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The DV-38DS from SEZ replaces the eight standard chambers in the 300-mm DV-38 tool with eight double-side process modules, enabling simultaneous removal of wafer front-side polymers as well as backside organics and particles. Using DSP+ chemistry followed by DI water on both sides of the wafer, the double-side module eliminates the need for customers to perform multiple individual cleaning steps or to use immersion (batch process) tools. Simultaneous front- and backside processing using an acidic aqueous solution such as DSP+ (which does not cause the same cleaning problems as basic solvent-based polymer removers) eliminates DRAM-formation residues while meeting memory devices’ tight delivery windows and high-volume requirements. The single-wafer platform features onboard chemistry, a progressive user interface, and an advanced system for handling 200- and 300-mm wafers. Information: (Semicon West, North Hall, Booth 5368)

JEOL offers remote capability for transmission electron microscopes (TEMs) using a laptop computer with a cellular network connection. Wireless broadband capability enables users to operate microscopes from outside of the lab environment. Equipped with the Sirius remote control system for TEMs, users can view atoms from any location where a wireless connection is obtainable. Even if users are located thousands of miles from a microscope, they can image atoms for semiconductor research or perform material analysis. Remote operation makes it possible for universities and research labs to share microscope time with students or researchers from other organizations. Wireless broadband further expands the flexibility of TEM operation. Information: (Semicon West, South Hall, Booth 1101; West Hall, Booth 7310)

PI (Physik Instrumente) has received a U.S. patent for its development of an innovative means of increasing resolution in existing D/A converters without additional hardware. This technology enables the company to provide higher-resolution piezo-driven nanopositioning devices at a lower cost. The technology will be marketed under the trade name HyperBit. HyperBit is a fundamentally flexible technology that can benefit virtually any application where the DAC update rate exceeds the responsiveness of the rest of the system. It works equally well in open- and closed-loop situations. In closed-loop systems it can exist upstream or downstream from the servo. It can also reduce higher-order granularity-driven artifacts. Information: (Semicon West, North Hall, Booth 6147)

The SF-100 system from Intelligent Micro Patterning can be used for micronumbering of individual components. A maskless photolithography system, the SF-100 utilizes patented Smart Filter technology, licensed by the company from the University of South Florida. Smart Filter incorporates proprietary microoptical techniques to rapidly project master images directly onto diverse substrate materials without the use of photomasks. It can be used by silicon wafer fabricators for individual die marking. By combining the ability to quickly pattern in the mesoscale region without photomasks, users can place unique markings in areas on devices that were not possible in the past.

Dow Corning has been granted a patent in Japan covering the use of silicon carbide barrier films between dielectric and metal layers. Silicon carbide barrier technology is essential in the production of leading-edge devices, which use copper dual damascene conductors and low-k dielectric insulators. A silicon carbide barrier layer prevents copper metallic species from diffusing into and contaminating neighboring dielectric film layers in the chip interconnect structure. As a result, chip manufacturers can continue to build smaller and faster devices. Information:

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