SEMICON EUROPA
EXHIBITOR LIST

Company...................Booth A AAF-International...................B2.508 AB Sandvik Calamo...................B1.336 Abakus Software...................A2.422 ABB Extrel...................B2.733 ABC Service & Produktion...................A1.484D Ablestik...................B1.134 AC Cerama...................A1.243B ACR...................B2.152 ACSI...................A1.448C ADCS...................A1.269 ADE...................A1.145 ADEC...................B1.584R Admat Materials...................B1.516C Adolf-Slaby-Institut...................B1.449 Advanced Ceramics...................A1.515 Advanced Energy Industries...................B2.210 Advanced Systems Automation...................B2.562 Advantek...................B1.431 Advantest...................A2.102 Aera...................B2.564 Aeronex...................B1.427 AES Motomation...................B1.132 Aetrium...................A1.262A, A1.263A AG Associates...................A1.210A, A1.222A, A1.310A Agence d'etudes et de Promotion...................A1.129 AGL...................B1.255D AGRU Kunststofftechnik...................B1.174 AIO...................B2.402-1D Air Liquide Electronics Labeille...................A1.502 Air Products...................B1.142 Aixtron...................A1.410 Alcatel High Vacuum Technology...................B1.124 Align-Rite...................B1.442 Alliance...................A1.762A Allianceles (Europe)...................A1.644-1 AlliedSignal...................B1.422 Alma...................A1.210B, A1.222B, A1.310B Almatec...................A1.274 Alpha Innotech...................A2.222F Alphasem...................A1.402 Amecon...................B2.434 American Fine Wire...................B1.102B Amtech/Tempress Systems...................A1.634 Anatel...................A1.708A Angel Business Communications...................B2.263B Anseros Klaus Nonnenmacher...................B1.469 AP Tech...................B1.106 APIC Filter...................B2.611B Applied Materials...................B2.170 Applied Mechanical Europe...................B2.402-1N Applied Precision...................B2.110, B2.102A APS...................A1.131 ARC...................B2.402-1K ARC Machines...................B1.711 ARCH Chemicals...................B2.202, B2.302 Ardmac...................B2.137 Arias...................A1.734 Aries Electronics...................A1.150 Asahi America...................B2.402-1F Asahi Glass Electronic Materials...................B2.633 ASAT...................B1.726 Aseco...................B2.402-1J Ashland Chemical...................A1.264 ASM Assembly Products...................A1.174 ASM Europe...................A1.324 ASM Lithography...................B2.642 AST...................A1.104E Astec...................A1.250 Astex...................B1.255 ASYS Automatic Systems...................B2.734 Asyst Technologies...................B1.164 Atlantic Tubing...................B2.402-1G ATMI EcoSys...................A1.635 Atomika Instruments...................B2.745 ATS Products...................B2.121 ATV Technology...................A1.766 August Technology...................A1.676D, A1.680D, A1.262B, A1.263B Aurel...................A1.302 Aurer Precision...................B2.142F Ausimont...................B2.402-1P AutoSimulations...................B1.537 AXIC...................A1.344A B B&G Enterprises...................B2.102B Carl Baasel Lasertechnik...................A1.455 Balzers Materials...................B1.402A Balzers Process Systems...................B1.402 BDM Nederland...................B1.202B, B1.302B BE Semiconductor Industries...................A1.454A Benchmark International...................A1.206 Berghof...................A1.571 Berkshire International...................B1.745 Bernt...................B1.417 BH Thermal...................B1.747A Bid Service...................A1.706 Bilz Schwingungstechnik...................A1.125 Bio-Rad...................A1.209 Bionics Instrument...................B2.384 BL Automation...................B1.728D BLE Laboratory Equipment...................A1.372 Boschman Technologies...................A1.524 BPS-Nextral...................B1.402B Brewer Science...................A1.611 Bronkhorst High-Tech...................B1.105 Brooks Instrument...................B2.164 Bruker Optik...................A1.758 BS Engineering...................A1.303 N. Bucher...................B1.720 C Cabot...................A1.210C, A1.222C, A1.310C Caburn...................B1.747 Caltechnix...................B2.751 Camline...................B1.151 Canon...................A1.384 Carbone Lorraine...................B2.544 Carborundum...................A1.303A, A1.243 Carsem...................B1.445 Carten Controls...................B2.514 Cascade Microtech...................A2.122, A2.222 Castrol...................A1.210E, A1.222E, A1.310E CCS Meßgeräte...................A1.708B CDE Creative Design Engineering...................A1.344B Center For Technology Development...................A1.484 Centrotherm...................B1.622 Ceramaseal...................B1.207 Cerprobe Europe...................A2.101 CFD Research & Consulting Software...................B1.335 CGS Thermodynamics...................A1.766A Chapman Instruments...................A1.104D, A1.344C Christ...................B1.731 Cicorel...................B1.712 Clariant...................B1.444 Cleanroom Products...................A1.210D, A1.222D Cleanroom Technology...................B2.263A Clear & Clean...................B2.173 Clestra Cleanroom...................B2.725 Climet Instruments...................A1.237 CMTEC...................B2.142 Coillard...................B2.159 Comdel...................B2.257 Comdisco Electronics Group...................B2.630 Compression Polymers Group...................B2.402-1M Comtec Semiconductor Technology...................B1.780 Comvat...................B2.243A Consilium...................B2.464 CPI...................B1.255C CPS...................A1.712C Craftech Industries...................B2.412 CRC Clean Room Consulting...................B2.654 Credence Systems...................A2.402 Crystec Technology Trading...................A1.511B CS Clean Systems...................B2.177 CS2...................B1.403 CSC Commonwealth Scientific...................A1.344D CSP Cryogenic Spectrometers...................B1.738 CTI-Cryogenics...................B1.542A Cuno...................B2.542 Cybeq Nano Tech...................A1.109, B1.584V Cybeq Systems...................A1.210F, A1.222F, A1.310F Cybor...................A1.210G, A1.222G, A1.310G Cymer...................A1.507 D Dagard...................B2.481 Dage Electronic...................B2.111 Dainippon Screen...................B1.584A Daldrop + Dr.-Ing. Huber...................B2.262 Das Dünnschicht Anlagen Systeme...................A1.154 Dastex...................B2.417 Data Instruments...................B2.216 Datacon...................B1.562 Daymarc...................B1.584I Delta Design...................B1.584H Deposition Systems...................B1.613 DH Instruments...................B2.751A Dias Automation...................B2.142E Dionex...................B1.479 Disco Hi-Tec....................B1.224 DME Danisch Micro Engineering...................A1.728A DMS Dynamic Micro Systems...................B1.374 Dockweiler...................B1.154 Dolinschek...................A1.484A Donaldson...................B2.614 Dow...................B2.759 Dr.-Ing. K. Busch...................B2.772 Dr. Tresky...................A1.159 Draeger Sicherheitstechnik...................B1.125A DRE, Dr. Riss Ellipsometerbau...................B2.173A Dräger Tescom...................B1.125 DSM Intra Services...................B1.746 DuPont...................B2.127, B2.128 Dynamic Support...................B2.713 Dynatex...................B1.584J Dyneon...................B2.551 E Eagle-Picher...................B1.617 Eaton...................B1.602 Ebara...................B2.472 ECI Technology...................B2.469 EG&G Engineered Products...................B1.234 Eichhorn & Hausmann...................B2.102C EKC Technology...................B1.564 Electrochemical Technology...................B1.516B Electroglas...................A2.602 Electrograph...................A1.210H, A1.222H, A1.310H Electronic Instruments and Systems...................B1.242B Electronic Visions...................B1.574 Electrotechnical Engineering...................B2.257A EM-Technik...................A1.244 Empak...................B1.274E, B2.342 Engelhard-CLAL...................B2.632 ENI...................B1.343 EO Technics...................A1.371 Epitech...................A1.354 Epoxy Technology...................A1.102 ERS Elektronik...................A2.324 ESEC...................B1.202, B1.302 ETEC Systems...................B1.536 ETO...................B1.255A Euresys...................A1.104G Euris...................B1.274 European Semiconductor...................B2.263 EVAC...................B2.615 Evans...................B2.414 Ever Technologies...................A1.762 Extraction Systems...................A1.210I, A1.222I, A1.310I F F&K Delvotec...................B1.364 Fab-Tech...................B2.229 Factum...................B1.644A Fairchild Technologies...................A1.169 Faith Enterprises...................B2.402-1C Fastech Integration...................B2.450 FEI...................B1.650 Feinmetall...................A2.109 Ferrofluidics...................B1.165 FHR Anlagenbau...................A1.728 FICO...................A1.454 Firfax Systems...................A2.316 Flowlink...................A1.728B Flowmeca...................B2.151 Fluidix...................B2.402-1H Fluoroware...................A1.210J, A1.222J, A1.310J FormFactor...................A1.644E, A1.750E Fortrend Engineering...................B1.457C Four Dimensions...................A1.104B Fraunhofer Institutes...................B1.178 Froilabo...................A2.222E FSI International...................A1.210K, A1.222K, A1.310K FSI-CME...................A1.210L, A1.222L, A1.310L FSP Fluid Systems Partners...................B2.482 Fujikin...................B2.514A Fujimi...................A1.602A, A1.716A Furon...................A1.442 Furukawa Electric...................A1.602B, A1.716B Futurestar...................A1.510 G G & N...................B1.157, B1.584O Gaiser Tool...................B2.111C GaSonics International...................B1.424, B2.344A GCB Druva...................B1.106A GDS Manufacturing...................B2.237 GE Quartz...................B2.463 Gebr. Haake...................A1.778 GEI Courtoy...................A2.523 GEI International...................A2.523A Gel-Pak...................A1.210M, A1.222M, A1.310M Gemetec...................A1.672 GEMÜ...................B2.676 Genmark Automation...................A1.664 Georg Fischer Rohrleitungssystgeme...................B1.430 Gl Mechatronic...................B2.142D Glas-Col...................A1.210N, A1.222N, A1.310N Glegg Water Conditioning...................B1.457D Global Semiconductor Safety Services...................B2.147 GO...................A1.609 Gold Tech Industries...................A1.162 B.F. Goodrich...................B2.402-1O Granville-Phillips...................B1.542B Greene, Tweed...................B2.254 GW Associates...................B2.165 H H-Square...................A1.676A, A1.680A Habonim Industrial Valves...................B2.368 Hager + Elsässer...................B2.649A Halcyonics...................B1.410A Haldor Topsoe...................B1.543A Hamamatsu Photonics...................B1.169 Han Mi Mold Tool...................A1.712D Hartfelt...................B1.720D HCT Shaping Systems...................B1.453 Heidelberg Instruments...................B1.439 Helix Technology...................B1.542 Heraeus...................B2.242 Hermos...................B2.322 Hesse & Knipps...................B1.337 Hewlett-Packard...................A2.302 Hillelian Concepts...................B1.549 Hiltex...................A1.676E, A1.680E Hitachi...................A1.522 HM Reinraum-Technik...................A1.576 Hologenix...................B2.102E Holtronic Technologies...................B2.535 Honda Electronics...................B1.763A Honeywell...................B2.354 Horiba Europe...................B2.602 Hositrad...................B1.239 Hoya...................B1.284 HTS...................B1.457 HTT, High Tech Trade...................A1.644, A1.750, A1.762B Hurner Umwelttechnik...................A1.165A Hytec Flow Systems...................B2.402-1Q Hüttinger Elektronik...................A1.406 I Ibis Technology...................A1.528 IBS - Ion Beam Services...................B2.585 ICD Heateflex...................A1.676B, A1.680B ICG-APD Cryogenics...................B2.372 ICOS Vision Systems...................A1.105 ICT...................A2.515B IDS...................B1.584Q IMS Integrated Measurement Systems...................A2.222B Imtec Acculine...................B2.402 Incam Solutions...................B1.531B Inelio...................B2.462A Inko Industrial...................A1.448B Innolas...................B2.453 Innotec Group...................B2.502 Inspectech....................A1.304 Inspex...................B1.584C Intega...................B2.662 Integrated Designs...................B2.646C Intersurface Dynamics...................B1.720A Intest...................A2.414 Ion Systems...................B1.513 Ion Tech...................B2.102F Ionics...................A1.718 IPEC...................B2.344 Irvine Optical...................A1.344E Ishii Tool & Engineering...................B2.156 Ismeca...................A1.254 ITS, Intertrade Scientific...................A1.344 Iwaki Europe...................B1.632 J JEM...................A2.603 JEMI France...................B2.710 Jenoptik Infab...................B2.224 JEOL...................B2.424 JIP...................B2.709 Johnson Matthey Electronics...................B2.756 Johnstech International...................A1.644C, A1.750C JSR Electronics...................B1.264 K Kakizaki...................A1.602C, A1.716C Kanebo....................A2.523B Karo Electronics...................B1.585A Kayex...................A1.511A Keithley Instruments...................A1.444 Keller's...................B1.584G Keteca...................B2.102G Kinetic Systems...................A2.515C Kinetico/EPOC...................B1.457A Kinetics...................B1.464 Kitec Microelectronic Technologie...................B1.728 KLA-Tencor...................B1.544 Kobe Precision...................A1.405 Koch Microelectronic Service...................B2.118 Kokusai Electric Europe...................B2.584 Komatsu Electronics...................B1.763B Koyo Lindberg...................A1.511 KPI...................A1.448D Krantz-TKT Cleanroom Technology...................A1.342-1 Kratos Analytical...................A1.213 Kristiloehn...................A1.511D KTD Plasticon...................A1.165 Kulicke & Soffa...................B1.562A John P. Kummer...................B2.102 Kurabo Industries...................B1.763E Kurt J. Lesker...................B2.709A Kyocera...................A1.137 Kytek...................B1.106B L Laflow Reinraumtechnik...................B1.622A Lambda Physik...................B2.536 Lapmaster International...................A1.726 Laporte Electronics...................A1.462 Laserspec Analytik...................A1.175 Lauffer...................B1.348 Laurell Technologies...................A1.676F, A1.680F Laurier...................A1.262C, A1.263C Lehighton Electronics...................B1.728B Leica Microsystems...................B1.244 Leybold...................B1.624, B1.630 Lighthouse Worldwide Solutions...................B2.107 Linde Werksgruppe Technische Gase...................B2.310 Lintec...................B1.224A Logitech...................A1.403 Logitex...................A1.754 Lord Ingenierie...................A1.104F LOT - Oriel...................B1.133 LP-Thermtech...................B1.766 LPE...................A1.355 Lucas/Signatone...................A1.464 Lucid...................B2.344J Ludl Electronic Products...................B1.109 Lufran...................B1.584E, B2.114 Lufthousol Gebaudemanagement...................A1.342-1A Lumonics...................A1.124 Lutch-Ceramics Science & Technology...................B1.251 Luxtron...................A1.104C Luxtron/Accufiber...................A1.262D, A1.263D M M & M Software...................B2.217 Macrotron Systems...................B1.584 Mactronix...................B1.706 Mahle Raumtechnik...................A1.125A Mallinckrodt Baker...................B2.465 Manufacturing Integration Technology...................A1.133A, B2.142A Mapa Professionnel...................B1.532 Mass-Vac & MV Products...................B2.485 MAT...................B1.584F Materials Research Corp....................B2.264 Matrix Integrated Systems...................B2.222 Mawomatic Mayer Wonisch Mietzel...................B2.782

Company...................Booth MB Services...................B1.734 MDC Materials Development...................A1.202 MDC Vacuum Products...................B1.747B MDC...................A1.464C MECO Equipment Engineers...................A1.454B MEC Tech...................B2.141 MECS...................B1.733A Meissner+Wurst/M+W Zander...................B2.224 Merck...................A1.542 Meridionale Impianti...................B1.760 Merritt Precision...................B2.453A Metroline...................B2.344D Metron Technology...................A1.210, A1.222, A1.310 MGI...................A1.210, A1.222, A1.310 Micrion...................B2.211 Micro Lithography...................B1.715 MICRO...................B2.565 Micro-Control...................A1.464D Micro-Mechanics...................A1.262E, A1.263E Micro-Swiss, Packaging Materials...................B1.102C Microbar...................B1.584D Microchem...................B1.606 Microchemistry....................B1.214 Microcontrol Electronic...................B1.330 Microfil Industries...................A1.780 Microhandling...................A2.423 Microlin...................B2.742 Micromanipulator...................A2.316B Micronic Laser Systems...................B2.616 Microtool...................B1.274D Microworld...................A1.464B, A1.712 Middlesex General Industries...................A1.136 Milliken...................B1.435 Millipore Microelectronics...................B2.244 Minntech...................B2.569 Mipox International...................A1.782 Mirae...................A1.622 MIT...................B2.142A Mitutoyo Meßgeräte...................B1.474 MKS Instruments...................B2.444 MLI Microlithography...................A1.210Q, A1.222Q, A1.310Q, B1.763C Modular Process Technology...................A1.344F Moore Technologies...................B2.454 Morgan Matroc...................B2.555 Mott...................B2.468 Mozaik...................A1.766B MRL Industries...................B2.644 MSP...................A1.644D, A1.750D MST Micro Sensor Technology...................B1.478 MTS Systems...................A1.173 Muegge Electronic...................B1.411 Mühlbauer...................B1.384 Müller Feindraht...................B1.102 Multicore Solders...................B2.111D Multitest...................A2.316C Myriad...................A1.584 N N & K Technology...................B1.728C Nanometrics...................A1.344G Nanophotonics...................A1.633 New Wave Research...................A2.122A NFT-Nanofilm Technologie...................B1.410 Nicolet Imaging Systems...................B1.584L Nidek...................B2.111E Nikon...................B1.502A Nikon Precision...................B1.502 Nimble...................A1.210R, A1.222R, A1.310R Nippon Pillar Packing...................A1.676C, A1.680C Nipponnso Europe...................B2.376 Nippon Silica Glass...................A1.117A Nisseingyo...................A1.522A Nitto Denko...................B1.584B Noran Instruments...................B2.607 Nordson Electronics Systems...................B1.654 Norton ASTI...................A1.565 Norton Cerbec...................A1.243A Nova...................B2.344E Nova Measuring Instruments....................B2.509 Novatron...................B2.644A, B2.646 Novtek...................B1.584K NOW Technologies...................A1.514 NT International...................B2.436 NYS Centre for Advanced Thin Film Technology...................A1.305 O Oak Technical...................A1.142 Obsidian...................A1.210S, A1.222S, A1.310S Ohmcraft...................B2.111F Okamoto Machine Tool Works...................A1.344H Okmetic....................A1.534 Opmaxx...................B1.584T Optem International...................B1.112 Opti-Clean Product + Technology...................B1.720E Optical Associates...................B2.402-1B Opto Sonderbedarf...................B1.112A Optometron...................B1.109A Orthodyne Electronics...................B2.124 Ortner Reinraumtechnik...................A1.342, A1.484B, B1.184A Oryx...................A1.344I, A2.222G Osaka Vacuum....................A1.537 Osram...................B2.484 Oxford Instruments...................B2.250 OZ-Technologies...................B2.102H Ozone Systems...................B2.402-1R P PAC Tech...................B1.155 Pacific Scientific...................A1.708 Pall...................B2.524 Palomar Technologies...................B1.644 Park Scientific Instruments...................B2.603 Parker Hannifin...................A1.364 Particle Measuring Systems...................B1.510 PB Technik...................B1.543 PCS Process Control Systems...................B2.654A PCT Precise Connector Tooling...................B2.142B PCT Systems...................B2.703 Peak International...................A1.549 Perfection Products...................A1.168, A1.174A Persys Technology....................B1.776 Pfeiffer Vacuum...................B1.462 Philips Analytical X-Ray...................B2.122 Phillip Mueller H+E...................B2.649 Photronics...................B2.624 Physical Electronics...................B2.529 Physik Instrumente...................A1.104A Picopolish...................A1.541 Pillar...................A1.508 Plascore...................B2.533 Plasma-Therm...................B2.473 Poco Graphite...................B1.610 Podolski Chemikal & Metallurgical...................A1.450 Polymer Flip Chip...................A1.102A Polytec...................A1.104 Powatec...................B2.142C Praxair...................B1.342 Prettl Prozeß und Reinraumtechnik...................B2.746 PRI Automation...................B2.572 Prior Scientific Instruments...................B1.448 Probe Technology...................A2.316A Prodotec Plexus...................B2.151A Production Techniques...................A1.375 Progressive Technologies...................B2.504 Promis...................B1.584P Protavic...................B1.772 Proteus Industries...................B2.102J PS Systems...................A1.644H, A1.750H PST Progressive System Technologies...................B2.102I PTI Technologies...................B2.611 Pure Water Cooling...................A1.770 Pyramid Engineering Services...................A1.153 Q QC Optics...................B2.408 QC Solutions...................B1.274B QFI Quantum Focus Instruments...................A1.262G, A1.263G Qualiflow...................B2.162 Qualitau...................B2.102K Quartz & Silice/Norton...................B2.442 Quarzschmelze Iimenau...................B2.752 Quasys...................A1.262, A1.263 Quesant Instrument................... Quester...................A1.210T, A1.222T, A1.310T Quintel...................B1.740 R Raith...................B1.732 Ramgraber...................B1.716 RDI-Research Devices...................A1.262H, A1.263H Ready Products...................A1.712A, A2.122B Recif...................B2.462 Refradige...................B2.442D Rena Sondermaschinen...................B1.362 Retan Developments...................A1.470 Riedel-De Haen...................B1.422A Rigaku...................B2.352 Rika Denshi...................B1.511 Riken Keiki...................B2.316A Rion....................B2.482A Rippey...................A1.210U, A1.222U, A1.310U, A1.414 Rite Track...................B2.726 RKI Analytical Instruments...................B2.316 Robert Bosch...................B1.278 Rodel...................B1.344 Rofin-Sinar Laser...................A1.133 ROM-Stuttgart...................B2.515 Rommel, Ehingen...................B1.384A Rotarex - Ceodeux Puretec...................A1.624 Roth & Rau...................A1.774 Royce Instruments...................B2.763 RSF Elektronik...................B2.762 R2D Ingenierie...................B1.728A Rubröder Factory Automation...................A1.177 Rudolph...................A1.210V, A1.222V, A1.310V RVSI...................A1.644, A1.746, A1.750 S SAES Getters...................B2.231 Saint-Gobain...................B2.442E Sairem...................B1.555 Sakurai...................A1.210X, A1.222X, A1.310X Salland Engineering...................A2.322 Scanlab...................A2.222D Scanwel...................B2.529A Klaus Schaefer...................B1.703 Schiller Automation Systems...................A1.155A Schneeberger...................A1.533 Schott Glas...................A1.132 Schumacher...................A1.210Y, A1.222Y, A1.310Y Schwab & Klug...................B2.362 Scientific Sealing Technology...................A1.204B Scottish Semiconductor Supplier Forum...................B1.707 SCP Global Technologies...................A1.564 SDI Semiconductor Diagnostics...................A1.210Z, A1.222Z, A1.310Z SDL...................B2.102L SE...................A1.511C Sedis...................B2.402 Seiko...................A1.210AA, A1.222AA, A1.310AA Sela...................A1.210AB, A1.222AB, A1.310AB Selfa Valves + Fittings...................A1.624A Semco...................A1.676G, A1.680G Semco Engineering...................B2.125 SEMI....................A1.242 Semi-Ny.Com...................A1.305A Semiconductor Business News...................A1.329 Semiconductor Equipment Assessment...................B2.714 Semiconductor Fabtech...................B2.215 Semiconductor International...................B2.364 Semiconductor Materials....................B1.720B Semiconductor Technologies...................A2.316D Semilab...................A1.434 Semitec, Packaging Materials...................B1.102A SemiTest...................A1.344J Semitool...................B1.664 Semix...................B1.115, B2.344F Sempac...................B1.202C, B1.302C SEMY Engineering...................B2.548 Senior Flexonics...................B1.412 SensArray...................A1.210AC, A1.222AC, A1.310AC, A1.344K Sentech Instruments...................B1.354 Setra Systems...................B1.235 Sett...................B2.442C SEZ...................B2.664 SGL Carbon...................A1.362 Shibaura...................A1.210AD, A1.222AD, A1.310AD Shinko Electric Industries...................B2.111A Shipley...................B1.642 SICO...................B2.648 Sieghard Schiller...................A1.155 Siemens...................B2.184 Sigmameltec...................A1.210AZ, A1.222AZ, A1.310AZ Sigmatech Applications Center...................A1.344N Sika Chemie...................B2.730 Sikama International...................A1.766C Silicon Glen Technologies...................A1.464A Silicon Valley Group...................B1.222 Silicon Valley Microelectronics...................A1.466 Siltronix...................B2.317 SIMAC Masic...................B1.141, B1.242A Simco...................B1.378 Simona...................B2.676A Sistro...................A1.484E Site Services...................B2.151B SJM-Eurostat...................B1.429 Slee Technik...................A1.543 Small Precision Tools...................B1.415 Software Industries...................A1.742 Soitec...................B1.531 Solid State Equipment...................B1.662 Solid State Measurements...................A1.224 Solid State Technology...................A1.345 Solvay...................B1.181 Sonix...................B1.318 Sonoscan...................B1.585 Sonosys...................A1.372A SOPRA...................B1.733 Sorbios...................B1.255B Specs...................B1.133C Spectra International...................B2.167 SpeedFam...................A1.602, A1.716 Speedline Technologies...................A1.122 SPI/Semicon...................A1.251 SPS...................A1.676, A1.680 Stangl...................B2.766 Staubli Unimation...................B2.554 Steag Electronic Systems...................B2.422 STEC/Horiba Instruments...................B2.602D STI...................A1.262F, A1.263F, A1.644-2, A1.762C STM Advanced Technologies...................B1.515 Strasbaugh...................B1.274A STS...................B2.672 STT Components Software...................A1.484F Surface Consulting...................B2.706A Surface Technology Systems...................B2.402-1A Karl Suss...................B1.162 Swagelok...................B1.144 Swan Analytical Instruments...................B1.159 Sydec International...................B1.516 Synatron...................A2.222, A2.510A Syncro Vac...................B1.516A Synova...................B1.175 Systemböden System Floors...................A1.125B Systemation Engineered Products...................A1.644F,A1.750F SZ Testsysteme...................A2.615 T Taitec...................B1.584Y Takatori...................A1.210AE, A1.222AE, A1.310AE TB-Ploner Oeg...................A1.484C TEC-SEM...................B2.344G Techarmonic...................B2.344L Techlink...................B1.633 Technical Lamp Supplies....................B2.727C Technics Plasma...................B2.428 Techniverre...................B2.149 Techsonic...................B1.470 Tecnol...................A1.210AF, A1.222AF, A1.310AF Tegal...................A1.424 Teikoku Taping System...................A1.344L Teleparts...................B2.344H TeloSense...................A1.210AG, A1.222AG, A1.310AG Teltec...................B2.344 Tem-Tech Lab...................B2.384B Temptronic...................B1.242 Teqcom Industries...................B2.402-1E Teradyne...................A2.124 Texwipe...................A1.210AI, A1.222AI, A1.310AI, B1.209 Therma-Wave...................B2.344I 3P-Performance Plastics Products...................A1.158 Thomas West...................B2.344M Thomson...................A1.712E Thomson Semiconductor...................B1.608 Thornton...................B2.402-1L TIPS...................A1.484G Tiros...................A1.262J, A1.263J TLC Equipment...................B2.169 TMC...................A1.210AH, A1.222AH, A1.310AH TMT...................B1.584N Tokai Carbon...................B2.717 Tokyo Electron...................A2.112 Tokyo Seimitsu...................A1.544 Topcon...................B1.584X Toshiba Ceramics...................B1.314 Tosoh...................A1.117 Towa...................B1.584W TQS...................B2.442B Trace Analytical...................B2.231A Trebor...................B1.274C, B2.622 Triant...................A1.210AJ, A1.222AJ, A1.310AJ Trio-Tech...................A2.222C Tronix...................B1.584M TRU-SI Technologies...................B1.457B TSE...................B1.584U TSL...................B2.442A TSSI...................B1.584S TT-Engineering...................A1.262I, A1.263I 2M Strumenti...................B2.529B Tystar...................A1.728C U U.K. Semirep....................A1.448A Ultra Fab/Varioplan...................B2.721 Ultratech Stepper...................A1.232 Ultron Systems...................A1.676H, A1.680H, A1.712B Ulvac...................B2.144 Unit Instruments...................B1.565, B2.646A Unitive Electronics...................A1.325 Universal Photonics...................A1.631 Upsys...................A1.228 US...................B1.747C Ushio...................B2.727 UTI Ultra Testing International...................B2.102N V Vacom...................A1.740 Valex...................B2.684 Valtech...................B1.720C Varian...................B1.322 Vat Vakuumventile...................B2.243 VDMA Productronics...................B2.722 Veeco Instruments...................B1.524 Vegatec...................B2.740 Veriflo...................B2.645 Verity Instruments...................B2.706 Verteq...................B1.324 Viking Semiconductor Equipment...................A1.344M Virginia Semiconductor...................B1.407 VLSI Standards...................B1.611, B2.102O Voltaix...................B2.105 Voss Electronic...................B1.763 W Wacker Siltronic...................A1.422 Wafer Service International...................A1.738 Waferfab Equipment....................A1.448 M. Watanabe...................B1.763D Watkins-Johnson...................B1.522 Watlow Electric...................B2.532 Wavecrest...................A2.117 Weld-Equip...................A1.204C Weld-Equiples...................A1.204A Wentworth Laboratories...................A2.212, A2.515 West • Bond International...................A1.204 Wetea...................B1.370 White Knight...................A1.644G, A1.750G Williams Advanced Materials...................B2.111B Peter Wolters...................A1.684 Woollam...................B1.133B World Courier Logistics...................B2.145 X, Y, Z Xandex...................A2.515A Yamada...................A1.210AK, A1.222AK, A1.310AK Yamaichi Electronics...................A2.610 Yield Engineering Systems...................B2.102P YieldUp...................B2.344K Carl Zeiss Jena...................B1.121, B1.122 Zellweger Analytics...................B2.356 Zevatech...................B1.202A, B1.302A Zind Verfahrenstechnik...................B2.611A Zygo...................B1.133A, B1.145

(Show information correct at press time.)

EXHIBIT HALL HOURS

Tuesday, April 13
10 a.m.— 5 p.m.

Wednesday, April 14
10 a.m.— 5 p.m.

Thursday, April 15
10 a.m.— 4 p.m.

Munich Walkabout The Bavarian metropole is a walker's paradise, with voluminous opportunities for sightseeing, shopping, noshing, and sloshing. No visit would be complete without a jaunt to the Marienplatz, the square that's been the heart of Munich since the 12th century. Jumping with street entertainment, the area is best known for the glockenspiel with its human-size figures and carillon bells that come to life at 11 o'clock every morning in the New Town Hall. The Fussgangerzone, an Old Town pedestrian area connecting Marienplatz with the Karlsplatz, features one of the most intense retail areas in town, with old churches like the St. Peterskirche and Frauenkirche standing as symbols of more spiritual pursuits nearby. The largest city park in Germany, the Englischer Garten (English Garden) stretches for several miles along the Isar River. Locals and visitors from all walks of life congregate in its luxuriant grasp, while those with a hankering for Bavarian beer can slake their thirst in the Chinesischer Turm (Chinese Tower) or Seehaus (Lake House), two of the park's (in)famous beer gardens. Photos courtesy German National Tourist Office of New York.

CONFERENCE PROGRAMS The following is a partial listing of business and technical programs at Semicon Europa 99. All events take place at the International Congress Center Munich (ICM) in the Trade Fair Center. MONDAY, APRIL 12 Manufacturing Test Conference — Efficiency in Semiconductor Manufacturing Test 8:30 a.m.— 5:30 p.m. Opening Remarks Stanley Myers, president, SEMI Opening Session Keynote Speaker Semiconductor Business Environment and Developments Tsyoshi Kawanishi, senior adviser, former Toshiba president Morning Plenary Session Reality of the SIA Technology Roadmap—Challenges and Opportunities of ULSI and System on Chip Technologies Cochairs: U. Schoettmer, Hewlett Packard, and Roberto Toscani, ST Microelectronics Afternoon Session Cost-Efficiency Challenges in the Management of the Manufacturing Test Floor—Panel/Audience Interaction to Exchange Manufacturing Experiences and to Identify Industrial Needs Cochairs: Rene Segers, Philips Semiconductor, and Joachim Sahn, Siemens Overall Equipment Effectiveness (OEE)—Improving Equipment Productivity 9 a.m.—5 p.m. Instructors: John Fowler, Arizona State University, and Doron Meyersdorf, Tefen Simplification of Semiconductor Processing—A Key to Future Success (conference jointly organized by GMM, VDMA, and SEMI) 1:30—5:30 p.m. (also Tuesday, April 13, 8:30 a.m. — 12:30 p.m.) Chairs: Heiner Ryssel and Lothar Pfitzner, Fraunhofer-IIS-B, and Jens Uwe Fuhrmann, VDMA TUESDAY, APRIL 13 International Conference on MST/MEMS and the 6th European Strategic Roundtable on Microsystems (cosponsored with CEA-LETI, FHG, NEXUS, VDI/VDE-IT, VDI/GMM, VDMA) 8:30 a.m.- 5:45 p.m. Chairs: Steven Walsh, University of New Mexico/SEMI, and Bernd Hillerich, Fraunhofer IFT Opening Remarks Stan Myers, SEMI Plenary Session International Roadmap Job Elders, Twenty MicroProducts, chair/Intel roadmap project MEMS Developments in the Pacific Rim Sato Hisayoshi, Micromachine Center Steven Walsh, UNM Session I: Current MST Infrastructure Experience with an Industrial MEMS Foundry Service Mathias Illinga, Robert Bosch Creating Microsystems Infrastructure Henne Van Herren, Philips Modular Solutions to Packaging MEMS Devices Volker Grosser, Fraunhofer-IZM Session II: MST/MEMS Solutions Production of Customized MST Devices Felix Rudolph, CSEM Automotive Solutions Speaker TBD, Daimler Chrysler Oil Exploration and MST: An Example of Commercialization Claude Roulet, Schlumberger Afternoon Session Chairs: Henning Wicht, CEA-LETI, and Ron Lawes, RAL Opening Remarks SEMI/LETI Fifth Framework Program Horst Forster, European Commission DG lll Industry Eurimus Gaetan Menozzi, Sextant Avionigue Session III: Microsystems for RF and Hyperfrequency Systems: Which Microsystem for Your Mobile Phone? Speaker TBD, Alcatel; Stefan Carlberg, Ericsson and Luc Lapierre, Cnes Session IV: Electronic Cards and Integration of MEMS: What is Needed for the Next Generation? Speaker TBD/Insite Speaker TBD/Siemens Panel Discussion Cocktail Reception Advanced Optical Lithography Conference 1—4:30 p.m. Chair: Alberto Caligiore, ST Microelectronics Semiconductor Equipment Assessment (SEA): Bridging the Innovation—Productivity Gap to the Next Millennium 1:30—5 p.m. Chair: Georg Kelm, European Commission DG XIII Opening Address Georg Kelm European Commission DG Xlll Bridging the Innovation— Productivity Gap to the Next Millennium Jeff Bruchez, SITEC/SEA Vertical Furnace with Fast Ramp Capability and Advanced Automation for 0.25-µm Technology on 300-mm Wafers Michael Stadtmuller, Semiconductor300 Step-and-Scan Lithography for 0.25-µm Mix-and-Match Production Jacques Trilhe, ST Microelectronics Addressing Mask Cleaning and Inspection Issues for Advanced Photomask Manufacture Andrew Hourd, Compugraphics International Single-Step DUV Laser—Based Stripping of Photoresist with Wafer Cleaning for Key 0.18-µm Processes Peter Ramm, Fraunhofer IFT Failure Analysis Utilising HDP Etching for the Deprocessing of Packaged Multilayer Die Luc Decroix, Alcatel Microelectronics Reduction of Process Waste Gas Abatement Expenditures by using an Integrated Approach Helmut Endl, Texas Instruments Single-Area Excimer Laser—Based Crystallisation of Amorphous Silicon for the Production of Next-Generation AMLCDS Thomas Harrer, University of Stuttgart Silane Safety Seminar (cosponsored with SSA [Europe] and NMI) 1:30—5:30 p.m. Chair: Peter Middleton, Fujitsu Microelectronics UK WEDNESDAY, APRIL 14 Chemical Mechanical Polishing Conference 8:30 a.m.—noon Chair: Wolfgang Windbracke, Fraunhofer ISIT CMP Developments in Japan Speaker TBD, Japan Advances in Damascene Using Orbital Polishing Karey Holland, IPEC Investigation of Mechanism Cu CMP Process and a New Method for the Endpoint Detection Dieter Zeidler, Technical University Dresden Challenges in Copper CMP Deepak Mahulikar, Olin Microelectronics Materials Process Control in CMP Application of Motor Current Sensing, Pad Surface Temperature Measurement, and ISRM Getz Springer, SIMEC Dresden Post-CMP Cleaning Martin Knotter, Philips Research Plasma Damage Conference 8:30 a.m.—noon Chair: Bart Manders, Philips Semiconductors Electron Shading Damage Mr. Nakamura, Fujitsu Transient Fuse Schemes for Plasma Etch Damage Detection Mr. Krishnan, Texas Instruments An Integral Approach to Predict Product Yield Loss Due to Plasma-Induced Damage Mr. Luchies, Philips Semiconductors Plasma-Induced Damage and Charging Sensor Measurements for Etching and Deposition in Flash Memory Devices Mr. Alba, ST Microelectronics Equipment Automation and Integration Conference—First European Symposium on Semiconductor Manufacturing (ESSM) (cosponsored by Fraunhofer-IPA) 8:30 a.m.—5:30 p.m. Chairs: Thomas Kaufman, Fraunhofer-IPA, and Jack Ghiselli, GW Associates Particle Contamination and Monitoring Conference 1—4:30 p.m. Chair: Heiner Ryssel, Fraunhofer Institute—IIS Advanced Interconnects Conference 1—4:30 p.m. Chair: Luc Van den Hove, IMEC THURSDAY, APRIL 15 STEP: SEMI S2, Safety Guidelines for Semiconductor Manufacturing Equipment 8:30 a.m.—12:30 p.m. Chair: Richard Kaplan, Applied Materials, and Peter Middleton, Fujitsu Microelectronics UK STEP: Advanced Factory Communication (CIM Systems) 1:30—5:30 p.m. Chairs: David J. Partington, Partington Associates, and Thomas Kaufmann, Fraunhofer IPA SPECIAL EVENTS Friday, April 16 Fab Management Forum: Business Forum on Semi Industry Market Drivers and Manufacturing Models 9:30 a.m.—6:30 p.m. Dresden, Germany Dorint Hotel Dresden Chair: Peter Kücher, Semiconductor 300, and Joel Monnier, ST Microelectronics Products and Markets Semiconductor Market Drivers and Profitability Malcolm Penn, Future Horizons Technological Challenges for Future Mobile Terminals Kari-Pekka Estola, Nokia Mobile Communications Challenges for High-Volume Manufacturing of Advanced Microprocessors Jack Saltich and Hans Deppe, AMD IC Manufacturing Lines: New Concepts for Manufacturing Vision for Future Manufacturing Lines Speaker TBD, Japan Low-cost Factory for DRAM Production Ron Huber, Siemens Highly Efficient Future Wafer Fabs Jurgen Giessman, M+W Zander Productivity Achievements and Future Trends for Foundry Manufacturing John Docherty, Chartered Semiconductor Title TBD Jack Sun, TSMC (Invited) Equipment and Materials Fast Yield Ramps Cary W. Halsted, KLA-Tencor Enhanced Fab Productivity Through Seamless Integration of Software and Equipment Sass Somekh, Applied Materials Breakthrough in Thinking for Overall Equipment Efficiency Rick Hill, Novellus A Potential to Save Moore's Law Brad Mattson, Mattson Benchmarking to Other Industries As Good As It Gets: Optimal Fab Design and Deployment Jim Duley, HP Title TBD Speaker TBD, Volkswagen Panel discussion on cost-efficient manufacturing in 2000, with participants from major IC manufacturers, suppliers, and consortia.

Munich's Museums Whether you want to immerse yourself in artistic visions, get hands on with science and technology, or learn more about Bavarian culture, a visit to one of Munich's many world-class museums is a must. Famous for collections of 19th-century French paintings as well as those of Flemish and old German masters, the new and old wings of the Pinakothek (German for "picture gallery") are filled with sculptures and paintings of the first order. If you prefer expressionist or abstract, the Stadtische Galerie im Lenbachhaus has an impressive set of works by Klee, Kandinsky, and the like. For those with more technological tastes, the huge Deutsches Museum (www.deutsches-museum.de) features everything from acoustics to Zeppelins, including a nearly 300-meter-long model railroad, items from lithography inventor Alois Senefelder's workshop, and the first U-boat. For those curious about things Bavarian, the Bayerisches Nationalmuseum has dozens of exhibits on the arts, costumes, and handicrafts of the area, while the Hunting and Fishing Museum might tickle your taxidermic fancy. Photos courtesy German National Tourist Office of New York.

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