Extended editorial coverage of critical industry trends
With device geometries shrinking well into the nanoscale realm, the challenges faced in the transistor formation portion of wafer processing have increased enormously. This series focuses on such front-end-of-line processes and challenges as strain engineering (sSi, sSO1, etc.), gate stack engineering, nonplanar transistor structures, atomic layer deposition, nondamaging surface preparation and cleaning approaches, and advanced metrology and inspection strategies.
A regular series of device-level process analyses, written exclusively for MICRO by Chipworks' senior technology adviser, Dick James.
This exclusive series, done in conjunction with International Sematech
Manufacturing Initiative (ISMI), focuses on how chipmakers can reduce
costs in current and next-generation fabs. Contributed articles
will examine advances in such areas as factory and tool productivity,
metrology, and ESH that can help sustain manufacturing efficiency
Chipmaking veteran Bijan Moslehi offers his perspectives on the challenges
facing an industry in transformation in MICRO's Reality Check
From supercritical CO2
cleaning to immersion lithography, dozens of new processes, materials,
and control strategies are poised to enter current and next-generation
production. This series showcases contributed articles from those
working on the front lines of advanced development.
Compound semiconductors, MEMS, thin-film heads, and other nonmainstream
applications are among the fastest growing segments of the chipmaking
community. This series examines key manufacturing technologies in
those segments through MICRO's focused lens of defect reduction, process
and equipment control, and yield enhancement strategies.
Articles on the defect, process-control, and yield issues associated with
integrating materials such as silicon-on-insulator, high-k dielectrics,
and exotic elements into process recipes.
These articleswritten by the major photomask suppliers, their partners,
and their customersreport on the research and manufacturing work being
conducted in the mask and reticle community.
An assortment of the most intriguing papers from recent Advanced Semiconductor
Updates and analysis concerning the International Technology Roadmap for
Silicon wafer manufacture is a business of extremes. This series deals with
some of the technical challenges faced in the wafermaking side of the industry.
Technical articles from equipment and materials suppliers as well
as from the research and chipmaker communities. Topics include defect
analysis and metrology, chemical and slurry delivery and waste treatment,
process equipment defectivity, and surface cleaning.
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© 2007 Tom Cheyney
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