of spectral engineering techniques from Cymer minimizes variations
in optical proximity effects (OPE) and enhances depth of focus (DOF),
enabling chipmakers to improve process control and maximize yields.
Based on the company's on-board E95 bandwidth metrology,
the new techniques include active bandwidth control, which lets semiconductor
manufacturers tune the light-source bandwidth within a narrow range
under a variety of operating conditions and minimize OPE variations
from exposure tool to exposure tool. The suite also includes the resolution
enhancement by laser spectrum adjusted exposure (RELAX) technique,
which improves DOF for critical process layers. Information: www.cymer.com.
Matthey has been granted a U.S. patent for the V-Purge hydrogen
purification system, which purges hydrogen from palladium
membrane purifiers. For use in large MOCVD production platforms,
the design ensures complete hydrogen removal in the event of power
outages and emergency shutdowns. The system eliminates all hydrogen
in the cell before the cell cools below 300°C, the limit at which
significant stresses on the membrane can occur if hydrogen is present.
Complete purging can take place in less than 10 minutes. The system
can also switch from full nitrogen purge to full hydrogen flow of
up to 200 std L/min in one minute while maintaining the cell temperature
within ±5°C. Information: www.pureguard.net.
has enhanced its ArchestrA application platform, which focuses on
fabwide equipment engineering systems (EES). The enhancements
provide fast correlation of process data with production events, ad
hoc navigation through data from multiple sources, and new calculations
embedded into the system's integrated real-time database. The
new capabilities allows IC fabs to better use the platform's connectivity,
visualization, and data storage and management features to build fabwide
EES. The platform provides a user-friendly electronic design automation
interface to define and manage data collection plans for an entire
fab. More than 800 interfaces are available for direct connection
to real-time data sources. An automated portal provides personalized
information delivery and drill-down navigation. Information: www.wonderware.com.
the Zeta spray cleaning system, FSI International
has developed the PlatNiStrip process, a nickel-platinum
strip process that helps IC manufacturers to form salicide at the
The company has partnered with chipmakers to demonstrate the process
on 65-nm pilot-line devices. The process, which can be implemented
using industry-standard chemicals on a standard Zeta system, uses
a point-of-use blended-acid solution that can strip both nickel and
platinum without leaving residues. It has high selectivity to silicide,
oxide, and nitride and enables the integration of nickel-platinum
silicide film. Information: www.fsi-intl.com.
analysis software from SEMICONsoft supports ellipsometry, reflectance,
and transmittance analysis. TFCompanion includes an extensive
materials library and supports different parameterized approximation
models of materials' optical dispersion. The new release has a flexible
feature matrix that allows users to select the version and capabilities
of the software to suit the project at hand. It also features backside
reflection correction, which enables users to measure thick substrates
without blackening the backside. Information: www.semiconsoft.com.
Web site from Cabot Supermetals provides information on the company's
tantalum sputtering targets. The targets are used in critical
thin-film applications in the semiconductor, flat-panel-display, and
other industries. The site includes detailed information
on tantalum material properties and target product specifications.
Technical papers by company scientists explain advances in tantalum
thin-film applications. The site also provides material safety data
sheets and ISO certificates. Information: www.cabottargets.com.