filament. With a high helium-pumping speed of 20 L/sec, it offers fast response time in spaying mode. It also performs qualitative and quantitative high-pressure leak tests (at crossover pressures of 200 and 30 mbar). A simple interface has two parts: one for the operator and the other for entering process parameters. (Semicon China, Booth 5639)

Hydrogen Purification Systems


Billerica, MA

Aeronex gas-purification systems are dual-bed, self-regenerating units that deliver a continuous supply of pure gas. Using ambient-temperature purification technology, the systems operate at a low pressure drop and offer a lower cost of ownership than palladium cells. The stand-alone units have a user-friendly touch screen PC and can be configured with several options, such as a breakthrough indicator and manual or automatic bypass valves. They remove contaminants to sub-parts-per-billion, and, in some cases, parts-per-trillion levels. The systems are available in several different gas series to generate ultra-high-purity H2, NH3, and inert gases. (Semicon China, Booth 3119)

Germanium-Free sSOI Wafers


Bernin, France

Manufactured using the patented Smart Cut process, germanium-free strained silicon-on-insulator (sSOI) wafers are produced for partially depleted (>35-nm-thick) and fully depleted (<25-nm-thick) CMOS architectures. By overcoming FEOL integration and yield concerns associated with germanium-based sSOI technologies, the wafers enable chipmakers to achieve up to an 80% improvement in the electron mobility of future chips. Compatible with existing SOI technologies, the 200- and 300-mm sSOI substrates can be used in a wide range of high-speed, low-power applications. (Semicon China, Booth 4251)

High-Current Ion Implanter

Varian Semiconductor Equipment

Gloucester, MA

The single-wafer VIISta HC high-current ion implanter provides repeatable beam steering and good contamination control. An optimized beamline improves upon the tool's ribbon-beam architecture. Enhancements include increased beamline transmission, beam utilization, and reduced autotune time, providing high productivity for low-energy conductive implants. All VIISta products feature a common control system, positioning system, and single-wafer end station, easing their integration into factory automation, lowering spare-parts and training costs, and simplifying tool operation.

Barrier Slurry

Rohm and Haas Electronic Materials
CMP Technologies

Phoenix, AZ

Optimized for low-pressure/ low-stress copper CMP, SSA barrier slurry provides consistent performance, low defectivity, and a large process window. For use at the 90- and 65-nm nodes, the slurry leads to fewer microscratches, better sheet resistance, and lower overall defect counts than conventional slurries. High barrier-removal rates at low pressure (1.5 psi) provide high, balanced throughput while minimizing film stress or delamination. The slurry can polish combinations of barrier and cap materials, antireflective coatings, and low-k dielectric films. It attains tantalum and tetraethylorthosilicate rates above 500 Å/min at a low pH and low weight percentage of particles. (Semicon China, Booth 5357)

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