From supercritical CO2
cleaning to immersion lithography, dozens of new processes, materials,
and control strategies are poised to enter current and next-generation
production. This series showcases contributed articles from those
working on the front lines of advanced development.
show that a thermal-wave-based method can perform quantitative,
simultaneous characterization of USJ depth and abruptness with
one nondestructive measurement. (August/September
Young's modulus of low-k dielectrics using surface acoustic waves
A rapid, nondestructive technique can be used to characterize
the stiffness of thin films, map coated-wafer contours, and detect
the elastic anisotropy of porous dielectric materials. (June
the impact of backside defect inspection on process development
Fab data show how an inspection tool based on dark-field imaging
detects backside defects, which can cause frontside focus spots
and flatnessomonitoring-tool errors in steppers and scanners.
supercritical carbon dioxide processing in microelectronics applications
Experiments show that supercritical CO2
is an effective alternative to aqueous-based solvents for removing
residues in copper damascene and potash breakthrough processes.
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