CMP and Etch Metrology Tools

Rudolph Technologies

Flanders, NJ

Matrix S200 metrology systems for CMP and etch provide application-specific sets of metrology techniques. The S200 CMP system has a 5 ´ 10-mm-spot, 633-nm HeNe laser ellipsometer for measuring on-product substrate n and k and a 2.5-mm-spot, 470—905-nm reflectometer for measuring film thickness at a throughput of 120 wafers per hour. Using the visible reflectometer, users can measure thicker films and all forms of polysilicon. The S200 etch system has the same features as the CMP system plus a 780-nm ellipsometer and software optimized for etch-to-clear applications. It can detect ultrathin trace residues and overetch sensitively and accurately. (Semicon Southwest, Booth 726)

High-Flow Regulators

Swagelok

Solon, OH

Half the size of conventional diaphragm pressure regulators, HF-series regulators are suitable for use in space-restricted valve manifold boxes, gas interface boxes, and tools. They feature a pressure-sensing assembly that ensures the precise, consistent control of gas delivery pressure. Their multiple-welded-diaphragm design permits high system flow rates at low pressures. Set-pressure models provide output delivery pressures of 10, 20, 30, 50, and 80 psig. Dome-loaded models can be adjusted remotely while in service or factory-charged to deliver outlet pressures of 10, 20, 30, or 50 psig. (Semicon Southwest, Booth 1510)

Digital Camera

Optronics

Goleta, CA

The LE-D, a _-in. charge-coupled device color digital camera, is suitable for critical microscopic applications such as industrial wafer inspection. Available in NTSC and PAL formats, it permits users to completely control image contrast, brightness, color, edge enhancement, and parallel-port digital-image computer transfer. An optional 6.4-in. LCD color display, which is offered for the convenient viewing of the subject, is mounted on the camera's remote head for simple attachment. (Semicon Southwest, Booth 1647)

Submicron Wet Scrubber

Tri-Mer

Owosso, MI

The Cloud Chamber Scrubber collects submicron particles and corrosive fumes simultaneously. It requires only 500 W to charge particles and water droplets with opposite polarities. When a continuously moving particle approaches within 10 µm of a circulating droplet, electrical attraction draws the particle into the droplet. The system requires less than 1 in. of pressure drop under full-load operation, minimizing operating costs. Able to scrub both soluble and insoluble particles, the system can also remove fumes and gases, including HCl, HF, HNO3, H2SO4 , and Cl2. It removes 99% of all particulates between 0.1 and 3 µm.

E-Beam Inspection Tool

KLA-Tencor

San Jose, CA

The eS20 is the semiconductor industry's first in-line scanning e-beam inspection tool for sub-0.18-µm and copper devices, according to its manufacturer. Optimized for use in full-volume production, the eS20 is up to 75 times faster than previous e-beam inspection tools. It is sensitive to defects <0.10 µm in size and ensures a strong defect-to-yield correlation. Used primarily for post-CMP and postetch monitoring, the eS20 is not limited by resolution, color, grain, or pattern noise, which can degrade inspection tools' detection capabilities. The eS20 is also a 200/300-mm bridge tool, guaranteeing added flexibility and greatly increasing the tool's extendability. In addition to being able to inspect memory devices, the eS20 can perform the die-to-die comparison necessary for inspecting logic devices.

ESD-Safe Swabs

Texwipe

Upper Saddle River, NJ

Three swabs from the Transplex series can be used for the critical cleaning of ESD-sensitive parts in magnetoresistive and giant magnetoresistive disk-drive manufacturing. They feature handles made of a clean, chemical-resistant polypropylene, which has low surface and volume resistivity as well as low levels of outgassing and NVR emissions. The heads of the TX755E Mini Thin Alpha and TX770E Micro Tip Alpha ESD swabs are made from a single layer of cleanroom-laundered, 100% continuous-filament polyester with a thin supportive core. The TX767E Mini Point CleanFoam ESD swab has a compact pointed tip made of low-NVR, 100-ppi open-cell foam with a supportive core. (Semicon Southwest, Booth 635)

Deep-UV Microscope

Carl Zeiss

Jena, Germany

The Axiotron DUV microscope permits resolution of chip structures down to 0.08 µm. Fitted with quartz optics, the microscope uses 365-nm i-line and 248-nm deep-UV wavelengths. Special high-resolution dry objectives have been optimized specifically for deep-UV and i-line wavelengths and feature a numerical aperture of 0.95. Employing extreme stray-light reduction and UV-light illumination for higher resolution provides very high-contrast images of the minutest structures. A simple version of the modular instrument can be used with visible light and 365 nm only. It can be retrofitted with a confocal laser scanner module for 364 nm. For obtaining fast overviews of objects, the microscope can be configured with a standard binocular tube and used with visible light. The Axiotron DUV is designed for wafers up to 200 mm in size, while the Axiotron 300 accommodates 300-mm wafers.

CD Metrology Tool

Surface/Interface

Sunnyvale, CA

The Stylus NanoProfilometer Series 3000 is a nanoscale metrology instrument that provides nondestructive 2- and 3-D measurements of critical dimensions on deep submicron features. The tool addresses fab requirements for CD-SEM calibration, stepper optimization, and future-generation IC development and will accommodate dimensions 0.10 µm. It combines elements of traditional scanning probe microscopy and stylus profilometry with new sensing technology to obtain true feature profiles. The effect of stylus shape is accounted for in the measurement. The tip shape remains constant throughout the measurement process. The system's nondestructive cross-sectioning feature enables linewidths, depths, sidewall slopes, and corner geometries to be measured anywhere from the top to the bottom of lines, trenches, and vias. No physical cross-sectioning is needed. Nonconductive samples such as photomasks are handled without problematic charging effects. The core of the measurement system is a 10 x 5-mm probe assembly consisting of a silicon balance beam with an integral probe tip.

Cleaning Chemistries

EKC Technology

Hayward, CA

A family of specialized cleaning solutions is designed to remove etch residues from low-k dielectric, copper, and tungsten semiconductor structures without causing damage. By cleaning geometries down to 0.13 µm, the solutions can extend the life of manufacturing equipment. The EKC4000 PCT series of aqueous solutions eliminates the risk of fire associated with such rinses as IPA and NMP. The solutions also contain no SARA Title III ingredients. They operate at room temperature with a low evaporation rate. Copper-compatible EKC500-series cleaning agents were developed for use with damascene and dual-damascene structures. EKC600 semiaqueous solutions for use with tungsten can clean residues at or below 0.25 µm and offer extremely short cycle times. (Semicon Southwest, Booth 617)

Cold Plates

Lytron

Woburn, MA

Lytron has developed a new cold-plate technology that offers a 300% improvement in thermal conductance over traditional designs. The design uses 1/4-in. tubing instead of traditional 3/8-in. tubing to decrease thermal resistance and improve cold-plate performance. The plate removes heat from the high-power electronics used in the semiconductor industry, increasing throughput by cooling wafers more quickly than the traditional design. The company offers several different cold-plate technologies, including vacuum brazed, embedded tube, and extruded microchannel designs. For OEM applications, the firm's engineers will review customers' applications and select a cold-plate technology to meet their requirements.

Low-Ionic Paper

Lyons Falls Pulp & Paper

Lyons Falls, NY

Lytech 100 low-ionic paper makes a low-dusting, low-abrasive, and low-corrosive substrate for use in applications where metal or another material can benefit from a paper barrier displaying such characteristics. The total ionic contamination of the paper has been measured at <2000 ng/cm². The paper is free of many additives commonly involved in paper manufacture and comes in rolls and in sheet sizes.

Sputtering Targets

Johnson Matthey

Spokane, WA

New high-purity copper sputtering targets for physical vapor deposition have been introduced by a company that produces its own high-purity copper, enabling it to maintain direct control over all steps in target fabrication. The microstructure of the material has a fine uniform grain size of <50 µm, resulting in highly consistent sputtering performance throughout each target's life and from target to target. The copper targets are diffusion bonded to an aluminum backing plate to create a finished product that can be used in high-power applications. According to the manufacturer, the sputtering targets are compatible with Applied Materials's sputtering equipment, including the Vectra IMP.

Cup Sinks

Scientific Plastics

Waukesha, WI

Designed for mounting onto countertops or in fume hoods, space-saving cup sinks facilitate the disposal of waste liquids in R&D and laboratory environments. The sinks are seamlessly molded from polyolefin resins. They are resistant to acids, solvents, and other lab chemicals and come in a broad range of styles, sizes, and colors. For ease of installation, 11/2-in. male-thread drain outlets are molded into all units. Mounting brackets are available with most styles.

Precision Dispensers

Fluid Metering

Syosset, NY

Designed for on-line analyzers, Models STH, STQ, and RH dispensers integrate valveless piston technology with precision stepper motor control. The OEM dispensers offer metering and dispensing accuracy of better than 1%. Their only moving part is a ceramic piston that rotates and reciprocates within a precision ceramic liner. The inert fluid path features ceramic and fluorocarbon surfaces. The three models accommodate a dispensing range of 0.002 to 1.28 ml per stroke. The dispensers can be controlled by the manufacturer's stepper motor driver or by other commercially available drivers.

Moisture Analyzer

Ametek Process Instruments

Newark, DE

The 3050 OLV moisture analyzer works with processes that require the continuous, reliable measurement of moisture in gases and vapor. It performs on-line verification using an internal moisture generator to measure sensor and system operation against a sample containing a known amount of moisture. An alarm signals if the verification process has failed. Quartz crystal detection technology enables the analyzer to read moisture levels in seconds and to dry down to 90% of the steady-state reading within 1 minute in the event of a sudden drop from 1000 to 10 ppm. (Semicon Southwest, Booths 1908D, 2013, 2013A, 2013B)

Programmable Transmitter

Accutech

Hudson, MA

The AI-1000 Revision 2 programmable transmitter for industrial thermocouple or RTD temperature measurements features automatic self-calibration to onboard reference standards for measurement reliability. The transmitter accepts nearly any thermocouple or RTD, millivolt or ohm input and provides linearized output over the entire usable range of the sensor selected. It can be configured for field or panel mounting and reconfigured as needs change. An optional plug-in display or PC configuration permits the user to program and read directly from any transmitter without a handheld terminal. Digital ambient temperature compensation to within ±0.5°C ensures ambient temperature stability.

UHP Chemical Filter

Pall

East Hills, NY

The all-fluoropolymer Ulti-Kleen filter is designed for use with UHP chemicals in the manufacture of semiconductor devices with linewidths ¾0.25 µm. Its PTFE/PFA cartridge produces extractables at levels <25 ppb total in a 1.5-L, 5% HCl extraction solution. The crescent-shaped Ultipleat filter design provides a very high surface area for a standard-diameter cartridge. The filter thus offers high flow rates and low differential pressure. Prewetting is included. The 100% integrity-tested filter is manufactured in a cleanroom. (Semicon Southwest, Booths 1908C, 2118)

ESD-Protective Containers

Orbis

Oconomowoc, WI

A line of plastic containers is designed to protect sensitive electronic components from ESD in cleanroom, storage, and distribution environments. Containers made of advanced static-dissipative, antistatic, and conductive materials are offered in more than 1000 styles and sizes. Styles include stack only, dividable, stackable/nestable, nest-only, folding, and hopper. The containers are available to suit most uses.

Wafer-Temperature Monitor

CI Systems

Westlake Village, CA

The NTM500 monitor is a noncontact, emissivity-independent system for RTP, PVD, CVD, and other processes. The compact single-probe pyrometer features real-time emissivity measurement at the point of temperature acquisition, enabling accurate compensation even when backside emissivity changes during a process. Background compensation is application dependent, involving both hardware emission blocking and software processing using wafer emissivity and heater temperature as inputs. The monitor is available with temperature ranges of 200°— 600°C for PVD, 250°—700°C for HDP CVD , and 400°—1250°C for RTP and RTCVD. The system offers analog and digital outputs for accommodation by any host interface configuration. (Semicon Southwest, Booth 2431)

Submicron Metrology Tool

Schlumberger ATE

San Jose, CA

The IVS 130 advanced submicron metrology tool maintains a high level of measurement precision, even on shallow-trench isolation (STI) and tungsten-plug CMP processes. The system uses Adaptive RG metrology software to minimize ramp-up time and maximize the accuracy and repeatability of measurements. An image-processing algorithm accommodates variations in the verification target and accepts or rejects targets. The tool's FSF focus system locates the focal plane independently of thin-film effects. A laser keeps the microscope in focus as the stage moves across a field of varied topographies. Advanced pattern recognition and robust wafer handling are executed without operator assistance. With light quarterly maintenance, the tool offers a mean time between failures of more than 1500 hours.

Nanotopology Analysis System

ADE Phase Shift

Tucson, AZ

The NanoMapper provides quantitative surface height mapping for ¾0.18-µm technology, bridging 200- and 300-mm wafer sizes. It provides whole wafer topology data, using noncontact optical measurement to precisely quantify nanometer-scale surface height variations. Tracking the phase of the optical signal using proprietary interferometric technology results in the subnanometer resolution of measurements. (Semicon Southwest, Booth 710)

Vacuum Pump

Busch Semiconductor Vacuum Group

San Jose, CA

The Cobra DS-80, a 46-cu ft/min dry-screw vacuum pump, occupies minimum space in the subfab, reducing the burdens of pump maintenance and repair. Its programmable logic controller can be mounted on top of the pump, or it can be placed on the subfab wall. The pump can be swapped out easily without having to be reprogrammed, because all programming is resident in the remote programmable logic controller (PLC). The pump also synchronizes automatically with the manufacturer's other PLCs, and its software integrates fully with the company's pump monitoring system, which has microprocessor control and an adjustable threshold for warnings and alarms. A permanent measurement display shows exhaust pressure, temperature, motor power, nitrogen, and water flow. (Semicon Southwest, Booth 805)

Plasma Source

Applied Science and Technology

Woburn, MA

The Model AX7610 microwave plasma source for downstream etch applications can be configured with a replaceable quartz discharge tube for nonfluorine chemistries or with a sapphire discharge tube for fluorine chemistries. The quartz-tube version is suitable for producing atomic oxygen for resist stripping and is compatible with O^₂, N^₂, H^₂O, argon, and other nonfluorine-based gases. The sapphire-tube model is compatible with NF^₃, CF^₄, C^₂F^₆, and other fluorine-based gases as well as those handled by the quartz tube. Process gas pressure during operation can be 0.5 to 6 torr, depending on process conditions. The plasma source can be used in stripping and passivation, chamber cleaning, surface modification, and reactive gas processing. (Semicon Southwest, Booth 1005)

Cleanroom Actuators

IAI America

Torrance, CA

ISD-CR Class 10 cleanroom actuators, available with an ESD option, feature electroless nickel plating, stainless-steel parts, stainless-steel fasteners, and a cable-management system that uses ESD-rated plastic. With an overall surface resistivity of less than 10⁹ (omega), the actuators come in small, medium, and large frame sizes and are available with stroke lengths of 100 to 1200 mm in increments of 100 mm. They can position ¾80-kg payloads horizontally and ¾19-kg payloads vertically at speeds of ¾1000 mm/sec and with a repeatability of ±0.02 mm. To maintain operation at a Class 10 level, a thin stainless-steel shield contains any particles generated within the actuator, which are purged from the system through a standard vacuum connector port.

In Situ PVD Monitor

MKS Instruments

Andover, MA

The Orion system for in situ PVD monitoring has a closed-ion-source quadrupole mass spectrometer and an integrated turbomolecular pump. Orion Version 4.3 system software facilitates integration with the process tool and process via data binning, multievent gas-specific alarms, automatic recipe selection, and advanced SECS-II/GEM compatibility. It provides programmable operation for residual gas analysis and complex process monitoring. Three mass ranges are available: 1—100, 1—200, and 1—300 amu. The system can monitor process pressures up to 3 mtorr with parts-per-billion sensitivity and can be customized for monitoring at higher pressures. (Semicon Southwest, Booth 830)

Tubing Resin

Elf Atochem North America

Philadelphia, PA

Kynar SuperFlex resin is suitable for the manufacture of flexible tubing and fittings in semiconductor applications. This high-purity, high-clarity PVDF resin has a flexural modulus of 30 x 10³, one-third that of materials made with Teflon PFA or FEP. It has a melting point of 240°F, a specific gravity of 1.78, and high kink resistance. Strongly resistant to DI water and acids, the resin has no additives and provides a desirable surface finish. Used as a polymer processing aid with polyolefin films, it minimizes melt instabilities characteristic of high-shear extrusion. (Semicon Southwest, Booth 1705)

Quick-Disconnect Couplings

Colder Products

St. Paul, MN

Two lines of quick-disconnect couplings facilitate disconnection during fluid transfer. ChemQuik couplings, available in polypropylene, PVDF, TFM, and PFA, feature an entirely nonmetallic flow path and have integral flare-style tubing connections for PFA and other semirigid tubing. SST electropolished stainless-steel couplings, ranging in size from 1/8 to 5/8 in., offer integral double-ferrule compression and mating tube terminations. Both types feature an easy-to-manipulate thumb-latch design and are able to handle aggressive chemicals, solvents, CMP slurries, and ultrapure water. (Semicon Southwest, Booth 803)

Photoresist Detector

Leybold Inficon

East Syracuse, NY

The Preclude photoresist detector performs in situ wafer analysis to reduce PVD cluster tool downtime. The detector continuously monitors degas chambers and identifies wafers residing in tools that are contaminated with photoresist. Scanning each wafer as it is degassed, the detector sounds an alarm when even trace amounts of photoresist compound are left on the wafer as a result of an incomplete or missed strip. A signal from the high-sensitivity sensor can automatically shut down a cluster tool to prevent further damage and minimize yield problems. (Semicon Southwest, Booth 901)

300-mm Wafer Prealigner

GL Automation

Dallas, TX

An intelligent 300-mm wafer prealigner with integrated OCR capability performs alignment operations via serial commands sent between the prealigner and the controlling host PC. The optical image formation system is connected to OCR hardware in the host PC to acquire images, drive illumination, and decode the backside wafer scribe. ActiveX components used to set up and run the OCR process simplify the system's integration into the user's PC software. Within 6 seconds, 300-mm wafers are aligned by means of edge-contact centering jaws to an angle of ±0.3° with a position accuracy of ±0.002 in. The prealigner's centering mechanism meets Class 1 cleanliness standards and is process tool compatible. (Semicon Southwest, Booth 1547)

Product Extra!

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