single-wafer processor uses a vertical immersion process chamber with
three megasonic transducers. Located at the top of the chambers, two transducers
introduce acoustic wavefronts directed at the wafer/liquid/gas interface
(the cleaning zone), while a bottom transducer prevents the redeposition
of removed particles. The combined action of the wavefronts allows for
the use of reduced megasonic power levels and lower exposure times to
prevent damage to critical FEOL device structures. Swept through the cleaning
zone several times, the wafer is exposed to acoustic wavefronts in the
millisecond range. The unit offers high particle-removal efficiency with
low film loss at the 65-nm node and beyond.
RGA, a sensor automation platform for residual gas analysis (RGA) control
and communication, monitors process integrity and tool performance in
real time, identifying process excursions and generating alarms and e-mail
messages. The system incorporates sensor-level fault detection and classification
as well as data reporting and searching capabilities. It also compares
wafer-to-wafer, chamber-to-chamber, and tool-to-tool data. The unit includes
a process-specific RGA, a tool connectivity component, and the Process
Eye RGA control platform, which runs recipe modules (including routines
for sensor configuration, calibration, chamber-state tracking, and real-time
dynamic alarms). (Semicon West, South Hall, Booth 1716)
Surfex-300, a parts-cleanliness testing station for 300-mm wafer-box applications,
can be used to test large parts such as front-opening unified pods, front-opening
shipping boxes, and reticle pods quickly and easily. Smaller parts can
also be tested. The automated system combines ultrasonic extraction, particle
measurement, high-purity fluidics, and automated software control. It
decreases testing costs by reducing sample times to one-tenth of those
of traditional manual methods. Test recipes and simple menu-driven software
eliminate data variability caused by human error. Reliable data with low
sample-to-sample variation are ensured by establishing accurate particle
baseline levels. The unit is available with a variety of particle counter
sensitivities and ultrasonic frequencies. (Semicon West, South Hall, Booth
JWS series of defect-review scanning electron microscopes (SEMs) help
identify the source of wafer contamination and fractures. The tools offer
full 360° wafer-edge review and high resolution. Their depth of focus
and high resolution enable users to observe the wafer edge, where defects
such as peeling films, residual slurry, embedded defects, cracks, chips,
and particles are more difficult to image using conventional optical tools.
Column geometry allows the wafer bevel and exclusion zone areas to be
in focus at the same time. The JWS-3000, designed for 300-mm wafer inspection,
features a conical lens that achieves 3-nm resolution for automated defect
review of microdefects in 65-nm design rule processes. The JWS-2000, a
150-mm and 200-mm tool with resolution of 5 nm at 1 kV and a magnification
range of 100 to 200,000X, offers a tilt angle range from 0 to 60°.
Both models feature an automatic energy-dispersive x-ray analysis function.
(Semicon West, South Hall, Booth 1101; Moscone West, Booth 7221)
Model 9200 PanelPrinter provides photolithography for mobile display applications.
It features 1.5-Ám resolution and has a high-performance 200-mm lens,
providing a large lens field and a depth of focus greater than 9 Ám. By
utilizing real-time autofocus at every site and high-speed frictionless
motion, throughput is improved by as much as 80% over competing technologies.
The 9200 offers fully integrated
subsystems, including a high-fidelity projection lens and illumination
system, a precision x-y stage, an automated substrate alignment system,
an automated reticle-handling and storage system, and a suite of metrology
sensors. The system features real-time magnification adjustment via a
patented six-degrees of freedom reticle chuck, which enables high accuracy
in layer-to-layer registration and image-field stitching. The lens provides
▒50 ppm real-time magnification adjustment, so that every substrate is
compensated for according to the alignment results.
to four Proportion-Air QB3 electronic pressure regulators can be mounted
to a manifold, which offers a common supply and exhaust port with individual
controlled outlet ports to minimize plumbing. The QB3 pressure regulator
controls pressure or vacuum electronically by accepting a command signal
of either 0–10 V or 4–20 mA. The pneumatic output is linear
to the command input. An analog output of 0–10 V is standard, representing
the actual pneumatic output.
Titan 80-300 scanning transmission electron microscope (STEM) yields atomic-scale
imaging with a TEM information limit below 0.7 Å and STEM resolution
below 1 Å. The microscope, part of the UltraView tool suite, performs
critical fab applications including seed/barrier layer characterization
for copper interconnect processes, ultrathin gate oxide imaging, and high-resolution
x-ray composition analysis. UltraView provides semiconductor manufacturers
with the ability to collect ultra-high-resolution analytical information
from wafers, providing process control feedback
in minutes rather than days. The process reduces the cost of ultra-high-resolution
analysis, which is often required to inspect complex devices. (Semicon
West, South Hall, Booth 2002; Moscone West, Booth 7211)
line of fluorine-based wafer thinning chemicals can be used in advanced
semiconductor manufacturing processes. Wafers are thinned to achieve flexibility,
which enables chipmakers to build smaller chip packages or to place multiple
chips into the same package. In smart-card applications, wafer thinning
is required to prevent embedded chips from breaking during normal use.
Thinning also enables IC manufacturers to shrink chip packages, allowing
them to accommodate smaller die sizes. It also permits chips to dissipate
heat at higher speeds, since the size of the insulating silicon layer
between the device and the thermal management material can be reduced.
(Semicon West, North Hall, Booth 5843)
for use at the 45-nm node, the TAKLDM liquid-dispense module can blend
and control a wide variety of dilute chemistries. Offering process and
tool flexibility, the unit is based on FractalFill, a patent-pending approach
that provides a continuously analytically qualified chemistry to precise
specifications. Once the chemistry is blended, the system gives users
the power to change recipes on the fly.
iSIS 1100, iSIS 1200, and iSIS 2000 CMP slurry blending and delivery systems
offer integrated centrifugal-pump technology for dispensing slurry to
a global loop that feeds CMP polishers. The systems' centrifugal-pump
technology provides global loop pressure control to minimize pressure
changes at the point of use during demand fluctuations, enabling consistent
polishing rates and improving yields. The systems blend concentrated CMP
slurry with DI water and up to four additional constituents via patented
MassFusion load cell–based blending technology. (Semicon West, South
Hall, Booth 726)
Flex fluoropolymer is for use in flexible, high-purity tubing applications.
The tubing, available in 1/4- to 1-in. diameters, complements Kynar PVDF
piping systems, which are used in containment, DI-water, and high-purity-acid
applications. The tubing is made from 100% pure fluoropolymer. Because
it does not contain stabilizers or pigments, it cannot leach particulates
into high-purity fluid streams. Depending on the grade of the resin, the
tubing operates continuously up to 125°C. The material offers high
chemical, abrasion, and thermal resistance. (Semicon West, South Hall,
are available for cleaning plastic front-opening unified pods (FOUPs),
front-opening shipping boxes (FOSBs), and other plastic wafer-handling
carriers and devices. The cleaning chemistries used in conveyorized or
batch cleaning systems, plus effective media isolation technology, remove
contaminants such as inks, fingerprints, oily spots, glue residue, and
silicone mold-release agents. The chemistries do not harm the plastics
and meet cleanroom requirements while preventing recontamination or contamination
lines of high-performance vibration-isolation platforms, the BM-6 and
BM-8, incorporate patented Negative Stiffness technology. The two compact
series offer a low 4.5-in. profile and a 1.5-Hz horizontal natural frequency
in an easy-to-use, easy-to-install passive platform. The BM-6 offers a
2.5-Hz vertical natural frequency, while the BM-8 offers a 0.5-Hz vertical
natural frequency. Both series support payloads up to 105 lb (48 kg).
Negative Stiffness technology outperforms costlier active and air-based
products and does not require high mass or expensive power and air facilities.
manual alignment system offers the advantage of optical backside technology
for the price of an infrared (IR) system. The MBA offers four-camera optical
backside alignment with 1–2 Ám accuracy. (In IR systems, accuracy
is only 3–5 Ám.) The system can handle a wide range of substrates
in a variety of conventional and irregular shapes and includes a touch
screen interface that is PLC controlled. It features the Series-30 light
source and an intensity-controlled
power supply. With its 50 X 32-in. footprint, the unit fits into any facility.
A tabletop model and a configuration with a vibration-isolation table
are available. The tool can be used in universities, R&D facilities,
and start-up companies for MEMS, semiconductor, and other applications.
(Semicon West, South Hall, Booth 1516)
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