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INDUSTRY NEWS

Intel fabs seek 100% FDC

SOURCE: INTEL; BACKGROUND PHOTOS BY DAVID CANTWELL; ILLUSTRATION BY LAUREN NAGODA

Several presentations at the sixth annual European AEC/APC Symposium in Dublin in early April detailed Intel's progress in implementing fault data collection (usually referred to as "fault detection and classification," or FDC) and other advanced process control measures. Ravi Khairate et al.'s paper, "Pervasive 300-mm FDC: Strategy and Results for High Volume, 90-nm Process Technology Fabs," and Daniel Benatar et al.'s poster, "Development and Implementation of Advanced Process Control and Excursion Prevention Capabilities for 1262 300-mm Intel High-Volume Manufacturing Fabs," examined some of the company's efforts to reduce wafer scrap, enhance tool productivity, and improve overall factory performance. As the accompanying charts show, FDC proliferation in Intel's three operational 300-mm fabs was extended to at least 80% of all process equipment as of earlier this year, with the planar tool sets close to achieving the ultimate goal of 100% coverage. Benatar explained that the percentage of FDC proliferation went from 27 to 79% in less than 5 months. Khairate pointed out that there are more than 4000 FDC models that monitor 10,000 equipment variables in each fab. Benatar said that unique implementations of APC applications have grown in Intel's high-volume manufacturing by a factor of 7. He cited APC run-to-run control proliferation numbers of 100% in planar, 80% in lithography, 40% in thermal, and >20% in etch and thin films across what Intel calls its "virtual factory." Areas under investigation include richer manipulation of the data, further integration of the process control systems, and the increased use of multivariate analysis, according to Khairate. For more information on these and other presentations from this year's symposium, go to www.aecapc-europe.com.


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