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Back Issues of MICRO magazine

1999 Back Issues | 1998 Back Issues | 1997 Back Issues

November/December 2000 | October 2000 | September 2000

July/August 2000 | June 2000 | May 2000 | April 2000 |

March 2000 | February 2000 | January 2000


November/December 2000
Selected Contents

EDITOR’S PAGE
MICRO R&D ROUNDUP
  • The R&D Roundup provides a glimpse of the university and governmental research being conducted internationally in the semiconductor field. Issues addressed in this special year-end section include interconnect, environmentally friendly processes, low-k, copper, the role of partnerships, and the status of mentors and students.
TOP 40 PRODUCT ALLSTARS
  • MICRO readers have chosen the 40 most popular products of 2000, including wafer shipping boxes, transport robots, lithography tools, copper-cleaning products, mass-flow controllers, wafer dryers, copper-stripping systems, and an array of valves, regulators, sensors, pumps, and detectors.

October 2000 - Selected Contents

EDITOR’S PAGE
INDUSTRY NEWS
  • Lead Story: Silicon Valley plugs away to cope with region's ongoing power pinch
  • Lefty: Not feeling chipper
  • Breakout: European chip equipment initiative succeeds in putting region's toolmakers on world map
  • World Beat:
    Asia: Motorola invests more in China; Cymer opens center in Hsinchu; Philips expands in Shanghai
    Middle East: Tower chooses M+W Zander to build Israeli fab
    Europe: LGInternational signs ITS as European distributor
  • 300-mm Imperative: Japanese firm orders Entegris FOUPs; 300-mm wafer toolmakers to see eightfold jump in revenues; FEI inspection tools installed at pilot facility; electronics manufacturer buys Axcelis dry resist removal tools
  • What’s Going On: Electronica 2000, Semicon Japan, and more
  • 'Round the Circuit: Corning to focus on ULE glass for lithography; FSI to close two California facilities; SEMI sponsors EHS award; Kinetics buys itself out from USFilter; ICE publishes report on 400 IC makers and suppliers
  • Expansions and Acquisitions: GaSonics enlarges plant, moves HQ; DPI begins production on new mask lines; Corning ups calcium fluoride production; General Chemical installs IPA unit; Air Liquide opens oxygen site; Photronics takes majority stake in Precision Semiconductor Mask
  • On Display: Team to develop passive-driven polymer organics LEDs

TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products: Inspection microscopes, fiber-optic amplifier, residue remover, quartz cleaning tool, plasma doping system, fabwide wafer-transport system, plasma impedance monitor, evaporation system, mass-flow controller, film metrology software, wafer treatment systems, heat exchangers, and more
  • Product Extra! Supplier offers advanced CMP slurry characterization; vendor's filter capsule expedites changeouts in photoresist applications; manufacturer expands sensor line; components maker enhances CMP retainer rings; ESD firm converts ionizing blowers; instrument maker reports on proximal probe technology, and more

September 2000 - Selected Contents

EDITOR’S PAGE
INDUSTRY NEWS
  • Lead Story: Metrology sector seeks methods to measure up to new challenges
  • Lefty: Only a wee bit Moore?
  • Breakout: Opening start-up's first plant, outsourcing veteran sees vindication and consolidation
  • 300-mm Imperative: Applied claims 21-tool launch; Selete approves FSI tool
  • International Sematech Watch: IMEC, Sematech enter R&D gate project; workshop agrees on soft pellicles
  • World Beat:
    Asia: Siemens, Intel, Macronix to build Thai fab; Mitsubishi, Honeywell form wet-process chemical alliance; Komatsu, Ushio launch excimer laser business
    Europe: Motorola opens Romanian center; Lytron hires AMS Thermotech as UK distributor
    Africa: BOC Edwards, Pelchem to build plant in South Africa
  • Fab Forecast: DRAM production, 300-mm fab growth to spur tool sales
  • Supply Chain Update: SemiSales.com debuts at Semicon West
  • Expansions and Acquisitions: Advanced Energy buys EMCO; ATMI purchases ESCA; BOC, ISinc form strategic design tool alliance; MKS acquires Spectra International; Sitek becomes Prodéo
  • What’s Going On: Ultrapure Water Asia, Semicon Southwest, and more
  • 'Round the Circuit: NIST wafer improves RTP; ASTM issues new wiper standard; SEMI hosts FPD show with EIAJ and JEIDA; ANSI okays IEST to write standards; MRS issues call for papers

TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products: CMP system, dry pumps, inspection systems, lithography platform, birefringence measurement, SIMS tool, feedthrough actuator, XRF elemental analyzer, CMP slurry cleaning systems, particle detection system, silicon-on-quartz wafers, yield management software, linear motion guide, flame detector, brushless linear motors, Teflon bellows, rapid thermal processing tool, poly etch system, critical dimension SEMs, flow switches, web-enabled tool connectivity, metrology tool, plasma etch tool
  • Product Extra!

July/August 2000 - Selected Contents

EDITOR’S PAGE
INDUSTRY NEWS
  • Lead Story: Meeting continues industry drive to chip in on economic model
  • Lefty: Self-assembly required
  • Dept. of Corrections
  • Breakout: Increased response rate expected as SEMI introduces electronic standards balloting
  • Breakout II: Infineon, Intel announce 300-mm expansion plans
  • World Beat:
    Asia: SEZ opens Singapore office; AMD, Fujitsu to build flash memory plant
    Europe: Infineon joins EUV effort; Micronas to extend fab
  • 300-mm Imperative: Sematech, Selete publish on-line info; Soitec to make SOI wafers
  • Expansions and Acquisitions: Timbre, Tokyo Electron vets launch software start-up; O¹Brien buys Cardinal; KLA-Tencor to build new plant
  • Photo Gallery In the bag
  • Supply Chain Update Adept backs e-biz
  • What’s Going On: FPD Expo Korea, Diskcon, and more
  • 'Round the Circuit: FSI teams on green project; Novellus claims low-k success

TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products: Copper-stripping service, nylon tubing, chemical delivery system, process control software, RTP system, quartz heater modules, flow control valve, data-mining tools, fluid-handling components, gas purifier, IPA drying system, spin processor, thick-film photoresists, electro-copper deposition system, wafer-testing probe, high-purity piping, nanoscale profilometer, flowmeters, CMP metrology system, process management systems, and more
  • Product Extra!
  • Products in Action: Automating slurry delivery reduces labor, improves data collection, increases yields
    Products in Action II: Design of experiments software helps clear wafer transport traffic jams

June 2000 - Selected Contents

EDITOR’S PAGE
INDUSTRY NEWS
  • Lead Story: New standards give chipmakers the power to maintain their yields
  • Lefty: VCs back ICs
  • Breakout: ASMC 2000 reaches past process issues to target range of semiconductor manufacturing topics
  • Breakout II: NEC says Internet advances led chipmaker to build "world¹s most-advanced" LSI fab
  • World Beat:
    Asia: SCP builds lab in Singapore; Boin wants Nanyang for wafer map distribution
    Europe: Applied expands in Europe; Oxford opens cleanroom lab in UK
  • Photo Gallery Application specific
  • Supply Chain Update The Supply.com, NexPrise link suppliers, buyers; SEMI forms e-biz board
  • Expansions and Acquisitions: Eaton expands; QAM completes buyout; Tower to make ICs for National; partners create Mosaic
  • Photo Gallery II Bavarian interlude
  • 300-mm Imperative: STMicroelectronics, Philips to build pilot line; SEZ to deliver spin processors to Semiconductor300
  • What’s Going On: Semicon Taiwan, BACUS, and more
  • 'Round the Circuit: FSI teams on green project; Novellus claims low-k success

TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products: Overlay metrology tool, cleanroom boot, wafer transport robot, XRF analyzer, height-adjustable workbench, etch manometer, power supplies, airflow measurement system, computer workstations, and more
  • Product Extra!
  • Products in Action: Control system speeds start-up and stabilizes process air in DUV litho tool clusters

SEMICON West 2000


May 2000 - Selected Contents

EDITOR’S PAGE
INDUSTRY NEWS
  • Lead Story: IBM announcement may boost fortunes of low-k spin-on method
  • Lefty: Doing their homework
  • Breakout: Trend to Web-based suppliers continues; new e-commerce parts firm sets July launch
  • Breakout II: Toshiba transfers "robust" submicron process technology to Tower for new foundry in Israel
  • World Beat:
    Asia: TSMC opens world¹s largest fab; DPI adds mask lines; Photronics buys PSMC; Powerchip to build fab in Hsinchu
    Europe: French atomic energy agency to explore EUV lithography
  • Photo Gallery Capacity boost
  • Expansions and Acquisitions: Novellus, GaSonics to develop photoresist and residue removal techniques for copper structures; Veeco buys CVC, parts of IBM AFM product line; SEZ, Ashland partner on polymer-cleaning chemistries; Solkatronic expands two sites
  • 300-mm Imperative: Sematech, Selete to develop 300-mm software; UMC, Hitachi form Trecenti
  • What’s Going On: Semicon Kansai, CleanTech 2000, and more
  • 'Round the Circuit: Sematech completes first-phase evaluations of low-k films; Motorola, EVG make mask-coating technology available; NIST agrees to offer Productivity¹s lean manufacturing course; Vortek claims breakthrough with annealing technology

TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products: Lithography scanner, ESD-event monitors, bulk-chemical control system, flat-panel monitors, static-dissipative linear slides, temperature probes, in-line batch sputtering system, liquid-level sensors, wafer dryer, surface-measurement sensor, interferometric camera, copper-cleaning products, pressure transducer

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April 2000 - Selected Contents

EDITOR'S PAGE
INDUSTRY NEWS
  • Lead Story: New ESH report details ways to cut fab water, energy costs
  • Lefty: Spare the rod
  • The Micro Interview Green research center's Shadman: "ESH has to be at the heart of process development"
  • Breakout: MIT lab makes world's smallest gate length transistors using direct optical lithography
  • Photo Gallery The next step down
  • World Beat:
    Asia: UMC, IBM, Infineon collaborate on 0.10-µm tech; Adept chooses Marketech to sell in Taiwan
    Europe: SEMY signs Teltec as rep
    Middle East: Jon Goldman provides Israeli fab with software upgrades
  • 300-mm SUNY thin-film tech center gets more funding from NY; 300-mm fab push boosts tool sales
  • Expansions and Acquisitions: Steag purchases CuTek; Honeywell Electronic Materials to enlarge California research center; Semifab expands plant, signs agreement with Lucid; BOC to buy Kachina; Cintas acquires Mission Industries; August moves to new site; Air Systems expands
  • What’s Going On: MRS, Cleanrooms 2000, and more
  • 'Round the Circuit: International Sematech reports copper successes; SEMI president heralds golden age; ASML MaskTools, Mentor collaborate on photomasks; Corning, Photronics agree to develop photoblanks

TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products: Ion implanter, ash-residue remover, slurry filter capsule, 300-mm shipping box, microprocessor module, liquid-level sensors, ESH-protective polypropylene, liquid-flow controller, vacuum-chamber flange, stripping solvent, fluorine monitor, laser-scan micrometer, gas system components, wafer clamp ring, pressure sensors, chemical delivery system fittings, pressure transducers, chemical-processing station, liquid-level sensor, flip-chip lithography tool, level-sensor controllers
  • Product Extra!

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March 2000 - Selected Contents

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EDITOR'S PAGE
INDUSTRY NEWS
  • Lead Story: Supply industry veterans get set to launch on-line materials sites.
  • Lefty: Black magic
  • The Micro Interview Intel's Mike Splinter to suppliers: Improve your technology, lower your costs, get more agile
  • Breakout: Is the downturn officially over? Intel's open pocketbook seems to say 'Yes'
  • World Beat:
    Europe: STMicroeltronics signs agreement with Tecdis and Three-Five Systems to make driver chips; Naltex opens office in UK; Union Miniere invests in Performance Materials
    Asia: Cabot Builds CMP slurry plant in South Korea
  • On Display: USDC contract with Kurt J. Lesker to promote development of flexible OLED panels; Kodak, DuPont join USDC; changes in substrate size pose challenge to TFT-LCD manufacturers; Three-Five exec chosen chairman of USDC's governing board of directors.
  • Expansions and Acquisitions: KLA-Tencor acquisition of Finle Technologies to facilitate 0.13-µm process; Transition technology International changes name to TTI Silicon: BOC Edwards opens lab focusing on copper chemistries, Aeronex signs purifier pact with Supelco; MRL to up furnace capacity; QC Solutions hires Palmborg Associates as sales rep
  • What’s Going On: IFST 2000, Diskcon Japan, Estech 2000, and more
  • 'Round the Circuit: Wright Williams & Kelly offers free on-line calculator to decipher the ITRS; same suppliers top TOP 10; Cypress Information Resource database contains info on 1400 semiconductor manufacturers; Applied cleans up

TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products: Spin processor, vacuum valve, die carrier, wafer loader, thin-film analyzer, particle size analyzer, digital MFC, gas purifiers, 300-mm thermal processor, electrochemical depostition system, KrF excimer laser, thin-film metrology system, CMP polishing pad, fab automation package
  • Product Extra!

SEMICON

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February 2000 - Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS
  • Lead Story: Irish start-up senses plasma turning point down the road
  • Lefty: A hands-on tour
  • Breakout: On the hunt for foundry capacity, TSMC announces mergers with WSMC, Acer
  • World Beat:
    Asia: Mitsubishi builds HP plant; SRC admits UMC Group as first overseas member; Air Products buys Korea Industrial Gases; M+W Zander to design Korean cleanroom; Tescom Korean branch debuts
    Europe: STMicroelectronics chooses Extraction gear in France; IMEC installs Verteq tool
    Africa: BOC, AEC team up to build plant in South Africa
  • Expansions and Acquisitions: Air Liquide opens air separations plant; Wacker, Arch launch CMP slurries joint venture; ATMI reorganizes materials business; Aera touts InPod buy
  • Microlithography 2000 Special section on 25th annual symposium features metrology conference shift to defect detection, show exhibitor list
  • On Display: Philips signs deal with Rainbow Displays; Three-Five/Mitsui expand agreement; Kingroup integrates Adept robots
  • 300-mm Imperative: TSMC breaks ground for Hsinchu fab; Hitachi, UMC to build fab; GW Associates offers component object model-based server
  • 'Round the Circuit: TSMC, UMC offer copper devices; Graham becomes president of SISA; alliance pushes Ethernet, TCP/IP in industrial automation; Honeywell, Microbar sign spin-on materials delivery deal
  • What’s Going On: DUMIC, SPWCC, and more
  • Photo Gallery

TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products: DUV Spectrophotometer, surface-mount gas delivery system, high-density plasma sources, 3-D SEM, glass-ceramic connectors, FTIR metrology tool, vacuum gauge, disk measuring system, particle counter, vacuum chamber, SEM review system, automated manufacturing software, UPW piping system, mass-flow controller, contact-angle measuring systems, CVD metrology system, cylinder-pressure regulator, and more
  • Product Extra!

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January 2000 - Selected Contents

  • EDITOR'S PAGE
    INDUSTRY NEWS
    • Lead Story: Suppliers ponder whether chip technology map is road to ruin
    • Breakout: Display Works 2000—Display industry's push to larger panel sizes continues to pull at production yields
    • Breakout: SIA backs year-plus study to assess fab cancer risk
    • Photo Gallery: Implantation augmentation
    • World Beat:
      Asia: Cabot to open plant in Geino, Japan; Hakuto agrees to sell Extraction Systems filtration products; Hyundai Electronics, GaSonics form joint development pact for <0.13-µm DRAMs; Asyst signs partnership pact with MECS; J.T. Baker contracts Dong Woo of South Korea to make strippers
      Europe: AMD opens new fab in Dresden, Germany
    • 'Round the Circuit: Chipmakers, equipment manufacturers join forces to expand Scalpel litho technology, NIST assists MEMS projects; VLSI Standards to use MIT technology to make CMP reference wafers
    • Expansions and Acquisitions: Court okays SubMicron sale to Akroin; Entegris buys Mace; SET sets up new site in California; Ultratech, Shin-Etsu sign pact to evaluate photoresists; Silicon Genesis opens Class 1 site; Process technology enlarges Class 100 cleanroom; DPI ups mask capacity; Lam buys cleaning technology from Oliver
    • What’s Going On: Semicon Korea, SPIE Microlithography, and more

    TECHNICAL ARTICLES
    • Building Copperopolis II: Using a wafer backside spin process to eliminate contamination in copper applications A spin-process technique prevents back-surface particle contamination of the process chuck, creates an edge exclusion zone, and optimizes the copper/barrier material interface.
    • ITRS Update: Comparing the defect reduction sections of the most recent versions of the roadmap The International technology Roadmap for Semiconductors details the challenges of finding ever-smaller needles in an ever-larger haystack.
    • Ultrapure Fluids: Identifying organic contaminants in ultrapure water at sub-parts-per-billion levels Unlike existing methods, a combination TD-GC-MS technique can identify semivolatile compounds, such as phthalates and siloxanes, which can affect wager and disk-media processing.
    • Defect and Yield Analysis: Reducing baseline defect density through modeling random defect-limited yield Partitioning yield into random and systematic components and partitioning the random defect-limited yield component heightens defect reduction efforts and enhances yields.

    PRODUCT TECHNOLOGY NEWS

    • Products: Wafer inspection system, implant monitor, air sampler, mass-flow controller, microwave analyzer, recycled-waferscrubber, deep-UV excimer laser, plasma characterization probe, ESD-certified garments, Teflon process bath, optical spectrograph, polyimide machining stock, servomotor brakes, fume extractor

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