Defect-Review SEM

Applied Materials

Santa Clara, CA

The SEMVision cX scanning electron microscope automatically reviews and classifies wafer defects in advanced semiconductor production lines. The system can examine up to 500 defects per hour and offers color multiple-perspective SEM imaging for enhanced topography and material information about defects on patterned wafers. Using OperatorFree EDX analysis, the microscope features automatic material identification to characterize defects on unpatterned wafers such as monitor wafers and those with blanket films or planarized surfaces. The SEM classifies defects by type, material properties, and other operator-specified characteristics. Its ability to quickly provide information on patterned and unpatterned wafers helps users to control process excursions and correct defect sources in a- timely fashion. The system also creates a database of information for future reference. Many features can be retrofitted to earlier SEMVision systems as well.

CMP Pressure Analyzer

Tekscan

South Boston, MA

The I-Scan electronically measures pressure distribution on a silicon wafer during CMP polishing. The system depends on a <0.08-mm-thick, flexible, grid-based sensor composed of conductive and semiconductive inks. A material whose electrical resistance varies with applied force separates conductive rows and columns in the sensor grid, making each intersection on the sensor a force sensor. The computerized system scans and measures the change in resistance at each sensing cell in order to determine the timing, force, and location of contacts on its surface. Windows-based software lets the user view gathered data statically or dynamically in 2- or 3-D graphical displays. Tests can be recorded, stored, played back, and graphically analyzed to provide a pressure profile across the complete sensing surface. The system can be used in conjunction with single- or multispindle heads. Applications include balancing pressure distribution during CMP machine setup, aligning polishing heads, detecting and measuring polishing-pad wear, and performing QC on rebuilt carriers.

Wafer Inspection System

CyberOptics

Minneapolis, MN

The noncontact, laser-based WaferGage inspection system captures submicron measurement data from wafers ¾100 mm thick and ¾150 mm wide. Measurements are repeatable despite wafer bow or warp up to 2.5 mm. With a laser beam diameter of 16 µm, the manually operated off-line tool offers 0.2-µm resolution and 2-µm accuracy and distinguishes the smallest etchings and surface features. It employs two patented laser triangulation sensors to measure precisely changes in thickness ¾950 µm. Proprietary software facilitates data collection at a mouse click. The x-y stage can be adjusted smoothly by the operator for the collection of readings from different wafer locations. The operator can save measurement data to an exportable table via foot pedal or mouse.

Cryogenic Valve

Acme Cryogenics

Allentown, PA

A stainless-steel extended-stem cryogenic gas valve comes in vacuum-jacketed and nonjacketed versions. Sizes range from 1/2 to 2 in. The standard configuration for service with liquid oxygen, nitrogen, argon, or liquefied natural gas is a nonbellows design. The valve can be configured with a bellows seal for use with liquid hydrogen and helium. The valve's design reduces heat leak into the valve and maximizes service life. Other features include O-ring seals, external stem threads, and metal-to-metal secondary seat seals. By means of an actuator kit, a standard manual valve can be adapted for actuated capability. The valve is offered with linear, equal-percentage, or quick-opening plugs.

Pressure Switch

United Electric Controls

Watertown, MA

For use in fab equipment and gas delivery systems, the ultra-high-purity solid-state Staset pressure switch offers the features of a switch, the output of a transducer, and the convenience of a gauge in a single space-efficient package. Switch output can be set to trip from 8 torr to 100 psig and is fail-safe upon loss of power. Measurement ranges from 760 torr to 100 psig are available. The device is offered with a 0—5-V dc analog process signal in addition to the switch output. Male end-seal and flush-mount process connections are available, both fabricated from vacuum-arc remelt 316L SCQ stainless steel. Wetted surfaces are electropolished to 5 Ra. A local status LED display indicates switch output, while an LCD enables process variables to be monitored continuously. The displays facilitate installation, calibration, and troubleshooting.

FPD-Handling Robots

Adept Technology

San Jose, CA

The AdeptAtlas 720 series of robots for liquid crystal and flat-panel display manufacturing consists of single- and dual-arm models. The low-vibration robots handle large-scale substrates ¾600 * 720 mm. The three-axis 720S single-arm and four-axis 720D dual-arm models provide total flexibility of movement within the work envelope. Certified for use in Class 10 cleanrooms, the robots come with forced exhaust. They employ maintenance-free, high-reliability ac servomotors and operate via dedicated command sequences. The SECS/GEM-compatible robots also feature sensors that ensure proper positioning of the substrate on the end effectors. Motion profiling facilitates smooth substrate transfer.

Defect Detection System

Leica Microsystems

Deerfield, IL

The LDS 3000 automatic wafer defect detection and classification system scans 4- to 8-in. wafers and detects defects on the fly. It classifies random and systematic defects as killer or nonkiller and bins them into defect types automatically. The cassette-to-cassette system permits 100% wafer inspection without operator involvement. Resulting defect maps can be sent to an external defect-management system for additional analysis and archiving. The flexible tool is adaptable to the particular requirements of various front- and back-end-of-line processes. A single tool can provide both defect location and classification when the Viscon ADC is mounted on the system.

Controlled-Pressure Gloveboxes

T-M Vacuum Products

Cinnaminson, NJ

Controlled-atmosphere gloveboxes and glovebox systems made of 16-gauge stainless steel are available for standard and specialized applications. Units are designed to operate at slight positive or negative pressure, depending on whether in-leakage or operator hazard is the concern. Glovebox end plates may be bolted to welded studs, attached via ring clamps, or made part of a completely welded unit. Other custom design options include rounded, radiused corners; various viewing-window styles and angles; and glove ports mounted in sheet metal or in the window. Standard or specialized gloveboxes with vacuum ovens, purge or vacuum interchanges, recirculating gas purifiers, moisture and oxygen monitors, and other accessories can be made into a custom system. Walls heavier than 16 gauge are available.

Oxygen Transmitter

Alpha Omega Instruments

Cumberland, RI

The Series 3500-Z oxygen transmitter uses high-speed zirconia sensor technology to precisely measure oxygen concentrations in a wide variety of background gases. It operates as a standalone system or in conjunction with a programmable logic controller, data logger, recorder, or digital signal controller. The transmitter features analog output of 4—20 mA dc. It has the ability to sense changes in gas composition in less than 10 seconds at 90% of full scale. Equipped with a 31/2-digit LCD, the low-maintenance device is resistant to acid gases. The nondepleting current-limiting zirconia sensor does not need routine electrolyte replacement. The transmitter is available in single ranges that include six different percent concentrations and trace concentrations of 0—1000 or 0—500 ppm.

Contact-Angle Meter

Tantec

Schaumburg, IL

The Cam-Wafer contact-angle meter can determine surface cleanliness, the presence of photoresist, and the etching rates of various surfaces. Several product features are designed to simplify the measurement of large-area critical surfaces. A projection screen in front of the operator provides a large droplet image that facilitates repeatable measurements, which can be discussed by a group. The half-angle measuring method, based on the formula for determining contact angle from the droplet dimensions, eliminates ambiguities that could arise from arbitrary tangential alignment of a hairline to the droplet image. A dual-axis stage control with digital readout allows for CD, hard-disk, or wafer mapping of the same points in accordance with a sampling plan. Stage diameter is adjustable between 4 and 8 in. The syringe-filling function and droplet application procedures are designed for ease and consistency.

Wafer-Identification Reader

Siemens

Santa Clara, CA

The LKx5 wafer-identification reader is a compact, stand-alone automated scanning system that accurately and reliably tracks silicon wafers through the production process. The LKx5 can read all commercial marking technologies, including OCR, 2-D code, and bar code 412. The wafer-identification reader's anodized aluminum cameras are 35 * 70 * 110 mm in size. According to the manufacturer, they are the smallest in the industry and have an integrated light source that automatically adjusts intensity to correct for the surface degradation of the wafer.

Defect Inspection System

August Technology

Edina, MN

The NSX-100 automated high-volume 100% defect inspection system for wafers and dies offers an inspection time of 60 seconds for a typical 8-in. wafer. The system detects defects >=0.5 µm. System speed is made possible by a combination of high-resolution image capture technology and enhanced illumination techniques and optics. The system is Windows NT based and can handle 300-mm wafers, wafers on film-frame, dies in Gel/Waffle packs, JEDEC trays, auer boats, and MCMs. Automated data collection and reporting, wafer mapping, and identification are standard features. Options include bump inspection, automated handling, inking, an OCR/bar code reader, and SECS-II networking.

Sputter Shields

Semiconductor Equipment Technology

Dublin, CA

When compared with OEM PVD shields, high-performance PVD sputter shields can reduce particle counts by up to 50% and increase the time between shield changes. The company's turnkey shield management program guarantees that every shield performs effectively.

In-Line Coater

Darly Custom Technology

Bloomfield, CT

The Swift-Kote in-line coater metallizes 3-D plastic substrates in a single 60-second cycle. It can also be used to deposit two different materials sequentially by evaporation. In conjunction with an optional sputtering source, the coater can perform metallization and top-coating in the same cycle. Because the coater has a vertical chamber, substrates are rotated on a vertical axis so that a uniform coating is produced. Fixtures can be changed in seconds to accommodate various product configurations. The coater's high-throughput, double-door design permits simultaneous batch loading and metallization. It also facilitates access to filaments, enabling the rapid replenishment of evaporation material.

Tungsten CMP Slurry

Cabot Microelectronics Materials

Aurora, IL

Semi-Sperse W2585 tungsten CMP slurry polishes all layers in a damascene architecture, including plugs and interconnects. Designed to minimize oxide erosion and microscratching, the slurry optimizes tungsten polishing of advanced devices with design rules ¾0.18 µm. Reduced oxide erosion enables greater planarization of the wafer than with other slurries. In addition, the slurry minimizes via keyholing and damascene trench seam enlargement. Principal applications include the development of high-end microprocessors and memory devices. The slurry can also be used with traditional tungsten plug polishing.

Integrated Wafer Prealigner

Berkeley Process Control

Richmond, CA

Handling 200- or 300-mm wafers, the integrated BXi/pa prealigner locates the center of the wafer and orients it for the next process step in as little as 750 milliseconds. Wafer notches can be oriented precisely at a repeatability of ±0.035°. System control hardware and software are embedded in the controller, creating a seamless interface between the aligner and the process tool. This plug-and-play compatibility simplifies integration of the prealigner into the tool. Autocalibration technology permits the component to be installed, configured, and placed in operation within minutes. Throughput advantages derive from the fact that there is no external data transfer between the prealigner controller and the higher-level controller.

Liquid-Level Transmitter

Polysonics

Houston, TX

The MSP420 ultrasonic liquid-level transmitter has a 26-ft operating range. It provides simple linear level measurement where an analog signal is needed. Housed in a NEMA 4X enclosure rated to IP 67 and with a CPVC liquid- contacting surface, the transmitter is mounted above the liquid level, either directly to the vessel or on a bracket, by means of a 2-in. thread. The device generates ultrasonic pulses that are reflected from the surface of the liquid. Microprocessor-controlled electronics calculate the level from the measurement of the interval between signal transmission and reception. The transmitter features automatic temperature compensation and economical NPT mounting. Its microprocessor provides a two-wire 4—20-mA output proportional to the level. A four-digit LCD under the cover gives a visual readout.

Product Extra!

Applied Materials has initiated the semiconductor industry's first comprehensive customer support program. Known as Total Service Solutions and consisting of a total support package (TSP) and a total parts management (TPM) plan, the program guarantees customers lower operating costs, improved system productivity, and reduced parts inventory management costs for Applied equipment. Using TSP, customers can outsource system maintenance to the equipment company's service teams, eliminating the need to carry service-related parts inventories. With TPM, customers stock spare parts in-house that are completely owned and managed by Applied. This significantly reduces customer inventories and the administrative costs of spare parts. The full program will eventually be available for all Applied systems and already has been implemented by 10 customers in 17 sites in Asia, Europe, and the United States. Information: 408/563-0647.

Responding to industrywide moves toward reduced inventories, the silicon wafer reclamation division of Kobe Precision has established a real-time customer-reporting Web site. This password-protected system can provide customers with on-line quality, inventory, and shipment information about their wafers in the reclamation process. Using this system, fab managers and process engineers, as well as inventory control, purchasing, and warehouse personnel can access all reports at any time. Because the reports are updated within minutes of a transaction, customers can be kept up-to-date about the status of their orders, inventories, and shipments. Information: 510/487-3200.

Lam Research's ceramic-free high-density plasma (HDP) polyetch chamber designed for use with the company's TCP 9400PTX 0.18-µm gate and shallow trench isolation etch system increases productivity and reduces contamination to enhance sub-0.25-µm process yields. Ceramic-free processing reduces metallic contamination, whose main source is ceramic in chambers where ceramic components are exposed to plasma, as in high-density silicon etch reactors. This processing method also minimizes particle generation and polymer formation on the wafer surface, thus simplifying stripping. In addition, the chamber prevents undesirable chemical reactions, thereby eliminating the negative effects of ceramic on wafer stripping capability. The waferless autoclean feature helps improve productivity and reduce particle levels with an in situ plasma clean technique that does not require a dummy wafer to protect the electrode. The chamber can be retrofitted to existing etchers. Information: 510/572-4538.

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