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MicroMagazine.com

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July 2006
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EDITOR'S PAGE

INDUSTRY NEWS

  • Lead Story: Forecast Update: Chip industry’s midyear sales outlook shows a lot of flash
  • Lefty: Save your energy
  • Tech Update: Litho survey reveals splits
  • ISMI Symposium: Green fab, 300-mm Prime sessions highlight productivity conference
  • Chipworks Corner: IBM, AMD use different dual-stress liner techniques for channel strain
  • ’Round the Circuit: “Rapid learning” keys TI’s ramp; three up-and-coming companies score funding; Princeton wins USDC award; CMP consumables top $1 billion

THE HOT BUTTON

  • Tech Emergent: Hu takes up the battle cry of CMOS “rejuvenation”
  • Columnist Bijan Moslehi explores flat-panel displays

TECHNICAL ARTICLES
  • Transistorama: Determining the limits of strain techniques in scaled CMOS devices
  • APC/AEC: Meeting reliability requirements for 300-mm CMP manufacturing using integrated metrology
  • Fab Support Strategies: Adopting CMP processes to achieve new materials integration
  • Green Manufacturing: Conducting early assessments of semiconductor manufacturing tools

PRODUCT TECHNOLOGY NEWS

  • Products: Spray cleaning platform, SOI thin-film wafers, gas analysis, diamond deposition system, MEMS tester, harsh-chemistry metrology, IR and DUV inspection technology, reticle autoleveling system, helium-ion microscope, perfluoroelastomer compound, wet-chemistry analyzer, in-line process refractometer, ultrasmall-footprint metrology tool, aluminum nitride substrates, leak-free tube fitting
  • Product Extra: Supplier receives patent in Japan for use of silicon carbide barrier films; flat mirrors are available for beam-steering tasks in UV excimer laser–based applications; vendor offers full on-site x-ray inspection and real-time Web interface service; SEMI Interface A software released; catalog highlights standard vibration-isolation systems and applications


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