fabs seek 100% FDC
INTEL; BACKGROUND PHOTOS BY DAVID CANTWELL; ILLUSTRATION BY LAUREN
presentations at the sixth annual European AEC/APC Symposium in Dublin
in early April detailed Intel's progress in implementing fault data collection
(usually referred to as "fault detection and classification,"
or FDC) and other advanced process control measures. Ravi Khairate et
al.'s paper, "Pervasive 300-mm FDC: Strategy and Results for High
Volume, 90-nm Process Technology Fabs," and Daniel Benatar et al.'s
poster, "Development and Implementation of Advanced Process Control
and Excursion Prevention Capabilities for 1262 300-mm Intel High-Volume
Manufacturing Fabs," examined some of the company's efforts to reduce
wafer scrap, enhance tool productivity, and improve overall factory performance.
As the accompanying charts show, FDC proliferation in Intel's three operational
300-mm fabs was extended to at least 80% of all process equipment as of
earlier this year, with the planar tool sets close to achieving the ultimate
goal of 100% coverage. Benatar explained that the percentage of FDC proliferation
went from 27 to 79% in less than 5 months. Khairate pointed out that there
are more than 4000 FDC models that monitor 10,000 equipment variables
in each fab. Benatar said that unique implementations of APC applications
have grown in Intel's high-volume manufacturing by a factor of 7. He cited
APC run-to-run control proliferation numbers of 100% in planar, 80% in
lithography, 40% in thermal, and >20% in etch and thin films across
what Intel calls its "virtual factory." Areas under investigation
include richer manipulation of the data, further integration of the process
control systems, and the increased use of multivariate analysis, according
to Khairate. For more information on these and other presentations from
this year's symposium, go to www.aecapc-europe.com.
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