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MicroMagazine.com

Back Issues of MICRO Magazine

December 2004 | October/November 2004 | August/September 2004
July 2004 | June 2004 | May 2004

April 2004 | March 2004 | January/February 2004


December 2004
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS


October/November 2004
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: New report examines challenges of CMOS extension and beyond
  • Breakout: Intel ramps up EUV litho development, installs exposure tool, sets up mask line
  • Lefty: Chip-scale clock
  • Japan Beat: Suppliers boost regional efforts
  • 'Round the Circuit: SIA seeks help for epidemiological study; TEL, LETI collaborate; flexible display R&D funded; Trikon lands MRAM funds; MuGFET shows process capability
  • Expansions, Acquisitions & Alliances: Litho leads partnering parade; ASMI sets Singapore plant; AMAT buys Metron; Kodak snaps up National unit
  • E-manufacturing: Interface A deployment, automated decision-making tools essential for full fab automation
  • Columnist Bijan Moslehi says roadmap must combine technology, business factors

TECHNICAL ARTICLES
  • Special Apps: Advancing real-time DRIE silicon trench etch-depth monitoring in MEMS applications
  • Materials Integration: Using an ICP-based strip system to perform resist and barrier-layer removal in copper low-k processes
  • APC/AEC: Eliminating scrap through process and equipment control based on interactive learning
  • Defect/Yield Analysis: Using an E-beam method and line monitoring to perform in-line inspection
  • Tool/Fab Support Strategies: Maximizing tool uptime and process stability through an RF system upgrade

PRODUCT TECHNOLOGY NEWS

  • Products: Photomask repair system, gas-flow calibrator, ion implanter, electron probe microanalyzer, thin-film deposition controller, aqueous develop/etch tool, excimer laser micromachining, sample-preparation platform, stainless-steel gas springs, wireless autoleveling sensor, wireless maskmaking sensor, linear CD source, FPD measurement tools, mask metrology system
  • Product Extra!: Vendor offers RF atom source/RF ion source conversion kit; enhanced litho software enables n-point alignment of multiple points on different layers; particle measurement products include dual air-filtration system; software package allows users to set up and monitor controllers; supplier modifies inorganic purification media to include CO filtration capabilities

August/September 2004
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: Semicon West wrap-up:
    New materials, 300-mm tool
    changeover test industry mettle
  • Sidebar: Semiconductor industrial park set for California-Mexico border
  • Lefty: A chip and a prayer
  • The MICRO Interview: MEMC's Nabeel Gareeb
  • Market Outlook : China tool market booms
  • 'Round the Circuit: Cypress opens tech center; Soitec, ASM push sSOI; CD-ROM explores MEMS; ULSI metrology conference issues call
  • Expansions, Acquisitions & Alliances: Immersion picks up steam; M&A activity continues; Samsung expands Austin fab; Siltronic opens 300-mm plant; Micron to fab NAND; BOC, IMEC get supercritical
  • Alan Weber: Facing the challenges of APC's second decade
THE HOT BUTTON
  • Interconnect: Etch, deposition, cleaning, and materials challenges line the road to 45 nm
  • Columnist Bijan Moslehi comments on full fab automation
TECHNICAL ARTICLES
  • TechEmergent: Combining thermal waves and a signal-processing algorithm to characterize USJs
  • Behind the Mask: Using OASIS to contain the size of data files in the manufacture of photomasks
  • Tool/Fab Support Strategies: Purging FOUPs that open to front-end minienvironments using an inert-gas curtain

PRODUCT TECHNOLOGY NEWS

  • Products: RTP system, electro CMP tool, capacitance vacuum gauge, ultrathin wafer backgrinding, gas-cluster ion-beam system, single-wafer electroplater, 3-D surface analysis instrument, lithography filter system, CMP platform, sputtering system, optical digital profilometry system, moisture analyzers, rotary actuator, excimer laser, TOC analyzers, thin-film measurement tool, silicon wafers, photomask CD measurement tool, copper electroplate filter cartridges, front-opening unified pod
  • Product Extra!: COO software line adds metrology analysis module; supplier awarded patents for nanolayer deposition of conformal thin films; brochure spotlights HPLC front ends for mass spectrometry; high-resolution module performs automated macrodefect inspection on CMP tools; vendor granted patent for silane flash arrestor

 


July 2004
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: Service, spares management deals extend Applied's global fab reach
  • Lefty: Fab pit crew
  • The MICRO Interview: Texas Instruments' Hans Stork
  • Market Outlook : Metrology measures up
  • 'Round the Circuit: Semicon West reunifies in 2005; spintronics center formed; SPIE Microlithography, ASMC call for papers
  • Photo Gallery: High Tech U
  • Expansions, Acquisitions & Alliances: IC manufacturers expand 300-mm-based capacity; Nantero, LSI go nano; three alliances bolster membership; STMicro, Si Auto sign control agreement; Sematech, Zeiss to develop AIMS for 193-nm masks; Surface Technology Systems, Jobin Yvon claim MEMS etch control advances; Integrated Materials scores funds
  • Metrology: Starting-material, engineered-substrate demands put
    added pressure on wafer suppliers, metrology providers
  • Columnist Bijan Moslehi looks at 300-mm manufacturing
TECHNICAL ARTICLES
  • Special Apps: Introducing wide-band-gap silicon carbide production into a silicon fab
  • Dry Surface Technologies: Using a tungsten plasma clean process to reduce metal shorts caused by CMP microscratches
  • Critical Materials: Understanding the new SEMI standards for stainless-steel welding applications
  • Green Manufacturing : Achieving closed-loop process control of DI-water replenishment
  • Failure Analysis : Adopting low-voltage STEM and automated sample prep to perform IC failure analysis
  • AEC/APC: Solving process issues at an ASIC fab using design of experiments

PRODUCT TECHNOLOGY NEWS

  • Products: Analysis tool, differential pressure controller, benchtop weld head, atomic-layer deposition system, fab data integration package, deposition bath control system, conductive AFM module, ball valves, miniature guideway module, manufacturing execution system, fluorine dry pumps, micromachining laser system, and more
  • Product Extra!: ALD module boosts deposition rates; vendor rents out e-diagnostics suite; technology measures copper overburden thickness on platers; Internet site offers wafer foundry marketplace; metrology system shipped on MOCVD reactors

June 2004
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: ALD maps out its place in the nanometer-scale world
  • Lefty: Edge cutters
  • Breakout: New photomask facility in Dresden combines R&D, pilot, and production lines
  • Breakout: Rudolph, SCP Global grab first-to-market honors with new product launches
  • 'Round the Circuit: Crolles2, LETI ink R&D pact; Singapore Economic Development Board, KLA-Tencor partner; Qcept scores funds and O'Neill; NanoVance launches
  • Expansions, Acquisitions & Alliances: Infineon expands Virginia fab; Entegris finds FOSB partners; TEL, Mattson collaborate; Air Products wheels, deals; AMD opens innovation centers
  • Lithography: Complexity, costs, infrastructure, and data-file size among challenges facing photomask community
  • Columnist Bijan Moslehi examines integrated metrology
TECHNICAL ARTICLES
  • TechEmergent: Measuring Young's modulus of low-k dielectrics using surface acoustic waves
  • APC/AEC: Optimizing STI etch process control using optical digital profilometry
  • Defect Yield Analysis, Metrology: Using an in-line defect-analysis tool to provide real-time root-cause knowledge of yield loss
  • Thermal Processing: Using a noncontact stacked-hot-plate system to cure spin-on dielectrics
  • Materials Integration: Evaluating the use of single-wafer wet cleans with organic spin-on dielectric materials

SEMICON WEST 2004

  • The special section features a rundown of show activities.

PRODUCT TECHNOLOGY NEWS

  • Products: Equipment control system, air diaphragm valve, diamond CMP pad conditioners, atomic-force line monitor, dry/wet lithography system, x-ray metrology tool, PVD cluster tool, ozonated-water delivery system, high-purity arsine, HEPA filter, single-wafer cleaner, 300-mm wafer/carrier handler, real-time factory cost model, dc plasma power supply, flare connectors, decentralized control system, cleanroom wipers, Ethernet/IP gateway, front-end module, metrology tool
  • Product Extra!: Vacuum chuck stage accommodates large samples; slide chart links potential lost revenue to inaccurate gas mixtures; vendor awarded patent for multilayer composite dielectric film concept; supplier offers assured shipping time program; catalog summarizes electronic switches, sensors, transducers

May 2004
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: SIA backs fab cancer study critics have long demanded
  • Lefty: It's, uh, Small World
  • Market Moves: M&A activity escalates
  • Breakout: Enhanced TEM tool used to break subangstrom image-resolution barrier
  • Breakout: SevenStar to contract manufacture Aviza systems for Chinese domestic market
  • 'Round the Circuit: Advanced Materials Research Center plan unveiled; Varian, ISE enter joint-development pact; China scholarships launched by SEMI; Mallinckrodt Baker expands stripper recovery program; FSA issues design kit guide; HCL showcases e-diagnostics framework
  • Expansions, Acqusitions & Alliances: Chartered ramps 300-mm fab; Fujitsu, NEC to build 300-mm facilities; Sony, Samsung join LCD forces; IMT builds gas sensors for Ion Optics
  • Fab Automation/Integration: Flexibility, interoperability, contamination control among keys to highly automated factories
  • Columnist Bijan Moslehi concludes his examination of the wafer-cleaning market
TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products: Multiple metrology tool, dry pump system, high-torque stepping motors, trace-moisture analyzer, vision sensors, vibration-isolation workstation, support bearing units, day tanks, mass-flow controller, GC-MS vacuum upgrade kit, confocal laser microscope, humidifier, bar code tool, arsine purifier, direct-drive rotary tables
  • Product Extra!: ICP-MS tool offers reliable method for measuring ultratrace metallics; liquid-level, flow, and pressure sensors catalog issued; immersion lithography simulation software updated; vendor provides UV excimer laser refurbishment services

April 2004
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: Metrology start-ups, spin-offs turned up business in downturn
  • Lefty: Mirror, mirror
  • Market Outlook: Smooth growth for slurry
  • Breakout: Infineon builds nanotube-based power transistor using standard processes
  • 'Round the Circuit: Nikon ups ArF ante; Microfabrica scores funds; ASMC returns to Boston; IC video training course released; UPW standard under review
  • Expansions, Acqusitions & Alliances: Sony/Toshiba, Samsung/IBM/Chartered/Infineon form chip alliances; Fairchild invests in PA fab; ASM buys NuTool; groups of suppliers join hands; X Initiative gains momentum
  • Interconnect: Concerns about low-k integration, extendability dominate debate
  • Columnist Bijan Moslehi examines the wafer-cleaning market
TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products: Defect-detection system, CMP monitor, atomic layer deposition valve, spray-coating tool, FTIR moisture analyzers, ArF excimer light source, miniature linear stage, ozonated-water delivery system, videographic recorder, dual-output pressure sensor, TOC analyzer, pressure transmitters, wide miniature linear guides, LED lift-off system, filtration capsules, FPD process-optimization sensors, panel-mount controllers
  • Product Extra!: Adapter allows lithographers to use filter capsule with filter media; Spanish-language Web site for membrane contactors launched; nanopositioning stage offers enhanced scanning control mode; x-ray diffraction software packages adopt XRDML data platform; vendor provides cost-modeling e-zine

March 2004
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: Liquid lithography technology waits for defect data to surface
  • Lefty: Strength in numbers
  • Lead Sidebar: Water treatment is 'nontrivial', says researcher
  • The MICRO Interview: Applied Materials' Mike Splinter
  • Breakout: Applied touts low-k progress
  • World Beat:
    Asia: Axcelis, Varian, Ionics, Thomas West, Entegris score Taiwan biz; Samsung awards contracts to Air Products, Praxair; Fujitsu, Sumitomo partner up

    Europe:
    ASM moves operations; Infineon unit taps Suss
  • Market Outlook: Tool market heat wave
  • 'Round the Circuit: IC sector ranks high in safety; static charge RP issued; Albany lands ALD program; Intel funds EUV source work; NanoForum to debut; ICP-MS textbook released
  • Expansions, Acqusitions & Alliances: Dow Corning joins litho fray; MEMC strengthens hand in wafer supply arena; SCP inks JDA with Korean DRAM manufacturer; Rockwood buys Isiltec; litho research center opens at North Carolina State
  • Metrology: Pressures build on tool performance
  • Columnist Bijan Moslehi examines the dawn of the
    e-manufacturing era
  • The show section features a preview of the AEC/APC Europe conference and a list of Semicon Europa programs.
TECHNICAL ARTICLES
  • Special Apps: Investigating the use of spray-coating technology in MEMS application
  • AEC/APC: Applying a simple statistical process control approach to defect monitoring
  • Materials Integration: Reducing costs in spin-on-glass deposition applications
  • Green Manufacturing: Using dissolved ozone in semiconductor cleaning applications

PRODUCT TECHNOLOGY NEWS

  • Products: Large-area stepper, FOUP cleaner, micromachining system, substrate etch tool, nonstandard thermocouple, dry strip platform, e-beam litho modeling software, HEPA and ULPA filters, RF delivery system, gasket filter, high-purity pressure sensor, particle-detection system, postash-residue remover, ultrastiff platforms, wet process tool, flex cable heaters, turbomolecular pumps, data-access software, air-filtration system
  • Product Extra!: DUV coating process improved; patent granted for high-purity quartz electric resistive heater technology; fluid-handling vendor redesigns Web site; supplier receives patent for system that reduces boundary layer thicknessin DIO3 fluid-flow field; fab connectivity system offers new features

January/February 2004
Selected Contents

EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: ITRS Update: Revised roadmap shows hard work ahead for yield drivers
  • Lefty: A good worm
  • Breakout: Chip outsourcing to accelerate
  • World Beat:
    Asia: TSMC, ASML jump into immersion litho; NEC, SVA ink FPD deal, Meiden, AMAT retool in China; KLA-Tencor goes on-line in Japan; BOC scores big in Shanghai
    Europe:
    AMD chooses Dresden for 300-mm fab
  • Photo Gallery: The art of nanoscience
  • 'Round the Circuit: Sematech forms new subsidiary; software simulates EUVL process; NIST uses SAXS to x-ray defects; Chipworks discovers true low-k
  • Expansions, Acqusitions & Alliances: SOI metrology targeted; GEM3 plans AZ chem plant; Molecular Imprints scores funds; NSF signs Actinix; Tegal buys Simplus; TWI upgrades lab; ISMT chooses Technovision
  • New feature presents excerpts of discussion about the challenges facing advanced lithography
  • New columnist Bijan Moslehi examines an industry in transformation
TECHNICAL ARTICLES

PRODUCT TECHNOLOGY NEWS

  • Products: E-beam inspection tool, x-ray diffraction tool, laser rotary encoder, annealing system, automated in-line SEM/FIB system, tantalum sputtering targets, and more
  • Product Extra!: Wafer-cleaning tool enhanced, metrology system software updated, motor catalog published, scan-field i-line stepper updated, and more


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