showcase strategies being used to achieve advanced process and equipment
control in semiconductor manufacturing.
Implementing EDA to improve equipment performance and fab productivity
An overview article focuses on the concrete steps that can be taken as Interface A comes into use, highlighting the performance and productivity benefits that the new technology will bring. (March 2006)
a condition-based process control model for STI trench
process control model eliminates manual recipe management in STI
applications and compensates for wet clean cycles, tool/chamber
matching, and process and reticle-set differences. (July
etch tools using real-time fault detection and classification
case studies detail the use of an FDC system based on a pattern-recognition
algorithm that is immune to drifts in sensor parameters caused by
normal chamber cycling.
scrap through process and equipment control based on interactive
correct a problem with bottom electrode temperature for an etch-tool
recipe, a fab installed a model-based control system, improving
tool and process performance and eliminating scrap. (October/November
and implementing an advanced CMP run-to-run controller
CMP run-to-run controller based on a microscale polish simulator
predicts the planariazation rate of high wafer features relative
to low features as a function of critical recipe variables.
maintenance input data to increase the prediction accuracy of APC
and beta tests at different fab sites demonstrate that by taking
maintenance data into account in an APC model, manufacturers can
better predict process shifts and drifts. (June
STI process control using large-spot-size Fourier-transform reflectometry
experiments demonstrate that an integrated film-measurement system
for use in STI process control applications can measure different
films simultaneously in dense patterns on product wafers. (April
overlay performance in lithography tools using run-to-run control
tests over several months demonstrated that an automated process
control strategy can improve overlay control in a lithography exposure
tool, reducing rework and production costs. (January/February
equipment productivity through on-product etch-process monitoring
performed during implementation of a real-time process control technique
revealed the technique's advantages over traditional equipment qualification.
an APC strategy for metal sputtering using residual gas analyzers
study used RGA technology coupled with tight sensor integration,
key-number compression, and multidimensional analysis to eliminate
the introduction of contaminants into sputtering tools.
Control) Linking plasma process parameters to tool parameters and
case study involving DRAM and logic gate-conductor etch relies on
data compression and analysis techniques to map process parameters
to tool parameters and electrical test results.
Control) Achieving process understanding and real-time fault detection
on a PVD tool
control system attached to a PVD tool can be used to customize recipes
during process development, perform process monitoring to detect
misprocessed wafers, and optimize PM cycles.
Control) Using global process control in semiconductor
fabs to achieve APC
the semiconductor industry experiences rapid technological changes,
new products and processes are continuously developed while technology
becomes ever more complicated and precise.
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