WaferSight wafer-flatness tool performs high-resolution and high-throughput
mapping of wafer shape, flatness, and thickness variations. Based on
proprietary optical laser interferometry, the in-line metrology system
is available for 300- and advanced 200-mm wafer processing. Its subnanometer
site-flatness measurement precision offers chipmakers good control of
polishing, which improves yields of fine-line-geometry devices. The
multigenerational tool has automated noncontaminating edge-grip wafer-handling
capability and supports the ITRS at the 90-, 65-, and 45-nm nodes. In
addition to performing industry-standard wafer thickness, flatness,
and bow and warp measurements, the tool measures wafer-edge roll-off,
a critical component of lithography yield, and CMP uniformity and process
Organic Carbon Sensor
Thornton total organic carbon (TOC) sensor is offered with the 770MAX,
an on-line transmitter that provides multiple TOC and conductivity measurements
in a user-configurable multiparameter instrument platform. The instrument
features low detection limits with fast and continuous response, providing
complete, accurate, and reliable data. The sensor technology makes system
installation and startup fast and simple.
Sensor Graphic Interface
dedicated multisensor interface (MSI) is available for Modline 5–series
infrared sensors. The MSI enables users to access configuration and
temperature data for up to 12 sensors over fabwide networks and the
Internet via an embedded Web-browser interface. A NEMA 4X–rated
10.4-in. touch-panel color display, the MSI comes preloaded with screens
presenting sensor configuration, status, current temperature, historical
trends, and temperature alarms. The unit provides an overview of sensors
interconnected by an RS-485 network. With its built-in Web-browser interface,
the unit can be accessed by remote workstations via Microsoft Internet
Explorer version 6.0 or higher. The infrared sensors measure temperatures
across a real range of 250° to 3000°C.
cost-effective alternative to high-resolution E-beam lithography for
printing sub-20-nm geometries, the NPS300 nanopatterning stepper employs
stamps or templates rather than optical lithography to imprint tiny
patterns. The tool is for use in cold ultraviolet-nanoimprint lithography
and hot embossing applications. Hot embossing consists of transferring
the stamp pattern into a thermoplastic embossing material by controlling
heat and pressure. When equipped with an automatic alignment option,
the tool demonstrates 250-nm overlay accuracy and accepts stamps with
sizes up to 100 mm and thicknesses up to 6.5 mm. The automated system
is available either in a manual or a fully automated configuration.
It includes automated wafer handling for sizes up to 300 mm and an automated
template pickup feature that allows different templates to be printed
on the same wafer. The tool can be used to fabricate integrated optical
devices, smart materials for microelectronics such as sensors and transducers,
and temperature and light sensors.
F80 line of stand-alone and integrated thin-film metrology tools uses
thickness-imaging technology, which generates thousands of thickness
readings at each measurement pad location. The tools' thickness-based
approach shields them from the image-contrast inversion problems
that affect conventional metrology tools in CMP applications. That approach
improves pattern recognition reliability and decreases the number of
recipes required. It also enables more-automated and more-intuitive
recipe creation, reducing setup and training time. Because the tools
generate large arrays of thickness readings, measurement pad locations
can be determined using software rather than high-precision stages,
as in conventional tools. Options include 1-D and 2-D high-resolution
scalable fault detection and classification (FDC) system for semiconductor
manufacturing, the Imprint MX2 provides fabs and foundries with portable
fault libraries, improved FDC sensitivity across fault types, and data-mining
capabilities. The system's user-configurable features permit operators
to deploy the most appropriate FDC controls for individual tools and
processes, enabling them to implement FDC process control with a scalable,
multiuser software platform. The system also allows users to extract
large volumes of information from process-state sensors, such as broadband
radio-frequency or optical sensors. Its data-mining features include
an SQL server database, allowing customers to archive, retrieve, and
manage data. The portability of the system's fault libraries lets users
transfer FDC libraries across entire toolsets both within sites and
from site to site.
G2 PVC-C sheet material is used in a range of semiconductor equipment,
from wet process workstations to wafer-processing-equipment cabinetry.
The material meets the demands of cleanroom wet processing equipment,
including the FM 4910 standard. It offers mechanical strength; high
resistance to chemicals such as strong and weak acids and bases, salts,
and aliphatic hydrocarbons; ease of use; and weldability. The material
is available in 48 X 96-in. sheets in gauge sizes from 1/8 to 1 in.
Clean Sweep, a low-shear, high-purity mixer, uses a sweeping motion
instead of customary rotating motion, eliminating process swirl and
the need for angle mounting. Featuring an FDA/USP Class VI elastomeric
seal, it provides a hermetically sealed environment. The mixer has an
impeller with specially shaped blades that are optimized to provide
global mixing throughout the vessel. The impeller's flow pattern is
modeled using a commercial 3-D computational fluid dynamic code. The
mixer eliminates particle shedding and product contamination, requires
no baffles, has few cleanability issues, and is easy to maintain.
and Fusion Systems
SYGEF Plus ultrapure-water piping system and 315 Plus infrared fusion
machine are suitable for 300-mm processing. The larger-size piping system
enables users to install a single 250- or 315-mm pipe instead of two
225-mm pipes, reducing overall installation costs. The piping is available
in SYGEF PVDF, a high-strength, low-weight material that resists abrasions
and has a wide operating temperature range. Valves and fittings come
in 250-, 280-, and 315-mm sizes. The fusion machine incorporates butt
fusion welds, small beads, and high joint strength. A computerized program
directs the operator at each step of the joining process to minimize
errors and enhance weld repeatability. The program also provides documentation
on a range of weld parameters.
new addition to a family of wafer-edge-exposure mercury short-arc lamps
for photolithography applications, the HBO 200W/DN-I is designed for
use with Dainippon Screen photoresist tracks. The lamp offers high performance
at a low cost. For use in i-line stepper imaging, it burns in an atmosphere
of high-pressure mercury vapor and provides a high output i-line source.
Like all HBO-IC lamps, the 200W/DN-I is manufactured with ozone-free
quartz, eliminating any potential ozone generation.
model-based full-chip tool is used for post–resolution enhancement
technique (RET) design verification. Departing from the polygon-based
approach to lithography simulation and database handling, the Tachyon
RDI 1100 has a hardware-accelerated data and simulation engine that
performs those functions. It simulates and inspects 100% of the chip
area using an image-based method. It can perform full-chip RET/optical
proximity correction verification in one hour. Using post-RET design
data, the tool simulates exact wafer-pattern contours across the entire
chip. Wafer patterning is verified and failures are identified by comparing
the simulated contours with the pre-RET design target. Simulation accuracy
is achieved by using 128 calculation kernels during optical image modeling.
The system's architecture handles design files from tens to hundreds
of gigabytes in size.
RealTime facilitates real-time process control and rapid response to process excursions.
The system integrates data from design, process, inspection, and test
equipment horizontally across all aspects of the semiconductor manufacturing
process, enabling managers and engineers to extract relevant information
to support yield decisions. The product provides Web-based statistical
process control that is tightly integrated with the YieldManager system.
It also offers a custom application development environment that accommodates