Vistec Electron Beam
The SB250, a universal, cost-effective system for direct-write and maskmaking applications, has modular architecture that imparts flexibility to the tool’s variable-shaped-beam system, enabling users to perform a range of applications. In addition, the architecture allows easy system upgrades. The SB250 has a stage travel range of 210 × 210 mm2, allowing operators to expose masks up to 7 in. and wafers up to 200 mm in diameter. Other features include a field-proven 50-keV shaped-beam column, write-on-the-fly writing mode, and fully automatic substrate handling. The system can be used for gallium arsenide and silicon direct writing, integrated optics, mask production, and applied research.
Thin-Film Deposition Controller
The XTC/3 thin-film deposition controller provides accurate control of deposition rate and thickness in an affordable, easy-to-install package. Equipped with the patented ModeLock feature, the unit offers proven mode-hop prevention for consistent quality. This oscillator technology measures films with greater precision than conventional techniques. The reliable, flexible system is available in two models with the capacity to perform up to 99 processes and 999 layers. Available as a freestanding module or with PC control, the unit works with the Crystal 12, Crystal Six, and dual sensors to perform automatic crystal replacement and continuous deposition-rate monitoring. The compact, half-rack unit has an easy-to-read TFT LCD display. For maximum uptime, expert support is available through the company’s global service network.
A two-way diaphragm valve, the SDV is the latest addition to the company’s Dymatrix line of specialty valves and control products. The valve is constructed with all-wetted high-purity PTFE components and can be used in high-end semiconductor and aggressive chemical applications. The valve is available in sizes from ¼ to 1 in. Models with manual or pneumatic actuation are available. The unit’s engineered design is consistent with other Dymatrix products, providing easy integration with existing configurations. Available end connections include standard fare, pillar, Flowell, and NPT designs.
Wet Processing Station
The automated system can be easily configured to meet acid or solvent wet processing needs by combining interface, processing, drying, and transfer modules. Designed to meet NFPA, NEC, and SEMI standards, the system includes a Class 1 minienvironment, modular design for flexibility and ease of change, Ethernet-based distributed control system, a host SECS-GEM interface, front or rear maintenance access, flush-mount capability, an operator touch screen, real-time data logging, event and recipe-driven process controls, and a bulk-chemical supply interface. The high-throughput unit can operate for more than 1500 hours between failures.
Photoresist Coating Technology
St. Florian, Austria
Nano Spray, a photoresist coating technology, can deposit conformal coatings on vertical via walls that are 300 µm deep and 100 µm in diameter. While the coating of vertical features has long been common in MEMS manufacturing, it is becoming more prevalent in the interconnect area. Vias are used to connect the active front side of the wafer to the backside and onto the pins of the wafer-level package. The spray technology performs lithography steps at the bottoms of vias to create through-wafer interconnects. Based on a spray mist created using ultrasonic nozzles, the technology improves the dispensing and positioning of the spray stream. First developed for the EVG100 series of coating equipment, the technology has undergone continuous improvements, enabling users to coat steeper sidewalls.
Dissolved-ozone sensors can be used to monitor semiconductor ultrapure water. The sensors connect to 770Max instruments, which measure conductivity/resistivity, total organic carbon, dissolved oxygen, flow rate, oxidation-reduction potential, pH, temperature, tank level, and pressure. The availability of up to six channels of mix-and-match measurement parameters in the 770Max reduces the cost and complexity of pure-water monitoring and treatment systems. When fewer measurements are needed, the ozone sensor may be used with the two-channel 2000 instrument. The ozone sensors provide reliable and accurate response and require only infrequent, simple maintenance. They provide stable measurements in both normal ozonation ranges and near zero (after ozone destruction).
The latest tool in the Optima implant family, the Optima HD performs traditional high-dose implants and an expanding range of applications in sub-65-nm device manufacturing. The low-energy, high-dose system offers a wide energy range of 200 eV to 80 keV, enabling customers to cover all traditional high-dose implants while providing significant mid-dose applications overlap for maximum versatility and capital efficiency. The tool also supports molecular and hydrogen implants for emerging dual-poly-gate and silicon-on-insulator applications to improve device speed and performance. The system delivers precise implants using advanced spot-beam technology, which ensures that all points across the wafer see the same beam at the same angle, resulting in excellent implant repeatability. In addition, the system uses proprietary RadiusScan technology, a hardware feature that enhances productivity and allows the system to cover a broad dose range, enabling customers to address both traditional and emerging high-dose implant needs.
The Aquarius II DI-water heater provides advanced temperature control over varying flows. Dual heater systems and special controls provide a preheat and final-trim heat stage for precise control. When the process demands it, an internal recirculation system provides a low trickle of instantaneous hot DI water or prevents flow entirely. Improved patent-pending fittings reduce the possibility of water leaks over time and at various temperatures. The unit provides improved temperature stability and does not require a nitrogen or clean-dry-air purge.
Miniature Isolation Valves
Five fully customizable miniature isolation valves feature a flexible mix-and-match construction that is determined by solenoid shell size, manifold mountability, and flow configuration. Valve shells are available in 0.38-, 0.75-, and 1-in. diameters to correspond to orifice diameters from 0.032 to 0.125 in. A selection of two-way normally open, two-way normally closed, and three-way configurations is offered. The isolation design effectively restricts fluid contact to the valve diaphragm and body, which are made of inert materials. Standard valves are constructed with chemically inert PTFE-wetted materials. For other mechanical- and chemical-compatibility requirements, PEEK, PPS, or Tefzel are available for the body material, while EPDM, Viton, or perfluoroelastomer are available for the diaphragm material.
Wafer-Flatness Metrology Tool
In addition to measuring wafer thickness, flatness, and bow and warp, the WaferSight optical flatness system measures wafer-edge rolloff , which is critical in lithography and CMP processes. The instrument reports wafer-edge rolloff as ESFQR for lithography applications or ZDD for CMP processes (indicating wafer-edge status). Based on proprietary optical laser interferometry, it performs high-resolution, high-throughput mapping of wafer sites, global flatness, and shape. The repeatable and accurate tool supports the site-flatness specifications outlined in the 2005 International Technology Roadmap for Semiconductors for the 65- and 45-nm nodes. A multifunctional in-line metrology system used by wafer suppliers and end-users to perform incoming quality control and R&D applications, it uses noncontaminating edge grippers to handle both 300- and advanced 200-mm wafers.
A small industrial servomotor, the MM provides unlimited linear or rotary motion with 0.17N of driving force and velocity up to 250 mm/sec. The motor measures 9 × 17 × 5 mm and weighs 5 g. It works with the company’s standard amplifiers and any servo control and can be integrated into most bearing structures. The motor provides excellent move and settle characteristics and is suitable for vacuum applications. Its compact packaging and ability to drive linear or rotary devices makes it well suited for semiconductor applications.
Scatterometry Acceleration Tool
Accent Optical Technologies
Part of the CDS Accelerate suite, Matchbox is an advanced computation engine that enhances the productivity of scatterometry-based critical dimension and profile metrology systems for tool and process control applications. The comprehensive library approach of grating diffraction signature matching ensures measurement precision and reliability. Matchbox addresses the requirement of ever-finer profile resolution, managing and processing this function parallel to signature acquisition by the CDS200 systems. Implementation of the matching utility improves the cost of ownership and offers a rapid return on investment by increasing metrology throughput by up to 20%. Additionally, the system’s hardware and software maximize metrology tool utilization, enabling operators to use multiple libraries and perform flexible sampling strategies and line balancing. With its scalable architecture, the system can be upgraded as computation demands increase.
Bonded Door Seals
DuPont Performance Elastomers
Kalrez bonded door seals are used in 200- and 300-mm CVD, etch, and ashing production equipment platforms. For example, they are employed in Monovat bonded door seals (illustrated). The perfluoroelastomer seals withstand semiconductor process media, including reactive plasmas, at temperatures as high as 327°C while helping fabricators reduce particles and cut costly downtime. The seals outperform conventional O-rings in slit-valve and gate-valve door-seal applications. They also reduce the rolling and twisting during door actuation that result from doors being held in a fixed position. These innovations can lead to extended seal life. The seals are designed for HDPCVD, PECVD, SACVD, low-k CVD, metal CVD, and etch and ash applications.
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© 2007 Tom Cheyney
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