SEMICON EUROPA EXHIBITOR LIST

Palexpo, Geneva, Switzerland
March 31 — April 2

Geneva's last hurrah as host to Semicon Europa comes when the continent's economy is on an upswing. With storm clouds continuing to hover over much of Asia, the solid economic trends from the Old World are welcome news to those in the semiconductor equipment and materials industry. Double-digit increases in both capital spending and wafer-fab equipment purchases have been forecast, making Europe the best growth region in 1998. This year's show, set for March 31 through April 2 at the Palexpo, will feature more than 900 exhibitors in some 1600 booths as well as a full slate of technical programs and standards meetings.

A special event on Monday, March 30, is SEMI's second all-industry forum, "Setting New Goals for Global Cooperation." The first such summit, held at Semicon Europa in 1994, helped pave the way for pan-industry cooperation on the transition to 300-mm wafers; strong programs dealing with environmental, health, and safety issues; and an increase in information sharing among global companies. SEMI hopes this year's forum will set the stage for similar cooperative ventures in the next millennium. Topics of other technical programs include productivity, trends in microlithography, CMP processing, flat panel manufacturing, MEMS strategies, and 300-mm challenges. Exhibitors and attendees will be envious of their spouses' trip on Wednesday to nearby Annecy, France, where a charming cobblestoned old town looks out over a spectacular Alpine lake. For those working the show, come by Booth 482 and meet the MICRO crew — nous serons heureux de vous voir.

Company Listing:

Company — Booth Number

A

AAF-International — 337

A-B Lasers — 1137

Accuprobe — 1410

Ace — 1767

ACR Automation in Cleanroom — 1780

Acuity — 481

ADE — 1508

ADEC — 1350

Admat Materials — 610

Advance Electronics — 492

Advanced Ceramics — 219

Advanced Delivery & Chemical Systems (ADCS) — 1725

Advanced Energy — 1000

Advanced Energy Industries — 700

Advanced MicroFinish — 376

Advanced Pressure Technology — 812

Advantek — 500

AEA Technology — 434

Aera — 436

Aeronex — 1018

Aetrium — 650

AET Thermal — 1786

AG Associates — 647

AGL — 1409

AGRU — 1447A

AGRU Kunststofftechnik — 693

AIO — 1447A

Air Liquide Electronics — 3011

Air Liquide Electronics Labeille — 2623

Air Products — 225

Aixtron — 1337

AJA International — 1305

Alcatel — 1369

Alcatel CIT — 3011

Alfa Laval/Cardinal Systems — 705

Align-Rite — 1637

Alliance Sales — 477B

AlliedSignal — 1129

Allteq — 477A

Almatec — 1116

Alpha Advanced Electronic Polymers — 2901

Alpha Metals — 2901

Alphasem — 1009

Amecon — 1604

American Mill Sales — 647

American Silicon Products — 800

Amtech/Tempress Systems — 887

Anatech — 493

APD Cryogenics — 1628

Applied Materials — 2423

Applied Mechanical — 1447A

Applied Precision — 829, 1219

Applied Robotics — 1625

Aprova — 946

APS — 484

APT — 1625

ARC — 1447A

Arc Machines — 1204

Arconium Specialty Alloys — 434

Ardmac PCI — 2505

ASA — 1577

Asahi/America — 1447A

Asahi Glass Electronic Materials — 2416

Aseco — 493

Ashland Chemical — 681

ASM — 725, 2601

ASML — 1559

ASP — 1625

Aspect Systems — 647

AST — 215

ASTeX/Applied Science and Technology — 1409

ASTI — 11, 1308

Asyst Technologies — 1451

Atcor — 477A-B, 493

Atlantic Tubing — 1447A

Atomika Instruments — 1636

ATS Products — 2517

ATV Technologie — 642

August Technology — 650

Aurel — 301

AXIC — 1509

B

Baasel Lasertech — 1137

Balzers Instruments — 1581

Balzers Process Systems — 963

B&G International — 829

Barry Controls — 647

BDM — 951

BE Semiconductor Industries — 2801

Bedell — 1700

Benchmark Technologies — 1767

Berkshire — 524

Bernt — 105

Beta Squared — 1237

Bid-Service — 2404

Bionics Instrument — 637

BLE — 493

BLE Laboratory Equipment — 1776

BOC Edwards — 1459

Boschman Technologies — 450

Brewer Science — 834

BriskHeat — 1518

Bronkhorst High-Tech — 109

Brooks Automation — 1629

Brooks Instrument — 1147

Bruce Technologies — 677

Brush Wellman — 434

BSE — 300

N. Bucher — 42

Busch — 334

BYE/Oasis Engineering — 1701

C

Cabot — 647

Caburn-MDC — 1518

CAD Design Software — 1618

Caltechnix — 1705

Cambridge Fluid Systems — 478

Cameca — 3011

Camelot Systems, div. of Cookson Electronics — 2901

Camline — 999

Canon — 459

Carbone Lorraine — 929

Carborundum — 300, 1197

Carsem — 368

Carten Controls — 1500

Cascade Microtech — 468

Cefilac — 929

Centrotherm — 625

Ceramaseal — 921

CerProbe — 547

CFM Technologies — 487

CGS Thermodynamics — 642

Chapman — 215

Chapman Instruments — 947

Chiptronix — 1717

Cicorel — 119

Cimcom — 333

Clariant, Electronic Materials — 1181

Clean Room Consulting — 463

Clean Systems — 438

Cleanroom Technology — 1537

CleanRooms — 1300

Clestra Cleanroom — 1511

Coillard Equipment — 2408

Columbus Precision — 2601

Comco — 493

Comdel — 312, 1000

Comdisco Electronics Group — 644

Commonwealth Scientific — 947

Compression Polymers Group — 1447A

Compugraphics — 350

Comtec — 1786

Comvat — 1246

Concept Systems Design — 1586

Consilium — 509

Containerware — 493

Contamination Control Technologies — 613

CPI — 1409

Craftech Industries — 1608

Creative Design Engineering — 947

Crystal Mark — 901

Crystec Technology Trading — 516

CTI — 647

CTI-Cryogenics — 1429

Cybeq Nano Tech — 1350, 2605

Cybeq Systems — 647

Cybernetix — 3011

Cybor — 647

Cymer — 838

D

Dage Electronic-Vertriebs — 434

Dage Precision Industries — 1135

Dainippon Screen Manufacturing — 1350

Daito Electron — 492

Danish Micro Engineering — 2616

Das Dunnschicht Anlagen Systeme — 334

Data Instruments, Critical Fluids Group — 1018

Data Storage — 1300

Datacon — 437

Daw Technologies — 1105

Daymarc — 1350

Decontrade — 1577

Delatech — 997

Delta Design — 1350

DH Instruments — 1705

Diamond Semiconductor Systems — 1136

Diemat — 434

Digital Instruments — 1762

Disco Hi-Tec — 969

Dockweiler — 201

Donaldson — 1115

Dostec Electronics — 869

Dow Chemical — 1767

Draeger — 401

DruVa — 812

DSM Engineering Plastic Products — 1600

DuPont — 886

DuPont Dow Elastomers — 886

DuPont Photomasks — 325

Dura Tek — 610

Dynamic Micro Systems — 1236

Dynatex — 1350

Dyneon — 1299

E

Eagle-Picher Industries — 404

Eaton — 977

Ebara — 1387

Ecosys — 1134

EDC — 477A, 493

Eichhorn & Hausmann — 829

EKC Technology — 881

Electrochemical Technology — 610

Electroglas — 229

Electro-Graph — 1625

Electrograph — 647

Electron Vision — 493

Electronic Visions — 358

Electrovert — 2901

EMP — 1134

Empak — 1001, 1610

ENI — 1000, 1125

Environmental & Occupational Risk Management — 380

Epitech — 713

Epoxy Technology — 213, 215

Equipe Technologies — 1717

ERS Elektronik — 451

ESEC — 951

Etec Systems — 1576

Etel — 175

ETO — 1409

Euris — 1610

European Semiconductor — 1537

EVAC — 504

Evans Europa-Microscan
Service — 646

Ever Technologies — 477A-B, 493

Expertech — 1136

Exsil — 350

Extraction Systems — 647

F

Fab-Tech — 1016

Fairchild Technologies — 1177

Faith Enterprises — 1447A

Fancort — 493

FASTech Integration — 942

FEI — 1386

FHR Anlagenbau — 2616

Fico — 2801

Fire Sentry — 1718

Flowlink — 939

Flowmeca — 1736, 3011

Fluidix — 1447A

Fluoroware — 647

FME FSI Metron — 647

Forbo-Giubiasco — 1775

Four Dimensions — 215

France Electronique — 3011

Frontier Semiconductor Measurements — 947

FSI International — 647

Fujikin — 1501

Fujimi — 476

Furon — 1201

Furukawa Electric — 476

Futurestar — 613

G

Gaiser Tool — 434

GaSonics International — 1029

GDS Manufacturing — 1242

GE Quartz — 1336

GEMU — 2409

Genmark Automation — 813

Genus — 601, 1350

George Fischer Piping Systems — 1013

Gigamat Systems — 1141

Glegg Water Conditioning — 699

Global Semiconductor Safety Services — 380

GO — 313

Gold Tech Industries — 912

Jon Goldman Associates — 1136

W. L. Gore & Associates — 305

Granville-Phillips — 346

Greene, Tweed — 458

GRESSI — 3011

GTX Marketing — 438

Guardner — 1700

H

Hager + Elsasser — 238

Haldor Topsoe — 101

HCT Shaping Systems — 1012

Heidelberg Instruments — 412

Heraeus Quarzglas — 1025

Heraeus Sensors — 1025

Hewlett-Packard — 1225

High Technology Solutions — 1134

Hillelian Concepts — 1767

Himec — 492

Hitachi Scientific Instruments — 668

Hmreinraum-Technik — 1517

Hologenix — 829

Holtronic Technologies — 1532

Honda Electronics — 638

Horiba — 1312

Hoya — 880

HPS, div. of MKS Instruments — 1363

H-Square — 1625

HTT, High Tech Trade — 493

Huettinger Elektronik — 317

HVA — 1036

Hyprez — 1420

I

Ibis Technology — 33

IBM Global Services — 3005

ICCI — 647

ICD/Heateflex — 1625

ICOS — 1577

ICOS Vision Systems — 3001

ICS Technology (Taiwan) — 438

III-VS Review — 175A

Imtec — 1447A

Imtec Acculine — 1447

IN USA — 933

Inabata — 912

Incam Solutions — 3011

Inelio — 877

Ineris — 3011

Innotec Group — 701

Inspex — 1350

Instrufluid — 438

Instrumat — 1762

Insulator Seal — 1518

Integrated Designs — 710

Intertek Testing Services — 380

inTEST — 241

Ion Beam Services — 1104, 3011

Ion Systems — 405

Ion Tech — 829

IPEC Precision — 1247

Irvine Optical — 947

ISA Jobin-Yvon Sofie — 1316

Ishii Tool & Engineering — 342

Ismeca — 235

ITS: Intertrade Scientific — 947

IVS — 829

Iwaki — 915

J

JEM — 234

JEMI — 3011

Jenoptik Infab — 987, 1186

Jenoptik Laser, Optik, Systeme — 1193

JEOL — 409

JMG Instruments — 3011

John Crane Belfab — 1325

Johnstech — 477A, 493

Joint Stock — 2609

JSR Electronics — 163

Julabo Labortechnik — 2512

K

K & S Semitec — 486

K & W — 893

K. C. Technology — 516

Kakizaki — 476

Kayex — 516

Keithley Instruments — 329

Keller Technology — 493

Kinetics — 212

KLA-Tencor — 1569

Knights Technology — 229

Kobe Leo — 492

Kodak — 816

Kokusai — 677

Komatsu Electronics — 638

Korea Pionics — 516

Koyo Lindberg — 516

Kramer Scientific — 493

Kratos Analytical — 1413

Krystiloehn — 516

KS Technique — 3011

KSI — 477A-B

Kulicke & Soffa Industries — 801

John P. Kummer — 829

L

Labeille — 3011

Laflow Reinraumtechnik — 625

Lam Plan — 1420

Lam Research — 1351

Lambda Physik — 512

Laporte Electronics — 350

Laurier — 650

LCPS Consultants — 3011

Leica — 1169

LETI/CNET — 3011

Leybold Inficon — 1162

Leybold Vakuum — 1162

Lighthouse Worldwide Solutions — 614

Lixi — 477A, 493

Logitech — 1100

LOT Oriel — 1762

LPE — 712

LSQ — 3011

Lucas/Signatone — 486

Lufran — 208

Lumonics — 501

Lutch, div. of Ceramic and Semiconductor — 617

Luxtron — 215

Luxtron/Accufiber — 650

M

Macrotron Systems — 1350

Mactronix — 1529

Mahle Raumtechnik — 494

Mallinckrodt Baker — 1037

Mapa Professional — 2509

Maschinenfabrik Lauffer — 436

Mass-Vac, MV Products Div. — 1004

Materials Development Corp. — 912

Materials Research Corp. — 863

Matrix Integrated Systems — 1525

Mattson Technology — 469

MB Walton — 647

MCT — 477A-B

MDC Materials Development — 925

MDC Vacuum Products — 1518

MEC Technology — 697

MEGA Systems & Chemicals — 1350

Mega-Dress — 493

Megadress — 477A-B

Meissner+Wurst — 987, 1186

MEMC Electronic Materials — 529

Merck — 686

Meridionale Impianti — 1514

Messer Griesheim — 1187

Metroline Industries — 1247

Metron Technology — 647

MGI Electronics, Products — 647

Micrion — 935

MICRO — 482

Micro Lithography — 638

Micro Materials — 829

Microanalysis Group — 309

Microbar — 1350

Microcontrol — 869

Microcontrol Electronic — 1150

Microcontrole — 3011

Microgas Systems — 1199

Microline — 1700

Microlithography World — 1300

Micro-Mechanics — 650

Micronic Laser Systems — 1536

Micropolish — 350, 3011

Microscan Service — 646

Microsensor-Technologie (MST) — 462

Micro-Swiss — 1209

Microtool — 1610

Microworld — 486

Middlesex General Industries — 837

Milliken — 1218

Millipore — 709

Minato Electronics — 1350

MKS Instruments — 1363

MLI Microlithography — 647

MMR — 215

Moore Technologies — 1605

Morgan Matroc — 1702

Morrow Tech Industries — 505

Mott — 1601

MPM — 2901

MRL Industries — 708, 710

MSI Electronics — 1767

MSP — 477B

Muegge Electronic — 1617

Muehlbauer — 2417

Muller Feindraht — 1209

Myriad — 2405

N

n&k Technology — 829

Nanofilm Technologie — 914

Nanometrics — 947

National Microelectronics Research Centre — 2412

New Vision Systems — 1563

Nextral — 963

NFT — 914

Nicolet Imaging Systems — 1350

Nidek — 492, 1135

Nikon — 1541

Nikon Precision — 1541

Nippon Pillar Packing — 1625

Nippon Sanso — 1097

Nissei Sangyo — 668

Nitto Denko — 1350

Noah Precision — 1136

Nordson Asymtek Electronics — 338

Nova — 1247

Novatron — 708, 710

Novellus Systems — 1381

Novtek — 1350

NOW Technologies — 615

O

OAI (Optical Associates) — 493, 1447A

Oak Technical — 362

Okamoto-Shibayama — 947

Okmetic — 1309

Olin Microelectronic Materials — 1151

Olympus Optical — 1414

OnTrak Systems — 647

Opmaxx — 1350

Optem — 232

Optical Specialties — 647

Orbis Technologies — 869

Orsay Physics — 3011

Orthodyne Electronics — 429

Osaka Vacuum — 1619

Oxford Plasma Technology — 309

OZ Technologies — 829

P

Pall — 1101

Park Scientific Instruments — 1035

Parker Hannifin — 209

Particle Measuring Systems — 1024

PB Technik — 101

PCS — Process Control Systems — 463

PCT Systems — 1400

Peak International — 1317

Perfection Products — 2601

Performance Contracting — 2505

Persys Technology — 1704

PESL — 642

Pfeiffer Vacuum — 1581

Phenix Semicron — 1767

Philips Analytical X-Ray — 1224

Philips Electron Optics — 1386

Photronics — 1237

Physical Electronics — 1112

Pillar — 716

Plade — 477B

Planar — 230

Plasmatech — 610

Plasma-Therm — 809

Plasmos — 247

Poco Graphite — 717

Poly-Flow Engineering — 1136

Polytec — 215

Praxair — 347

Precise Sensors — 1034

Prema Prazistonselektronic — 638

PRESI — 1781, 3011

PRI Automation — 1380

Process Control Corp. — 650

Production Techniques — 1408

Progressive System Technologies — 829

Progressive Technologies — 739

Promis Systems — 1008

Proteus Industries — 829

Pyromatics — 908

Q

QC Optics — 416

QC Solutions — 1610

Quad — 1393

Qualiflow — 1513

Qualitau — 829

Quality Assurance Management — 212

Quantum Focus Instruments Corp. — 650

Quartz & Silice — 1109

Quarzschmelze Ilmenau — 1217

Quasys — 650

Quester — 647

Quintel — 1417

R

Ramgraber — 1714

Recif — 877, 3011

Reedholm — 477B, 493

Reel Service — 1632

Reform Technology — 2823

Refradige — 1109

Reid Ashman — 493

Retan Developments — 1520

RF Power Products — 1000

Riedel-de Haen — 1129

Rigaku — 2723

Rippey — 647

Rodel — 609

Rotarex — 1377

Rudolph Technologies — 647

RVSI — 477A, 493

RVSI Electronics — 481

S

SAES Getters — 316

Sairem — 1305

Sakurai — 647, 1700

Sandvik — 515

SAPI — 493

Scanwel — 1112

Sceram Ceramics — 1038

Schlumberger ATE — 3011

Schneeberger — 1763

Schumacher — 647

Schwab & Klug — 1425

SCI Systems — 1767

Scott Semiconductor Gases — 246

SCP Global Technologies — 539

Secon — 1509

Sedis — 1447A, 1447

Seiko — 647

Sekidenko — 1732

SELA — 647

Semco — 1715

SEMI — 2431

Semiconductor Diagnostics — 647

Semiconductor Equipment Assessment — 3017

Semiconductor International — 400

Semiconductor Production Systems — 1625

Semi-Gas Systems — 1097

Semilab — 350, 1117

SemiTest — 947

Semitool Europe — 981

SEMIX — 1247

Sempac — 951

Semy Engineering — 2516

SensArray — 947

Sentech Instruments — 936

Service Support Specialties — 1767

Setra Systems — 218

Sett — 1109

SEZ — 876

SGL Carbon — 909

Shibaura — 647

Shimadzu — Kratos — 1413

Shinko Electric Industries — 434

Shipley — 1563

Showa Kako — 1700

Sibond — 529, 543

Sikama — 642

Silicon Valley Group — 1163

Silicon Valley Microelectronics — 1214

Siltron — 157

Siltronix — 1304

Simco — 413

Sizary — 204

SJM Eurostat — 486

SLEE Technik — 505

SMI — 1136

SNDI — 2508

SNEF — 3011

Soitec — 520, 3011

Solid State Equipment — 842

Solid State Measurements — 829, 847

Solid State Technology — 1300

Sonoscan — 304

Sonosys Ultraschall Systeme — 1776

Sopra — 1439, 3011

Spectra — 1168

SpeedFam — 476

SPI/Semicon — 2422

Staubli — 2701

STEAG Hamatech — 825

STI — 650

STMS — 3011

Strasbaugh — 1610

STS — 1587

SubMicron Systems — 1609

Summit Design — 1350

Surface Consulting — 1301

Surface Technology Systems — 1447A

Karl Suss — 662

SVR Silicon Valley Research — 647

SVTR — 547

Swagelok — 729

Swan Analytical Instruments — 2617

Sycom Technologies — 438

Sydec — 610

Synova — 2610

Systemation — 477A, 481

Systems & Technology — 477A

T

Tadin — 477B, 493

Taitec — 1350

Takatori — 647

TCL — 477A-B

Techlink — 513

Techneglas — 1247

Technical Lamp Supplies — 1709

Technics — 905

Technics Plasma — 1401

Techniverre — 1234, 3011

Tecnol — 117, 647

Tefen — 239

Tegal — 1158

Teikoku Taping System — 947

Tekform/General Ceramics — 434

Telecom-STV — 923

Teleparts — 610

TeloSense — 647

Teltec — 1247

Temptronic — 425

Tem-Tech — 637

Teqcom Industries — 1447A

Texwipe — 125, 647

Therma-Wave — 1247

Thermonics — 493

Thomas West — 1247

Thomson — 486

Thorton — 1447A

Tiros — 1577

TMT — 1350

Tokai Carbon — 2511

Tokyo Cathodes — 493

Tokyo Electron — 1551

Tokyo Seimitsu — 493, 680

Topcon — 1350

Topometrix — 1213

Toshiba Ceramics — 804

Towa — 1350

TQS — 1109

Trebor — 604, 1610

Tresky — 899

Triant Technologies — 647

Trikon Technologies — 1229

Trion Technology — 925

Tronix — 1350

TSK — 477A-B

TSL — 1109

TSSI — 1350

TT Engineering — 1577

2M Strumenti — 1112

Tystar — 2616

U

Ultra Fab Technology — 737

Ultracision — 477A, 493, 799

Ultratech Stepper — 1562

Ultron Systems — 486, 1625

Ulvac Technologies — 1329

UniSil — 1141

Unit Instruments — 710, 1028

Universal Photonics — 736

Upsys — 687, 3011

US Inc. — 1518

Ushio — 1709

UTI, div. of MKS Instruments — 1363

V

Valex — 113

Vanguard — 477A

Vanguard Automation — 481

Varian Associates — 169

Varioplan — 737

VARS — 1247

VAT — 1246

VDMA Productronics — 3005

Veeco Instruments — 629

Veriflo — 200

Verity Instruments — 1301

Versatile Technologies — 477A-B, 493

Verteq — 869

Viking Semiconductor Equipment — 947

VLSI Standards — 829, 1205

Voltaix — 246

Voss Electronic — 638

W

Wacker Siltronic — 1047

Wafer News — 1300

Wafertech — 438

M. Watanabe — 638

Watkins-Johnson — 525

Watlow Electric Manufacturing — 1435

WEB Technology — 650

WED — 493, 1447A

Wentworth Laboratories — 228

Wessex Semicon — 1134

Wilden Pump & Engineering — 1524

Williams Advanced Materials — 434

Peter Wolters — 892

World Courier Logistics — 1785

X,Y,Z

X-TEK Systems — 642

Yield Engineering Systems — 829

YieldUP — 1247

Carl Zeiss Jena — 112

Zellweger Analytics — 417

Zevatech — 951

F. H. Zipser — 912

CONFERENCE PROGRAMS

The following is a partial listing of technical and business programs at Semicon Europa 98. All events take place at Palexpo unless noted.

MONDAY, MARCH 30

Second SEMI All-Industry Forum: "Setting New Goals for Global Cooperation"
8:30 a.m. — 4:30 p.m.
(A reception hosted by the Jenoptik Group will follow the forum.)

TUESDAY, MARCH 31

The Second Annual Productivity Forum — What Drives Companies to Performance Excellence?
8:30 a.m. — noon

Program Chair: Arieh Greenberg, Siemens, Germany

Reduction of Scheduled Down Time
Luciano Gandolfi, SGS-Thomson, Italy

Overall Fab Productivity — How to Measure, How to Achieve
Friedrich Böbel, Siemens, Germany

Intel's Approach to Productivity
Martin Curley, Intel, Ireland

Managing the Human Complexity of the Fab
Tal Shavit, Insight, Israel

Panelists from Meissner+Wurst, Applied Materials

Future Trends in Microlithography
8:30 a.m. — noon

Program Chair: Elmar Cullmann, Karl Süss, Germany

Production Lithography Challenges for the Approaching Millennium
Richard George, ASML, Netherlands

Lithography for Future Packaging and System Integration
Prof. Reichl, Fraunhofer Institute, Germany

Pattern Placement Metrology for Mask Making
Carola Bläsing, Leica, Germany

Mask-Making Challenges in the Late and Post Optical Era
Jack Monita, Photronics, USA

Panelists from Karl Süss, Olin Hunt, and Shipley

The Success of the European Semiconductor Equipment Assessment (SEA) Initiative
1 — 4:30 p.m.

Program Chair: Georg Kelm, European Commission DG III, Belgium

SEA — The Esprit Semiconductor Equipment Assessment Initiative: A Global Approach to Bridge the R&D-Manufacturing Gap
Jeff Brouchez, SEA Office, UK

High-Throughput/Low-Damage Implanted Resist Microwave Stripping
Michael Schwark, Siemens, Austria

Assessment of DUV Stepper Litho Cell by Global Partners
Kurt Ronse, IMEC, Belgium

MESC/CTMC Compatible Hot Cluster for 0.18-µm Processing and Beyond
Alexander Gschwandtner, Siemens, Germany

Multiuser Assessment of a Fully Integrated CMP Cluster Tool for 6- and 8-in. Wafers
W. Arndt, Temic, Germany

In-Line Process Verification of Multilayer Structures Using Spectroscopic Ellipsometry
Christopher Pickering, DERA, UK

Halving Cost of Test Using Parallel Multidie Approach for Mixed Function Testing
Hervé Deshayes, SGS-Thomson, France

Flat Panel Display (FPD) Roundtable
1 — 4:30 p.m.

Program Chair: Ad Burgmans, Philips Components, Netherlands

Recent Advances in Field Emission Displays
Robert Meyer, LETI, France

Electroluminescent Displays — Opportunities and Challenges
Runar Tornqvist, Planar International, Finland

PDPs (Plasma Display Panels)
Harm Tolner, Philips, Netherlands

Active Matrix Addressed LCDs
Traugot Kallfass, University of Stuttgart, Germany

Polymer Diodes
Robert Jan Visser, Philips, Netherlands

Improvement of Brightness and Viewing Angle of LCDs
David Coates, Merck, UK

Plasma DVD
Aitor Galdus, Balzers, Liechtenstein

WEDNESDAY, APRIL 1

Chemical-Mechanical Polishing (CMP) — A Key Enabling Technology for Advanced
Device Processing
8:30 a.m. — noon

Program Chair: John Schmitz, Philips, Netherlands

What Can Simulation Do to Optimize Oxide CMP Processing?
Peter Lahner, Siemens, Germany

Post-CMP Cleaning Improvements
Edwin Ory, Philips, Netherlands

CMP of Dielectrics for VLSI Multilevel Metallization
Helmuth Treichel, Lam Research, USA

Copper CMP Process Evaluation
Murielle Fayoile, LETI, France

Panelists from Baykowski Chemi, Peter Wolters, and IPEC

Environmentally Conscious Manufacturing — Can Environmental Action Also Save Money?
1 — 4:30 p.m.

Program Chair: Alessandro Tonti, SGS-Thomson, Italy

Reducing Cost of Ownership: Using Product-Based Objectives and Targets to Measure Cost Reduction
Ed Quevedo, Wise & Sheppard, USA

PFC Emission Reduction Issues
Representative of the EECA PFC Task Force

New Technologies for Reducing Chemical Costs and Environmental Impact
Marc Heyns, IMEC, Belgium

Reduction of DI Water Consumption in Wet Chemical Processors
Klaus Wolke, Steag MicroTech, Germany

The Cost of "Nonenvironment"
Matteo Bartolomeo, FEEM, Italy

Determining Profitability: Seeing the Forest for the Trees Using Environmental, Health, and Safety Cost Modeling
Patricia O'Hara, EORM, and Anthony Veltri, Oregon State University, USA

Panelists from Haag Consulting, Fraunhofer Institute, and Meissner+Wurst

MEMS: Fifth European Strategic Roundtable on Microsystems
1 — 4:30 p.m.

Program Chair: Henning Wicht, CEA-LETI, Germany

NEXUS Market Survey: Trends and Case Studies of Market Penetration
Reiner Wechsung, Microparts, Germany, and Stephane Fontanell, CEA-LETI, France

MST/MEMS Technology Roadmap
Ron Horwath, SEMI, USA

MST Manufacturing and Industrialization Trends
Jean-Christophe Eloy, Conseiller Europractice, France

Europractice II: Low-Cost Access to MST for System Integrators
Ron Lawes, RAL, UK

New Innovative Products: Originalities of Development and Cost/Performance Ratio

Electronic Nose — Alphamos, Neotronics; Integrated Pressure Sensors — Active Sensor, Tronics; IT/Peripherals — Silmag, Baltea HP

THURSDAY, APRIL 2

Equipment and Materials Market Briefing
8:30 — 9:30 a.m.

Elizabeth Schumann of SEMI's market statistics department will present a status report.

300 mm — The Fab Challenge 2000: A Forum on Actual Status and Manufacturing Concepts
8:30 a.m. — noon

Program Chair: Peter Kücher, Siemens, Germany

The Move to Volume Manufacturing in 300 mm — Economic and Strategic Aspects
Robert Doering, Texas Instruments, USA

Equipment —New Concepts and Requirements for Future Manufacturing
Sang-Mun Chon, Samsung, Korea (invited)

Consortia on 300 mm — Status, Roadmap, and Achievements
Paul Patniro, I300I, France

Cleanroom and Automation Concepts
Jürgen Griessing, SIMEC, Germany

300-mm Silicon — The Key to Conversion
1 — 4:30 p.m.

Program Chair: Hermann — Fusstetter, Wacker Siltronic, Germany

Status of 300-mm Silicon
Randy Goodall, I300I, USA

Metrology of 300-mm Silicon — Wafers
Peter Wagner, Wacker Siltronic, — Germany

Challenges of 300-mm CZ
Sadao Kumai, ShinETSU, Japan

300-mm Epitaxial Wafers for — 0.25 — 0.18-µm Design Rules — Potential and Current Status Mikio Mouri, Sumitomo Sitix, Japan

Photos: Lakeview Courtesy Geneva Tourist Office/OTG; Palexpo Interior Courtesy SEMI/Joe Orlando; Aerial View Courtesy Palexpo.

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