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MicroMagazine.com

Litho survey reveals splits

DATA PROVIDED BY SEMATECH; ILLUSTRATION BY KAREN SEMANEK

A n anonymous survey of attendees at the Sematech-sponsored Litho Forum in May reveals both consensus and disagreement on the likely technology choices for future manufacturing generations. As the above graph shows, most of the participants—representing a mix of chipmakers and equipment material suppliers—agreed that a water-based, single-exposure 193-nm immersion (193i) lithography approach was preferred for the 45-nm half-pitch in 2009. But for what was seen as the introduction of 32-nm half-pitch in 2012 the respondents split, with the single largest group selecting EUV lithography, but a nearly equal number preferring either an extension of 193i single-exposure or the advent of immersion double-exposure technologies. But responses examined from those representing IC companies only revealed a large interest in 193i with high-refractive-index materials for 2012, according to Sematech. EUVL was the dominant choice for the dawn of 22-nm half-pitch in 2015 (although a handful of respondents chose nanoimprint lithography).

“The surveys indicated an aggressive adherence to the half-pitch targets identified by the International Technology Roadmap for Semiconductors,” explained Michael Lercel, Sematech’s recently appointed director of lithography. “However, cost concerns for new approaches are in the forefront of many people’s minds.”


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