PVD Tool

Novellus Systems

San Jose, CA

An alternative to traditional PVD technologies, the Inova system combines a hollow cathode magnetron source and a high-productivity platform to uniformly deposit sputtered metal films. The source offers directional deposition unaffected by feature width. The system's cup-shaped target and the orientation of the permanent magnets allow deposited neutrals to be recycled until they are ionized by the high-density plasma. The recycling effect extends the life of the target. No RF coils are needed to generate the metal ion plasma, and only moderate operating pressures are needed to ensure wide bottom coverage of high-aspect-ratio structures. Degree of ionization is >90%, and sputter pressure is <1—15 millitorr. The system suits production of sub-0.18-µm devices using films such as Ti, TiN, Ta, TaN, AlCu, and Cu seed layers. Applications include deposition of Ti/TiN liner/barrier layers for tungsten plug and aluminum fill as well as advanced Ta(N)/Cu barrier/seed processes for copper interconnects. The source provides uniform bottom coverage of high-aspect-ratio devices without the use of a collimator. (Semicon West, Yerba Buena Center)

Laser Annealing System

Ultratech Stepper

San Jose, CA

Laser thermal processing technology combines imaging and thermal processing in a single system for advanced contact and junction formation on devices with linewidths 0.18 µm. The patterned laser doping tool reduces production costs by eliminating the need for the masking layers common to conventional implant layers. The laser process also helps extend the use of low-resistance silicides to production of devices with geometries µm. (Semicon West, San Francisco, South Hall, Booth 238)

Wafer Transfer Systems

Fortrend

Sunnyvale, CA

E-8225 BB wafer transfer systems automatically rotate every other wafer 180° in back-to-back orientation before transferring them to 25-slot plastic cassettes. The rotation is designed to prevent front-to-back contamination of the wafer. The all-electric systems require no air lines to operate, thus reducing the potential for airborne contamination. They are suitable for Class 1 use and can be installed in new or retrofitted fabs. (Semicon West, San Francisco, North Hall, Booth 5126)

UHP Pressure Transducer

Setra Systems

Boxborough, MA

The Model GCT-225 pressure transducer is accurate to ±0.25% full scale and offers a pressure output of 0.2 to 5.2 V dc or 4-20 mA. The instrument measures gauge and absolute pressures from 0—25 to 0—3000 psig or psia and compound pressures of —14.7—25 to —14.7—3000 psig. Measuring 41 x 2 in. high, the transducer can be installed in high-purity gas delivery systems, gas cabinets, and process equipment. Its cavity volume of 11/100 cu in. is designed to make purging simple, and a rotatable cover provides access to 12-turn potentiometers for fine zero and span adjustment. All wetted parts are made of VAR 316 L stainless steel that is electropolished to a 7-Ra surface. Each sensor is helium leak tested with a mass spectrometer to 1 x 10^—9 atm cm³/sec. (Semicon West, San Francisco, Esplanade, Booth 4126)

VacuComp Jalapeño heated vacuum valves reach a minimum internal temperature of 150°C. Heating the valve raises its internal temperature, converts process byproducts into gases, and minimizes contamination buildup. The valves' Series 45 jackets are made of materials that heat the inside of the valve yet remain warm to the touch on the outside. A low-temperature alert feature allows users to monitor heater operations. No external controller is needed, because the heater has a built-in thermostat. A thermal fuse limits the high temperature of the jackets. The valves are available in angle and in-line models. Seals, limit switch, and solenoids are optional features. All valves are available with ISO-IF, ISO-Universal, CF, and buttweld fittings. (Semicon West, San Francisco, South Hall, Booth 1616)

Designed for fab use, the DualBeam XL860 combines high-resolution SEM imaging and precise FIB milling. The system is suitable for yield management, process evaluation, and failure analysis in the manufacturing of semiconductors with linewidths 0.18 µm. The workstation's Class 1 robotics handles samples and compensates for vibration and stray fields. Resolution is 3 nm over the range of 1 to 30 kV. The instrument is capable of this resolution even up to a tilted view of 60° and a working distance of 5 mm from the sample. The operator can switch between field-free and immersion modes. The former provides low-magnification, large-area images with low levels of distortion and large depth of field. The latter provides high-resolution images of features and defects 0.25 µm. The milling column enables the user to cut through successive layers to examine subsurface defects and particles so that the user can capture high-resolution SEM images. (Semicon West, San Francisco, South Hall, Booth 2715)

The ACM+ continuously monitors up to 13 toxic and hazardous gases simultaneously in the low- to sub-parts-per-million range. The system's manifold assembly operates at 20 seconds per sampling port. An FTIR spectroscopy feature identifies compounds and prevents interference that can cause false alarms. A Venturi pump installed in the system minimizes downtime for maintenance. The system automatically switches to a backup mechanical pump if the Venturi pump fails. The system can detect up to 60 operator-defined, vapor-phase toxic or hazardous chemicals at up to 40 sample locations. Warning and alarm levels can be set for specific chemicals so that automatic responses can be established. (Semicon West, San Francisco, Esplanade, Booth 4220)

The MetaPulse-Cu uses picosecond ultrasonic laser sonar technology to measure the thickness of copper films, barrier layers, and adhesion layers in copper interconnect processes. The nondestructive metrology system measures multiple thicknesses <20 Å to >3 µm in multilayer metal applications involving PVD, CVD, and electroplating. The tool simultaneously analyzes interfacial effects, determines optimal device performance parameters, and detects misprocessed results. (Semicon West, San Francisco, North Hall, Booth 5761)

Designed for in situ use with CVD and RTP process tools, the Thermal Track/TC logs thermocouple temperature data in real time from up to 17 sensors embedded in wafers. Applications include adjusting pyrometer calibrations, troubleshooting for temperature-related process problems, and running preventive maintenance checks. Data can be transferred to spreadsheets for evaluation on the vendor's Thermal MAP 2 data analysis system. The portable tool shows a wafer image with digital temperature indicators at each sensor location. It calculates minimum, maximum, and average temperature. Users can capture data in periods ranging from 200 milliseconds to 5 minutes, depending on the application. (Semicon West, San Francisco, North Hall, Booth 5168)

Suitable for Class 1—100 use, Alpha 10 QuickSat wipers are kept dry until wetted by the user in the cleanroom. The technology is designed to deliver a cleaner wiper at the point of use than is provided by prewetted wipers. The unfolded stack of Alpha 10 wipers with sealed edges is packaged with a liquid-filled barrier pouch containing IPA diluted to 20% with DI water. The user folds the outer package to burst the inner pouch and release the liquid on the wipers, which reach a 50% saturation level after 5 minutes. The wetted wipers are dispensed one at a time, and a resealable label keeps the remaining wipers moist. They can be used up to three weeks after wetting. (Semicon West, San Francisco, North Hall, Booth 5958)

The Analyzer 1500 uses broadband spectrophotometry to characterize thin film and substrate combinations. The instrument simultaneously measures film thickness and the n and k spectra from 190 to 900 nm, producing a film signature for analysis. The system accurately measures n and k values at 193, 248, and 365 nm, making it suitable for use in 0.25- and 0.18-µm processes. Capable of analyzing up to seven film layers, the tool can be used for a range of applications, including semiconductor, FPD, and compact disc manufacturing. The analyzer also measures interface roughness, and films deposited on transparent substrates such as glass can be measured in seconds. (Semicon West, San Francisco, North Hall, Booth 5256)

RVP-300 series rapid vertical processing tools deposit arsenic-doped TEOS films on 300-mm wafers. The system features rapid temperature ramping, minibatch economics, and model-based temperature control. Based on the company's advanced vertical processor platform, the automated systems are designed to provide high yield and process flexibility for a range of 300-mm thermal processing applications. The TEOS technology can process up to 100 wafers in one batch. The delivery system uses one-tenth the amount of the doping chemicals used in similar systems, thus minimizing ownership costs for volume production of films with high arsenic content. The system also is designed to ensure film-thickness control and doping uniformity. (Semicon West, San Francisco, South Hall, Booth 2226)

With a response time of <1 second, the Model 106 Flo-Sensor can measure low flow rates from 15 ml/min to 10 L/min with ±1% accuracy. The sensor features sapphire and Teflon-wetted surfaces and may be used in highly corrosive applications in which liquid is low in viscosity. The instrument uses a Pelton-type turbine wheel to determine the flow rate of the liquid being measured. The unit's electrooptical system consists of a diode-emitting energy in the infrared spectrum. As the turbine wheel rotates in response to the flow rate, electrical pulses are generated. The sensor can replace ball and glass tube flowmeters in applications in which an electrical signal proportional to flow rate is desirable.

Wear-resistant ruby and sapphire spheres are hard and durable with surface finishes of 20—10 scratch-dig or better. The highly spherical precision balls demonstrate AFBMA (diameter tolerance per ball) grade tolerances of 0.000003, 0.000005, 0.000010, 0.000015, 0.000025, 0.0001, and 0.0002. The spheres can be used as high-wear, low-speed bearings and are suitable for use in check valves and other precision instruments as well as in liquid application devices. The balls exhibit Moh 9 hardness and are available in 42 different inch and metric sizes from 0.005- to 0.5-in. diam.

The Model 260 wet-process station offers clear PVC adjustable eyeshields, fluorescent lighting in a sealed nitrogen-purged compartment, and an optional CO₂ fire protection system for added safety. Made from type 304 stainless steel with a number 4 finish, the station is available in 4-, 6-, or 8-ft lengths. Other features include filtered quartz etch tanks, wafer spinners, ultrasonic tanks, dump rinsers, rinser dryers, and chemical feed systems. The unit also offers a full-length tub below the work surface with a 11/2-in. NPT drain and exhaust ports connected to the plenum.

Designed to work with nitrogen or compressed air, the Top Gun produces a powerful stream of ionized air to clean parts and eliminate the static charges that attract and hold contaminants to surfaces. It operates using the principal of electrical corona discharge to ionize the air in the vicinity of the ionizing emitter point. A filter at the exit of the ionizing-air gun ensures the air is clean. The unit is balanced to 0 ±15 V and features low air consumption and high blow-off force. The lightweight gun body comes with a light-touch trigger switch, a flow control valve, and a balance adjustment capability for calibration. (Semicon West, San Francisco, Esplanade, Booth 4340; San Jose, McEnery Hall, Booth 9111)

The MA150CC mask aligner can handle 3- to 6-in. wafers and 6 x 6-in. square substrates at a throughput of 135 wafers/hr. Mainly used for wafer bumping and the production of microsystems, MCMs, and thin-film heads, the tool is suitable for exposure of high topography and thick resist. A Cognex pattern recognition system permits an autoalignment accuracy of 1 µm. High-intensity, full-field exposure optics contribute to the efficiency of the machine by allowing shorter exposure times. The high-throughput machine features stainless-steel covers and is available for wafers up to 8 in. (Semicon West, San Francisco, North Hall, Booth 5735; San Jose, McEnery Hall, Booth 10519)

Easy-Donning cleanroom garments are folded and packaged with their insides turned out to minimize touching and contaminating the outside of the garments. The packaging technique can lessen dressing time by simplifying garment removal. The clothing line includes open face and eyes-only hoods, bunny suits, sleeve protectors, and high-top shoe covers. All items come in laundered or nonlaundered versions. Sterile and white cleanroom garments are laundered and packaged in a Class 1 cleanroom. Nonlaundered apparel is packaged in a Class 100 cleanroom. Conforming to cleanroom stocking and donning protocols, the packaging comprises a vacuum-sealed inner primary bag, heat-sealed secondary outer bag, and tertiary polyethylene carton liner.

Two-point dilution automatic purge and an automatic switching capability for liquids or gases are standard features on the OmniControl 1 gas cabinet. The fully programmable cabinet also features a seven-valve panel. The unit can be customized with various configurations of process gas panels and adapted for two- or three-cylinder capacity. Operators enter data and control cabinet functions through a PLC and a touch-operated screen. Options include special software for remote monitoring and control. (Semicon West, San Francisco, South Hall, Booth 6153)

Wafer cassette transport carts provide maximum maneuverability in Class 10 to Class 1 cleanrooms and other restricted space, critical manufacturing environments. Designed to provide more efficiency than heavier, bulkier products, the carts come in 18- or 24-in. widths and lengths of 30, 36, and 48 in. Custom configurations are also available, and models feature perforated stainless-steel or modified wire shelving.

SelRO ultrafiltration and nanofiltration membranes are made from special materials designed for use in environments hostile to other polymeric membranes. The systems are suitable for extended use in extremely acidic or caustic conditions, as well as for applications involving solvents. Specific applications include treatment of photoresist waste-water, acid recycling, and caustics recovery from ion exchange regeneration.

Fluoroflex T-1002 resins withstand temperatures 260°C for extended periods and 290°C for short durations. The resins come in sheets 0.004 in. thick, and they offer a fatigue resistance of >10 million flex cycles. The hydrophobic resins can be used with most chemicals and solvents.

The Element inductively coupled plasma mass spectrometer provides rapid analysis of ppt levels of metals and elemental impurities in photoresist and other complex matrices. The tool can also analyze liquid samples down to the ppq concentration range and conduct isotopic ultratrace analysis of solid samples. The small-footprint ICP-MS offers ultrahigh sensitivity and low dark noise to ensure low detection limits. Since it can be fully computer controlled via modem or LAN, it can be remotely operated or monitored. (Semicon West, San Francisco, South Hall, Booth 1101-2.)

Suitable for sample preparation in IC die cross-sectioning and other applications, the TechPrep8 polishing machine features electronic touchpad/keypad entry for precise control of the platen speed, coolant, power, timer, and sample oscillation/ rotation functions. The tool produces optimal results when used with the company's MultiPrep micropositioning head. The MultiPrep comes with a precision spindle design that allows vertical indexing of samples perpendicular to the platen and can rotate samples simultaneously. The positioning head features a digital dial indicator that displays the sample removal rate in 1-µm increments and provides dual-axis angular positioning of the sample by micrometer controls in a 5° range.

For use in chemical processing and metal finishing, Corzan X10 CR piping is suitable for chemical drain line and steam condensate return (CR) applications. Company tests show that the piping has demonstrated insulation benefits versus carbon and stainless-steel piping, while lasting four times longer than comparable steel piping systems. The corrosion-resistant piping can handle temperatures up to 215°F with a maximum pressure of 15 psig.

Product Extra!

Strasbaugh and OnTrak Systems have signed an OEM agreement to integrate Strasbaugh's Symphony-CMP chemical-mechanical planarizer with OnTrak's Synergy Integra CMP wafer-cleaning tool. The combined system will create a fully automated dry-in/dry-out CMP process, the vendors say. Productivity and performance benefits include high wafer throughput, a fully characterized CMP process, and a smaller system than a stand-alone tool, they add. Strasbaugh will be responsible for sales, marketing, and CMP tool process support, while OnTrak will provide applications support, operator training, and field support for the cleaning component. The system will be available in August 1998. Information: 805/541-6424. (Semicon West, San Francisco, South Hall, Booth 2407 [Strasbaugh]; South Hall, Booth 1632-1 [OnTrak Systems])

Fluoroware's E400 series film frame shipper for 200-mm wafers securely holds the film frames containing wafers that are mounted on dicing tape. The method allows no contact between the frames and the wafers, ensuring secure handling during wafer transport. The system differs from the standard method of transport in which processed wafers are separated by a sheet of film and stacked for shipment in a "wafer jar," Fluoroware says. The new product is designed to complement the vendor's Voyager shipper, which protects raw silicon wafers. The film frame shipper is similar in design to a wafer carrier and is made of translucent natural polypropylene or Stat-Pro 125 static protective polypropylene. Information: 612/448-8193. (Semicon West, San Francisco, North Hall, Booth 5944)

A new electronic service manual and customer support management system from CFM Technologies gives clients access to all the information in the operating manuals for the company's Full-Flow 8100 wet process tool. Called Clientele, the system comprises a CD-ROM and real-time access to customer and tool information for CFM support personnel worldwide. Clientele enables CFM to track system performance and repetitive failures so that the vendor can optimize its clients' use of the Full-Flow tools and reduce mean-time-to-repair rates. The company also expanded its support offerings to include 24-hour telephone assistance and dedicated installation teams. Information: 610/696-8300. (Semicon West, San Francisco, South Hall, Booth 232)

The Smart Gripper from Smart Machines is an end-effector for the company's SVR 200/300-mm robots which uses robot centering and gripping of wafers in order to actuate the gripper and provide diagnostic feedback. Designed for use with 300-mm substrates, the apparatus grips and centers the wafer by clamping radially on it using actuated contacts. The contacts have lines of action that converge on a predetermined central point in the process tool. This centering capability is independent of wafer fluctuations. The tool has no contact with the wafer's backside. High throughput is an additional benefit. Information: 408/324-1234. (Semicon West, San Francisco, South Hall, Booth 2826)

BOC Edwards and Scott Semiconductor Gases have teamed up to offer just-in-time delivery of BOC's gases to semiconductor industry customers in the Silicon Valley and San Francisco Bay Area. Scott has a plant in Fremont, CA, on the eastern side of San Francisco Bay. BOC says it now has a complete network of locations stocking its gases in all of the major U.S. semiconductor markets. Information: 908/771-1512. (Semicon West, San Francisco, South Hall, Booth 2238-2 [BOC]; North Hall, Booth 6153 [Scott])

A chemical dispense connector from NOW Technologies uses a combination of mechanical key codes and electrical design features to guarantee that the correct chemical is dispensed from the vendor's NOWPak containers. The SmartProbe connector and SmartCap closure use more than 3400 unique key code combinations and an optional sensor interlock. The system minimizes the risk of sending the wrong chemical to the dispensing point and helps users to avoid cross contamination. A key-coded retainer on the SmartProbe connector matches an identically key-coded SmartCap closure. A sensor interlock can be connected electronically to the dispensing equipment to signal whether chemical delivery should begin. A green LED lights up when a connection is made at the right point. Information: 612/
829-4443. (Semicon West, San Francisco, Esplanade, Booth 4026)

PICK OF THE LITERATURE

The following companies are offering free literature:

• Alpha Omega Instruments, Series 3500 trace oxygen transmitter data sheet. Information: 800/262-5977.

• Asahi/America, Vorsite flowmeter indicator/controller brochure. Information: 800/343-3618; fax, 800/426-7058.

• Concoa, 1998 gas distribution equipment catalog. Information: 800/225-0473.

• Filmetrics, F40 thin-film measurement system brochure. Information: 619/554-0005; fax, 619/554-1311.

• Garland Floor, products/applications brochure. Information: 800/
  321-2395; fax, 216/883-9076.

• Gow-Mac Instrument, Series 816 high-performance gas chromatograph brochure. Information: 800/
  610/954-9000; fax, 610/954-9599.

• InterMetro Industries, cleanroom shelving and carts brochure. Information: 800/433-2232.

• Keithley Instruments, 1998 Acculex Catalog and Reference Guide. Information: 216/248-0400; fax, 216/248-6168.

• Leybold Inficon, Sky capacitance diaphragm gauge brochure. Information: 315/434-1100.

• Ryan Herco Products, fluid-
  handling products guide. Information: 800/848-1141; fax, 818/973-2600.

• Techni-Tool, 1998 tool catalog. Information: 610/941-2400; fax, 610/828-5623.

• Teledyne Brown Engineering/Hastings Instruments, condensed product brochure. Information: 800/950-2468; fax, 757/723-3925.

• Terra Universal, cleanroom and lab products catalog. Information: 800/767-0155; fax, 714/992-2179.

• Vibro-Acoustics, "HVAC Silencer Application and Selection Guide." Information: 416/291-7371; fax, 416/291-8049.

• Worklon, Apparel Catalog #29. Information: 813/397-9611; fax, 813/391-7514.

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